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MEMS Fabrication. By Thomas Szychowski. MEMS overview. Micron level mechanical parts Made from transistor materials and metals Van Der Waals forces Intermolecular bonding Plays an important part in design. Fabrication Techniques. Mask Lithography Injection molding
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MEMS Fabrication By Thomas Szychowski
MEMS overview • Micron level mechanical parts • Made from transistor materials and metals • Van Der Waals forces • Intermolecular bonding • Plays an important part in design
Fabrication Techniques • Mask Lithography • Injection molding • Microstereolithography • Silicon Surface Micromachining • Silicon Bulk Micromachining
Mask Lithography • Use of photo resist • Positive • Dissolves under light • Negative • Hardens under light • Both get covered with desired material, then photo resist is dissolved by a solvent • Multiple layers – Multiple steps
Injection Molding • Starts with mask lithography • Metal poured over resist • Resist gets dissolved • Metal form is left for plastic injection molding
Microstereolithography • Similar principal to mask lithography, but for 3D pieces • Uses an “active mask” • Not a physical mask • Utilizes a photo-reactive acrylic resin • Each layer image projected through a DMD(digital mirror device) • Projected into the resin • Uses lenses • Resin that is illuminated, Cross-links and hardens • Piece is then covered in a hardened layer
Microstereolithography • Dimensional capabilities • Lateral and Vertical resolution: 10μm • Maximum field size: 10.24mm x 7.68mm • Structural height: up to 5mm
Silicon Surface Micromachining • Uses the same process as IC fabrication • Needs multiple layers to create structures • Cheapest form of Micromachining • Similar to lithography • Sacrificial material • Structural material • When sacrificial material is removed, only whole structures are left
Silicon Bulk Micromachining • Done with Crystalline silicon • Constructed using etch stop planes • Chemical process • Anisotropic Etching • Speed dependent – Directional • etch in different crystallographic directions at different rates • Slower directions create and etch stop plane
Deep Reactive Ion Etching (DRIE) • Uses photo resist and a mask to create structures
Sapphire Etching • Metal Mask • 100µm etch depth • .28µm/min etch rate • Chlorine etching
Pressure Sensor Etching • Used on silicon • Metal mask • .81µm etch depth • Utilizes Fluorine
High-Speed Etching • Silicon material • 1µm/min etch rate • W-Si Mask
References • http://home.earthlink.net/~trimmerw/mems/tour.html • http://home.earthlink.net/~trimmerw/mems/BM_bulk.html • http://www.samcointl.com/apps/mems.html • http://www.cmf.rl.ac.uk/latest/msl.html • http://www.chemguide.co.uk/atoms/bonding/vdw.html • “Micromachining for Optical and Optoelectronic Systems”. MING C. WU