MEMS

1. MEMS HsinchuTaiwan December 5, 2012 Chair: Michael Gaitan (NIST) Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI) Work in progress – do not publish

2. MEMS Technology Working Group Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI) Toshiba Wispry Analog Devices SB Microsystems MEMSCAP National U of Singapore Promeus IMEC PolyTec iNEMI Jazz Semiconductor Perdue Acutronic University of MD Asian Pacific Micro NXP ST Micro KFM Technology Fujitsu Rohm NIST enablingMNT Hiroshi Toshiyoshi Ingrid De Wolf Jae Sung Yoon Jim Spall Jim Mrvos Jianmin Miao John Rychcik Joost van Beek Josh Molho Karen Lightman Kevin Chau Koji Fukumoto Marcie Weinstein Mark Crockett Mary Ann Maher Mervi Paulasto-Kröckel Michel Brillouet Monica Takacs Patric Salomon Pete Loeppert Raj Gupta Raji Baskaran Rakesh Kumar University of Tokyo IMEC KIMM Delphi Lexmark Nanyang Tech Univ Acutronic NXP Caliper MEMS Industry Group MEMStaff Sony Akustica SEMI SoftMEMS Aalto University LETI MEMS Industry Group 4m2c Knowles Acoustics Volant Technologies Intel Global Foundries Randall Wagner Philippe Robert Robert De Nuccio Robert Tsai Rob O’Reilly Ron Horwath Ron Lawes Sacha Revel Scott Bryant Shawn Blanton Stephane Donnay Stephen Bart Steve Breit Steve Greathouse Steve Walsh Takashi Mihara Tetsu Tanaka Tony Stamper Veljko Milanovic Wei-Leun Fang Wendy Chen Xiaoming Wu Yasutaka Nakashiba NIST LETI ST Micro TSMC Analog Devices Glimmerglass Ltd. Imperial College Accutronic MANCEF Carnegie Mellon University IMEC MKS Instruments Coventor Plexus MANCEF Micromachine Center Tohoku University IBM Mirrorcle Technologies NTHU KYEC Lexmark Renesas Electronics Akihiro Koga Arthur Morris AsifChowdhury Brian Jamieson Buzz Hardy Chengkuo Lee Chris Apanius Chris van Hoof Christian Rembe Chuck Richardson Dave Howard DimitriosPeroulis Dominique Schinabeck Don DeVoe Edward Chiu Erik Jan Lous Fabio Pasolini FabriceVerjus FumihikoNakazawa GoroNakatani Hebert Bennett Henne van Heeren

3. From Yole Development at the MEMS Industry Group's M2M Workshop, May 2012

4. MEMS in Mobile Devices Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012

5. MEMS Technology Working Group MEMS TWG Systems Integrators Device Manufacturers Equipment and Materials Suppliers Design Houses Foundries iNEMI

6. ITRS MEMS Chapter Summary • MEMS Device Technologies • Accelerometers • Gyroscopes • Inertial Measurement Units (IMUs) • Microphones • RF MEMS • Emerging MEMS • Technology Requirements • Device Performance • Design and Simulation • Packaging and Integration • Device Testing

7. MEMS Inertial Sensors • MEMS Inertial Sensors continue to incrementally increase in performance and lower in cost. • The integration path of the Inertial Measurement Unit (IMU) has advanced to 9 degrees of freedom (DoF) in the package sooner then forecasted in the 2010 edition. • Driving down the cost of testing of the IMU continues to be a challenge.

9. Example: 9 DoF IMU at Board Level ST Microelectronics Feb 12, 2012 http://www.st.com/internet/com/press_release/p3273.jsp

10. MEMS Integration Node

11. MEMS Microphones • MEMS microphones are expected to continue to increase in performance and lower in cost. • Testing in the factory environment is an issue as MEMS microphone sensitivity advances to -68 dB. • MEMS microphones will see advances in the ASIC to include digital output and adaptive signal processing (such as noise cancellation). • Testing of MEMS microphones with adaptive signal processing is a challenge.

12. RF MEMS • RF MEMS are intended to lower the power dissipation of the radio. • RF MEMS are sill in the process of increasing their reliability and lowering cost before they can be adopted in mobile devices. • The biggest challenge in RF MEMS is enhancing reliability and lifetime (# of operations) • Some of the future performance requirements have no known solutions, (e.g., signal isolation requirements)

13. Critical Issues • There is little uniformity for reporting performance characteristics in device data sheets. • A new terminology standard is in development and a new iNEMI project is starting to standardize characterization protocols. • MEMS manufacturers seek to lower the rising cost of testing as functionality increases. • The volume of MEMS testing is lower than ICs but the cost of testing per device is much higher. Testing can consume 60% of the manufacturing cost. • Potential solutions include: • Methodologies and validation for Wafer Level Testing. • Methodologies for Design for Test.

14. Plans for 2013 • The MEMS Technology Working Group is affiliated with the ITRS and iNEMI. • The iNEMI MEMS Chapter has been expanded to include consumer health and automotive applications. These will be further expanded in the 2013 ITRS MEMS Chapter. • Our TWG discussions are exploring the concept of sensor integration nodes. • We will incorporate magnetometers (electronic compass) and pressure sensors (altimeter) in the roadmap. • A new terminology standard for MEMS Sensors is being developed. • Driven by member companies in The MEMS Industry Group, which include Intel, Qualcomm, ST Microelectronics, Bosch, and Freescale. • An iNEMI project on MEMS Testing Requirements will be starting on defining testing protocols for device performance metrics in data sheets.

15. Conclusions • Systems integrators play a key role in developing cooperation between the device manufacturers. • MEMS Sensor Fusion creates challenges for testing as complexity increases while still lowering cost. • MEMS device performance and testing requirements depend on the application (consumer electronics, automotive, medical, defense and aerospace). • The concept of sensor integration path might facilitate longer term road mapping of MEMS and possibly other More than Moore Technologies.