HV-CMOS Hybridization

1. HV-CMOS Hybridization G. Darbo – INFN / Genova Future Pixel Chip Design – Vidyo 18 Mar 2014 On Behalf of Genova ATLAS Pixel & Genova Low Temperature Detector (LTD) Lab Indico agenda: https://indico.cern.ch/event/289724/

2. How to Glue HV2FEI4 to FE-I4 Requirements: • Thin uniform dielectric layer (5 µm?) • Precise alignment of the two chips (bumps are 18µm diameter and minimum 50µm pitch on FE-I4 side) Issues on “glue & press” • Difficult to keep parallelism • Difficult to keep calibrated spacing (~impossible once HV-CMOS reachesfull size) • How to align chips in XY (if capacitors are not cantered cross-talk) Deposit Glue FE-I4 CHIP Apply pressure HV2FEI4 FE-I4 CHIP

3. CCPD HV-CMOS - Hybridization How to improve – process steps: • Use spacers: patterned photoresist pillars on FE-I4 • Spin SU-8 photoresist (rad-hard) on FE-I4 to desired thickness • Use mask for making pillars and clean rest of the surface • Apply glue (or SU-8 again) to have a thin layer • Apply pressure until pillars are in contact with HV2FEI4 • Test done – see talk at 9th Trento WS by M. Biasotti: http://indico.cern.ch/event/273880/session/5/contribution/68/material/slides/0.pdf Spin SU-8 photoresist Pattern pillars by mask R/O CHIP R/O CHIP R/O CHIP Glue deposition Align & pressure Low Tempreature Detector facility – LTD Genova Ref.: M. Biasotti et al., 9th “Trento” Workshop – Genova 26-28/2/2014 DETECTOR CHIP 2x2 pillar height test: • distance 4 mm • height in µm The tiny HV2FEI4p1 prototype glued on the large FE-I4 FE-I4 HV2FEI4 2.2 × 4.4 mm2 60 columns × 24rows

4. How Genova May Contribute to CCPD Hybridization Genova has expertise and instruments • >20 years development of pixel detectors (ATLAS) and low temperature detectors (LTD) • Process on dies (not full wafer) • We may consider to do more than gluing – look at the combined facilities at the same department floor! Collaboration between • ATLAS Pixel Lab (APL) • Low Temperature Detector (LTD) Genova Lab (see next slides) ATLAS Pixel Lab (Genova) – APL KLA-TENCOR P7 stylus profiler Scan length: 150mm - 6” wafer Repeatability/reproducibility: 4/15 Å Vertical resolution: 0.01/0.60 Å Manual flip-chip machine

5. Micro-fabrication and Thin Film Facility - Genoa LTD Lab Laser shot for Ir, W, Re deposition PLD film deposition • Thin Film Growth Systems • 2 E-guns 4 material each @ 10-9 mbar • 2 AC & 1 DC Magnetron Sputtering Systems • Pulsed Laser Deposition System @ 10-10 mbar • Micro-fabrication • Reactive Ion Etching, Plasma & Wet etching • 2 Mask Aligners, Oxygen Plasma & Ion Beam • Critical Point Dryer Class1000-CR for lithography TES on SiN membrane

6. Micro-fabrication and Thin Film Facility - Genoa LTD Lab Bolometer for 145 GHz-Back etched and spiderweb shaped SiN membrane on Si wfr Cryogenic Silicon Ballistic Phonon detector for GeV cosmic protons for L2 orbit payload 10 µm 250µm 5 µm

7. Next Steps Try pillars technique on full size 2x2 cm2 • Glue face-to-face FE-I4 to FE-I4 • Deposit SU-8 on FE-I4, mask off and leave columns, measure height • Glue and align second FE-I4 using manual flip-chip machine • Make sections and measure thickness Then… • … proceed with functional components