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Small Feature Reproducibility

Small Feature Reproducibility. Small Feature Reproducibility Measuring, Understanding and Controlling Variability in Deep Sub-micron Patterning. UC-SMART Major Program Award E. Aydil, J. Bokor, N. Cheung, D. Dornfeld, B. Dunn, D. Graves, E. Haller,

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Small Feature Reproducibility

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  1. Small Feature Reproducibility

  2. Small Feature Reproducibility Measuring, Understanding and Controlling Variability in Deep Sub-micron Patterning UC-SMART Major Program Award E. Aydil, J. Bokor, N. Cheung, D. Dornfeld, B. Dunn, D. Graves, E. Haller, M. Lieberman, A. Neureuther, K. Poolla, R. Smith, C. Spanos, J. Talbot University of California Berkeley, Davis, Los Angeles, Santa Barbara, San Diego Third Annual Workshop 11/8/2000 SFR Workshop - Overview

  3. Program Goals • We have pursued solutions by focusing on: • fundamental understanding • modeling variability mechanisms • sensing variability causes during production • We will now focus on controlling and improving variability. • Our context is lithography, plasma, CMP, diffusion, and the way these steps interact with each other. SFR Workshop - Overview

  4. Small Feature Reproducibility • Capture • In-situ and off-line metrology • Hierarchical Analysis of Variance • Understand • Resist, Plasma, Diffusion Modeling • Variability Impact on Device / Interconnect Performance • Enable • Fundamental modeling of variability • Optimal recipe generation • On-wafer / real-time / in-situ sensors • Run-to-run and real-time control • Process diagnosis • Chamber, process and product design 2000-2003 themes SFR Workshop - Overview

  5. 2000-2003 Project The theme for 1998-2000 was: “how to measure, understand and model small feature reproducibility”. The theme for 2000-2003 is: “Enable the Reproducibility of Small Features” SFR Workshop - Overview

  6. Advanced Energy ASML Atmel Corp. Advanced Micro Devices Applied Materials Asyst Technologies Inc. Cymer Etec Systems Inc. Intel Corporation KLA-TENCOR Lam Research Corp. Millipore Corp. Nikon Research Corp. Novellus Systems Inc. Silicon Valley Group Schlumberger Industrial / Academic Team University of CA, Berkeley, Davis, Los Angeles, Santa Barbara, San Diego SFR Workshop - Overview

  7. A New* Research Structure • Education • Spread the word through workshops, GSRs, USRs, long / short courses, and freshman seminars. • Novel Technologies • Study bold new process steps and methods in order to leapfrog current technology limitations. • Modeling and Simulation • Develop goal-oriented numerical and statistical abstractions for processes and their respective hardware. • Sensors and Metrology • Justify and spearhead smart sensors that transcend process steps and technology generations. • Recipe Generation, Process Optimization and Control • Enable better process agility, reliability and reproducibility. * Old Structure: Litho, Plasma, CMP, Diffusion, Sensors, Education SFR Workshop - Overview

