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2008 International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal

2008 International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal Technologies for Wireless Communications Working Group April 4 2008 Koenigswinter, Germany. 2008 Update Plan. In discussion

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2008 International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal

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  1. 2008 International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal Technologies for Wireless Communications Working Group April 4 2008 Koenigswinter, Germany

  2. 2008 Update Plan • In discussion • Some roadmap reflect “prototype capable” device, not all in production, lack of application drivers • Generate matrix of applications vs technologies, including emerging applications (like medical and security etc) • CMOS • Performance Analog CMOS continue linkage to LSTP CMOS with 1 year lag • mmWave CMOS continue linkage to HP CMOS, may increase lag (current 2 yr) • Consider dropping partial nodes for RF? • Review 1/f noise, fmax and matching requirements with publsihed data, in particular as device move to HighK/Metal gate and double gate • XTWG with ERD • Wireless provide target key RF parameters (device and block level). • ERD benchmark current published RF performance. • XTWG with PIDS • I/O device offering options for planar SOI and FinFETs

  3. 2008 Update Plan • Bipolar • Delay in Ft/Fmax and modify Ft/Fmax ratio in high speed NPN roadmap. • Synchronize HV NPN Ft/Fmax with HF device and review BVCEO. • Update PA NPN parameter to reflect today performance. • Power Amplifier • Handset : HBT & FET, III-V and Si • Increase "foundry" PA participation.   • Update end of life battery parameter. • Consider adding semiconductor switch in 2009 roadmap. • RFMEMS • Expand membership. • Stay with device choice (1) BAW, (2) Resonator, (3) switch - capacitive contact, and (4) switch - metal contact. • Include more specific requirement parameters for switch and BAW. • Prepare specific design tools requirements for XTWG discussion with Design. • XTWG with Assy&Pkg & test • Provide MEMS package issues, required physical dimension and list of components in SiP module. • In-line test for MEMS package (Qual package only, no inline test needed?)

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