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Status of Readout Boards

Status of Readout Boards. Craig Woody BNL. Upgrade Working Group June 20, 2006. Schedule. First full scale board made in BNL Instrumentation Shop Left Hand Side, 5 m m Cu – all channels checked out ok No flash plating, no gold plating to save time

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Status of Readout Boards

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  1. Status of Readout Boards Craig Woody BNL Upgrade Working Group June 20, 2006

  2. Schedule • First full scale board made in BNL Instrumentation Shop • Left Hand Side, 5 mm Cu – all channels checked out ok • No flash plating, no gold plating to save time • Some areas where Cu was discontinuous repaired by hand • Attempt with 3 mm Cu was total failure • Layout for Right Hand Side complete, but no time for prototype • Will start production at RD Circuits ($1K/board) today, delivery by 6/30 • Second company ($300/board) only has 3 mm material; attempting to find 5 mm material, but not really an option at this point • All boards to stuffing house for SM components by 7/5, back by 7/12 • Through hole components installed at BNL (~ 2 days)  7/14 • Gluing Rohacell backing done at BNL - 4 boards/day • Delivery to Stony Brook starting 7/17, all 24 finished by 7/28 C.Woody, HBD Working Group Meeting, 6/20/06

  3. Final Readout Board (LHS) C.Woody, HBD Working Group Meeting, 6/20/06

  4. Board Layers 2x7 mm+ 5 mm = 19 mm = 1.33 x 10-3 X0 Core + Prepreg = .0165” = 2.16 x 10-3 X0 Total = 3.49 x 10-3 X0 1 mm Cu = 0.7 x 10-4 X0 C.Woody, HBD Working Group Meeting, 6/20/06

  5. Test Pulse Distribution TPin = 160 mV = 100,000 e’s C.Woody, HBD Working Group Meeting, 6/20/06

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