  8. SFR First year Milestones, due September 30, 2001 Novel Technologies Initial experiments and simulations for resist processes, polarization masks, and multi-parameter test structures. (Neureuther) Metalorganic precursor doser. Preliminary deposition studies. Self-limiting film formation for low toxicity precursors. (Graves) Etch resist in LAPS to examine uniformity. Characterize instability using OES/actinometry and planar probe. (Lieberman) Establish plasma recipes and adhesion data for plasma-treated Si, oxide, and metal surfaces. (Cheung) Modeling and Simulation Determine importance of physical effects on resist chemistry/optics interaction using simulation and experiment. (Neureuther) Molecular dynamics code for deposition energy. Preliminary sputtering studies, compare to phenomenological theory. (Graves) Simulations for AMD device designs at 100nm, 70 nm, and 50 nm gate length, including effect of isolation roughness. (Bokor) Analyze boron diffusion in silicon isotope hetero-structures. Predictive model for various experimental conditions. (Haller) Integrated CMP model for basic mechanical and chemical elements. Periodic grating metrology (Dornfeld, Talbot, Spanos) Sensors and Metrology Build and demonstrate Langmuir probe based on-wafer ion flux probe array using external electronics. (Aydil) Design and build a single MEMS based retarding field ion energy analyzer with external electronics. (Poolla) Design and fabricate first generation prototype MEMS sensor array. Bench test using Joule heating. (Smith) Demonstrate cut-and-paste approach for membrane arrays, LED arrays, and battery encapsulation. (Cheung) Develop thermally robust inorganic electrolyte. Lid added to battery encapsulation scheme. (Dunn) Build Microplasma generating system. Test with bulk optical components. (Poolla, Graves) Recipe Generation, Process Optimization and Control Install automated OES on LAM 9400 reactor and build large statistical database of process fingerprinting data. (Spanos) Install the Z-scan sensor and explore the spectral RF signature of plasma instabilities. (Spanos, Lieberman) Publish ellipsometric detection specifications for full-profile, 100nm metrology. (Spanos) Demonstrate simulator tuning for full profile matching over a range of focus and exposure conditions. (Spanos) Develop performance metrics for CMP and lithography. Assess input sensitivity and controllability. (Poolla) Education Second offering of the cross listed 133 course: increase student numbers from 16 to 24. Additional experiment: spin coating low k dielectric. Add plasma diagnostics to etch experiment. (Graves) Organize two workshops (Fall and Spring) for all the project participants. (Spanos) SFR Workshop - Overview

  9. SFR Second year Milestones, due September 30, 2002 Novel Technologies Conduct and quantitatively interpret resist processes, polarization masks, and multi-parameter test structures. (Neureuther) Study effects of surface preparation, type and temperature on film properties. Measure key radical-surface kinetics. (Graves) Characterize plasma instability using V-I-phase probe. Model for reduced electron temperature and density. (Lieberman) Demonstrate polymer surface modification with plasma implantation (Cheung) Modeling and Simulation Guidelines for 3D defect sizing and feature interactions. Extend line-end shortening to underlying topography. (Neureuther) Code to study ion-induced surface diffusion. Compare results to phenomenological theory and experiment. (Graves) Wafers processed at AMD finished with varying, and well-characterized LER. (Bokor) Model diffusion of dopants in isotopic multilayer structures. Study interference between diffusion and native defects. (Haller) Integrate initial chemical models into basic CMP model. Validate predicted pattern development. (Dornfeld, Talbot) Sensors and Metrology Build and demonstrate 8” on-wafer ion flux probe array in industrial plasma etcher with external electronics. (Aydil) Demonstrate MEMS based ion energy analyzer in plasma with external electronics. (Poolla) Integrate the inorganic electrolyte into the battery structure. Develop an in-situ lithium formation process. (Dunn) Build micro-optics for spectral analysis. Complete the preliminary designs for integrated MOES. (Poolla) Recipe Generation, Process Optimization and Control Automated fault detection using RF fingerprinting. Automated generation of syntactic rules for RF fingerprinting. (Spanos) Feasibility of building 100nm capable profile extraction using small footprint, in-line spectroscopic ellipsometry. (Spanos) Demonstrate simulator tuning (using Prolith) for full statistical profile matching over a range of conditions. (Spanos) Design optimal recipes for unit processes, evaluate robustness using simulators and experiments. (Poolla) Education Offer 133 as summer UC Extension course. Develop of web-based equipment simulation. (Graves) Development and first offering of 1- and 2-hour freshman seminar modules on semiconductor manufacturing. (Lieberman, all) Organize two workshops (Fall and Spring) for all the project participants. (Spanos, all) SFR Workshop - Overview

