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1. A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach
2. RJR Polymers Inc. Headquartered in Oakland, CA
Worldwide sales and engineering force
Manufacturer of injection molded plastic packages,
pre-applied adhesives and equipment
3. R-Pak Air Cavity Packages Plastic backed for low power package applications like sensors
CCD / CMOS for vision and optical sensor applications with glass covers
Thermally enhanced metal backed for microwave and power applications
5. RJR’s Injection Molded Packages Package Stackup
Thermal Base (Cu, WCu, CuMoCu, AlSiC, etc)
Sidewall with leads
Lids with epoxy (pre-applied)
RJR formulated epoxy as interstitial layers
Plastic alloy formulated to match the CTE of Copper or Copper alloys (WCu, CuMo, etc.)
Leads are coated with moisture resistant polymer, then injection molded
The 3 layers are bonded together using RJR IsoThermal Sealing (ITS) equipment
6. 1) Package Base
7. Thermally-Enhanced Package Exploded View
8. Moisture Resistance IPC/JEDEC J-STD-202B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
intended to classify “nonhermetic solid state SMDs” by moisture sensitivity to ensure that proper handling precautions are applied
Applies to plastic SMDs with cavity or without cavity
Basic issue is vapor pressure change of water during solder reflow cycle causing damage
Delamination, cracking, leaks, “popcorning”
Low moisture sensitivity comes from choice of materials, design of package and good processes
9. Hermeticity JEDEC standard JES D22-A109-A defines test procedures
Derivative of MIL-STD-883, Method 1013
Historic military definition of “hermetic” means sealed to a specified helium leak rate
Assumes cavity package
Excludes organic seals or materials
10. Nonhermetic and Near Hermetic Rationale that organics are “non-hermetic” based on diffusion rates of water through organic materials
Metal, ceramic and glass are considered hermetic
New organic materials challenge that definition
Near Hermetic is a common term without a clear definition
Moisture getters further confound the issue
11. Package Elements to Consider
13. RJR Plastic Alloy – HTP-1280 R-Pak? Plastic Body Compound
This custom thermoplastic compound is used in RJR R-Pak? plastic body package technology. The following properties are typical for the bulk material molded into standard test configurations defined by the applicable test method. These property values are intended for general engineering purposes and are not intended for establishing product specifications.
Physical:
Density: 1.67 gm/cc ASTM D792
Water Absorption 0.02% ASTM D570
Mechanical @ 23C:
Tensile Strength 21,000 PSI ASTM D638
Tensile Modulus 2.5 X 106 PSI ASTM D638
Elongation @ Break 1.2% ASTM D638
Flexural Strength 31,000 PSI ASTM D790
Flexural Modulus 2.4 X 106 PSI ASTM D790
IZOD Impact Strength Notched 1.6 ftlb/in ASTM D256
Thermal:
Melting Point 280?C (536?F) ASTM D3418
DTUL @ 1.8 Mpa (264 PSI) 270?C (518?F) ASTM D648
Electrical:
Volume Resistivity 1012 ohm-cm ASTM D257
Surface Resistivity 1017 ohm IEC 93
Dielectric Strength 766 V/mil ASTM D149
Dielectric Constant 3.8 @ 1 kHz ASTM D150
3.7 @ 100 kHz
3.7 @ 10 MHz
Dissipation Factor 0.007 @ 100 kHz ASTM D150
0.003 @ 10 MHz ASTM D150
Arc Resistance 165 Sec. ASTM D495
Comparative Tracking Index 175 volts ASTM D3638
Chemical Resistance:
Not affected by: Water, Acetone, MEK, Methyl celusolve, Hexanes, (Sulfuric Acid, Nitric Acid, and HCl) as used in electroplating baths.
14. Epoxy Sealing Materials Common properties
Minimal moisture transmission
Low ionics
Very low volatiles (outgassing)
Cure in minutes for efficient assembly
Lead primer formulation
Adherent to LCP and lead finish
Viscosity supports efficient lead coating process
Sealing epoxy
Uniform cover and sidewall coating
Easily B-staged
15. Process Design
Appropriate sidewall thickness
Molding process
Tool design and process control
Epoxy application
Complete 4 sided primer application
Consistent application to sidewall and cover
Package assembly process
Isothermal Packaging System (ITS)
Lead forming
Tool design critical to maintaining package integrity
16. Sealing Equipment - ITS (Isothermal Packaging System) Semiautomatic
Custom Designed and Built Plates
Controls:
Time
Pressure
Temperature
UPH: 600 - 700*
99% + Yield
17. Isothermal Packaging System Lid is held up during temperature ramp up
At temperature, lid is released onto package
Piston applies pressure to lid preventing pinholes and blowouts
18. Thermally Enhanced R-Pak
Moisture resistant and near hermetic
Capable of eutectic die attach
High thermal dissipation capability
High frequency capability
parts in service at 5.8 GHz
Can pass JEDEC Level I Moisture Pre-Conditioning
Pass Mil-Std 883 Section 1010 Condition C temp cycle
19. RELIABILITY TESTING
20. Eutectic Die Attach in an Air Cavity Plastic Package !