  10. SFR Third year Milestones, due September 30, 2003 Novel Technologies Design and test apparatus, interpret data for resist, polarization masks, and multi-parameter test structures. (Neureuther) Apply method to patterned surfaces for barrier film application. Explore DRAM capacitor applications. (Graves) Develop and test instabilities control. Reduce electron temperature and density in discharges. (Lieberman, Spanos) Demonstrate concomitant plasma treated/deposition surfaces as effective diffusion barrier. (Cheung) Modeling and Simulation Defect modeling to relate inspection to printing. Link resist, tool and substrate effects to line-end shortening. (Neureuther) Molecular dynamics of ion bombardment. Simulate energy deposition and surface diffusion and link to LER study. (Graves) Device characterization on AMD wafers completed and data analyzed. (Bokor) Comprehensive model on dopant- and self-diffusion in Si. Properties of dopants and native point defects in silicon. (Haller) Comprehensive chemical and mechanical model. Experimental and metrological validation. (Dornfeld, Talbot, Spanos) Sensors and Metrology Integration of Si-based IC with sensor arrays. Characterize and test integrated MEMS ion sensor array. (Aydil, Poolla) Battery operation between room temperature and 150°C. Battery survivability to sensor soldering operation. (Dunn) Design and test integrated MOES. Calibration studies, sensor characterization. (Poolla, Graves) Recipe Generation, Process Optimization and Control Study systems of real-time instability detection and plasma stabilization control. Spanos) Perform field studies of automated OES classification for fault diagnosis. (Spanos) Implement lithography controller that merges full profile in-line information with available metrology. (Spanos, Poolla) Model-based RTR control schemes, assess theoretical, simulated and experimental performance on SFR variance. (Poolla) Education 2nd offering of course as summer UC Extension course. Notes and lectures available to supporting companies. (Graves) Freshman seminars related to semiconductor manufacturing at all SFR-participating campuses (Lieberman, all) Organize two workshops (Fall and Spring) for all the project participants. (Spanos) SFR Workshop - Overview

  11. New Tools • UC Berkeley Microlab Converting to 6”. • ASML DUV stepper + SVG track. • Hitachi CD SEM. • Novellus M2I 5-chamber sputtering tool. • Complete planarization (CMP/back etch). • State of the art electrical CD metrology. • State of the art RF and OES sensing capabilities. • State of the art thin-film and scatterometry tools. SFR Workshop - Overview

  12. Achievements in Education • New teaching lab operational, course started in Spring 2000 • EE143 lab has been completely refurbished, ~55 students enrolled (up almost 60% since before SFR). • Biweekly teleconferencing seminars continue with technical talks this semester. • ~30 graduate students, 13 Professors, 5 UC campuses. >15 graduate(d) students now work for SFR companies. SFR Workshop - Overview

  13. SMART Microfabrication Equipment Lab Overview • Joint EECS/ChE/ME/MSME course at Berkeley available to B.S., M.S., and Ph.D. students • Focus on equipment and processes; existing labs focus on device fabrication (e.g. UCB/EE143) • Emphasis on chemical and physical processes occurring within equipment, including transport, plasma and chemical kinetics, materials science • Offered for second time spring 2001: enrollment goal is 24 students, up from 16 in 2000. • Plans to offer course as UC Extension short course, summer 2001 SFR Workshop - Overview

  14. SMART Equipment Lab Update • 3 new PC’s added in laboratory • Add statistical analysis of experimental data (JMP) • Simulation of chemical vapor deposition reactor (FLUENT) • Vacuum system simulation: pumpdown, conductances, pumping speed • Plasma simulations • Plan to upgrade plasma experiment to include optical emission spectroscopy and Langmuir probe • Modification to electrochemical deposition experiment to test effects of organic additives on growth rates SFR Workshop - Overview

  15. EE 143 Enrollment Statistics ~35 Fall 98 46 in Fall 99 56 in Spring 2000 We will further enhance the training laboratory. We will disseminate course modules to other schools. SFR Workshop - Overview

  16. Enrollment in Semiconductor Manufacturing Courses at Berkeley SMART Lab EE 143 SFR Workshop - Overview

  17. 2000-2003 Education Goals • Freshman seminar program at all campuses • One seminar per faculty member per year - 13 seminars/yr • 15 freshmen per seminar • Related to semiconductor manufacturing and the Department discipline • UC Extension summer offering of Equipment Lab • First offering in Summer 2001 • Undergraduate internships at participating companies • At least five positions, starting Summer 2001 • Seminar series with industrial speakers • Biweekly, with emphasis on business and technology SFR Workshop - Overview

  18. Freshman Seminars • Freshman seminar offered fall 2000 in chemical engineering (24 students, DBG) • Seminar emphasizes semiconductor industry and semiconductor processes. • ~10 such seminars will be deployed by fall 2001, reaching ~200 students across 4 campuses. SFR Workshop - Overview

  19. Example of Freshman Seminar TV with cover off - PC/disk drive - Laser printer - Silicon run - Moore’s law - Liquid crystal - Cell phones - MEMS - IC design / fabrication sequence - super clean manufacturing… etc. SFR Workshop - Overview

  20. Internships at Participating Companies • At least five summer undergraduate positions each year, starting in Summer 2001 • Student applications late in Fall Semester • Advertise among 300+ students taking semiconductor manufacturing courses • Identify positions by end of January • Select and fill positions by end of March • Company Mentors and UC PIs coordinate exchange • Coordinate with EECS BS/MS Internship Program We are now receiving applications / job descriptions! SFR Workshop - Overview

  21. Seminar Series With Industrial Speakers • Create bi-weekly seminar series with invited speakers from the participating companies • Emphasis on business and technology highlights • Will start in spring 2000. We are now asking/selecting presentation proposals! SFR Workshop - Overview

  22. Some of the SFR Graduates… • Luan Van, MS (Photoresist roughness studies) – Etec • Alex Goretsky, MS (plasma modeling) – Novellus • Harmeet Singh, PhD (plasma diagnostics) - Lam Research • Kurt Salloux -  Hughes Aerospace (to be Boeing eventually); Ph.D. Spring, 2000 • Xinhui Niu, Ph.D. in EECS, December 1998, co-founder of Timbre Tech, CD-Scatterometry for most of the SFR chip-makers. • Nickhil Jakatdar, Ph.D. in EECS, January 2000, co-founder of Timber Tech. • Scott Eitepence, BS in EECS May 2000, summer 2000 internship with Etec. • Yongsik Moon, PhD Mechanical Engineering, September 1999, now at Applied Materials, CMP area. • Gary Lam, BS Mechanical Engineering, Spring 1997 Applied Materials. • Yaoxi Wu, Ph.D. in Materials Science and Engineering, May, 2000. • Alexei Marakhtanov, Ph.D. student in EECS, summer 2000 internship at Lam • Junwei Bao, Ph.D. student in EECS, summer 2000 internship at AMD, continuing part-time during the fall semester. • Michiel Kruger, Ph.D. student in ME, summer 2000 internship at Applied Materials. SFR Workshop - Overview

  23. Today’s Objectives 1. Present and discuss 2000-2003 plans. Three-year extension awarded, Started October 1st, 2000. 2. Bring PIs, students, industrial participants together. Emphasis of presentations shifted to poster session. 3. Collect Feedback from Steering Committee Closed meeting and feedback session this afternoon. SFR Workshop - Overview

  24. Web site, etc. Timothy D. Duncan 524 Cory Hall, CSG phone: (510) 643-7542 fax: (510) 642-2739 tduncan@eecs.berkeley.edu Account Management Diane Chang 558 Cory Hall, ERL phone: (510) 642-4043 fax: (510) 642-2739 changd@eecs.berkeley.edu People to Meet and Places to Go Administrative Support Charlotte Jones 558 Cory Hall, ERL phone: (510) 642-1818 fax: (510) 642-2739 cmjones@eecs.berkeley.edu University of California, Berkeley CA, 94720-1770 http://sfr.berkeley.edu Access restricted by password SFR Workshop - Overview

  25. 3rd Annual SFR Workshop, November 8, 2000 8:30 – 9:00 Research and Educational Objectives / Spanos 9:00 – 9:50 Plasma, Diffusion / Graves, Lieberman, Cheung, Haller 9:50 – 10:10 break 10:10 – 11:00 Lithography / Spanos, Neureuther, Bokor 11:00 – 11:50 Sensors & Metrology / Aydil, Poolla, Smith, Dunn 12:00 – 1:00 lunch 1:00 – 1:50 CMP / Dornfeld, Talbot, Spanos 1:50 – 2:40 Integration and Control / Poolla, Spanos 2:40 – 4:30 Poster Session and Discussion, 411, 611, 651 Soda 3:30 – 4:30 Steering Committee Meeting in room 373 Soda 4:30 – 5:30 Feedback Session

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