310 likes | 329 Views
Small Feature Reproducibility. 3rd Annual SFR Workshop & Review, May 24, 2001. 8:30 – 9:00 Research and Educational Objectives / Spanos 9:00 – 9:45 CMP / Doyle, Dornfeld, Talbot, Spanos 9:45 – 10:30 Plasma & Diffusion / Graves, Lieberman, Cheung, Haller 10:30 – 10:45 break
E N D
3rd Annual SFR Workshop & Review, May 24, 2001 8:30 – 9:00 Research and Educational Objectives / Spanos 9:00 – 9:45 CMP / Doyle,Dornfeld, Talbot, Spanos 9:45 – 10:30 Plasma & Diffusion / Graves, Lieberman, Cheung, Haller 10:30 – 10:45 break 10:45 – 12:00 Poster Session / Education, CMP, Plasma, Diffusion 12:00 – 1:00 lunch 1:00 – 1:45 Lithography / Spanos, Neureuther, Bokor 1:45 – 2:30 Sensors & Controls /Aydil, Poolla, Smith, Dunn, Cheung, Spanos 2:30 – 2:45 Break 2:40 – 4:30 Poster Session / all subjects 3:30 – 4:30 Steering Committee Meeting in room 373 Soda 4:30 – 5:30 Feedback Session
Small Feature Reproducibility Measuring, Understanding and Controlling Variability in Deep Sub-micron Patterning UC-SMART Major Program Award E. Aydil, J. Bokor, N. Cheung, D. Dornfeld, F. Doyle, B. Dunn, D. Graves, E. Haller, M. Lieberman, A. Neureuther, K. Poolla, R. Smith, C. Spanos, J. Talbot University of California Berkeley, Davis, Los Angeles, Santa Barbara, San Diego Third Annual Workshop & Review 5/24/2001 SFR Workshop - Overview
Program Goals • We have pursued solutions by focusing on: • fundamental understanding • modeling variability mechanisms • sensing variability causes during production • We will are now focusing on controlling and improving variability. • Our context is lithography, plasma, CMP, diffusion, and the way these steps interact with each other. SFR Workshop - Overview
Small Feature Reproducibility • Capture • In-situ and off-line metrology • Hierarchical Analysis of Variance • Understand • Resist, Plasma, Diffusion Modeling • Variability Impact on Device / Interconnect Performance • Enable • Fundamental modeling of variability • Optimal recipe generation • On-wafer / real-time / in-situ sensors • Run-to-run and real-time control • Process diagnosis • Chamber, process and product design 2000-2003 themes SFR Workshop - Overview
Advanced Energy ASML Atmel Corp. Advanced Micro Devices Applied Materials Asyst Technologies Inc. Cymer Etec Systems Inc. Intel Corporation KLA-TENCOR Lam Research Corp. Mykrolis Corp. Nikon Research Corp. Novellus Systems Inc. Silicon Valley Group Schlumberger Tokyo Electron Industrial / Academic Team University of CA, Berkeley, Davis, Los Angeles, Santa Barbara, San Diego SFR Workshop - Overview
Our Research Structure • Education • Spread the word through workshops, GSRs, USRs, long / short courses, and freshman seminars. • Novel Technologies • Study bold new process steps and methods in order to leapfrog current technology limitations. • Modeling and Simulation • Develop goal-oriented numerical and statistical abstractions for processes and their respective hardware. • Sensors and Metrology • Justify and spearhead smart sensors that transcend process steps and technology generations. • Recipe Generation, Process Optimization and Control • Enable better process agility, reliability and reproducibility. SFR Workshop - Overview
SFR First year Milestones, due September 30, 2001Novel Technologies • Initial experiments and simulations for resist processes, polarization masks, and multi-parameter test structures. (Neureuther) done • Metalorganic precursor doser. Preliminary deposition studies. Self-limiting film formation for low toxicity precursors. (Graves) changed to: • Focus on TiN barrier layers deposited by novel ALD technology: REALCVD. Conduct preliminary film deposition studies. Test self-limiting film formation for various precursors. on target • Etch resist in LAPS to examine uniformity. Characterize instability using OES/actinometry and planar probe. (Lieberman) done • Establish plasma recipes and adhesion data for plasma-treated Si, oxide, and metal surfaces. (Cheung) on target SFR Workshop - Overview
SFR First year Milestones, due September 30, 2001Modeling and Simulation • Determine importance of physical effects on resist chemistry/optics interaction using simulation and experiment. (Neureuther) on target • Molecular dynamics code for deposition energy. Preliminary sputtering studies, compare to phenomenological theory. (Graves) changed to: Focus on plasma reactor modeling of etch products transport (SiClx). Role of gas inlet and outlet, flow rates on redeposition. Develop experimental testbed to examine plasma-wall interactions.on target • Simulations for AMD device designs at 100nm, 70 nm, and 50 nm gate length, including effect of isolation roughness. (Bokor) on target • Analyze boron diffusion in silicon isotope hetero-structures. Predictive model for various experimental conditions. (Haller) on target • Integrated CMP model for basic mechanical and chemical elements. Periodic grating metrology (Dornfeld, Talbot, Spanos) on target SFR Workshop - Overview
SFR First year Milestones, due September 30, 2001Sensors and Metrology • Build and demonstrate Langmuir probe based on-wafer ion flux probe array using external electronics. (Aydil) on target • Design and build a single MEMS based retarding field ion energy analyzer with external electronics. (Poolla)(similar project at Sandia)changed to: Thermal Flux Sensor for Etch Processes. Design and fabricate sensor. Test sensor in Xenon DiFloride ecth. Evaluate sensitivities. on target • Design and fabricate first generation prototype MEMS sensor array. Bench test using Joule heating. (Smith) on target • Demonstrate cut-and-paste approach for membrane arrays, LED arrays, and battery encapsulation. (Cheung) done • Develop thermally robust inorganic electrolyte. Lid added to battery encapsulation scheme. (Dunn) on target • Build Microplasma generating system. Test with bulk optical components. (Poolla, Graves) (Prof. Solgaard left) changed to: Electrical Impedance Tomography based Sensor to measure Spatially-resolved Natural Plasma Potential. Design sensor. Evaluate sensitivities. Study and devise efficient algorithms for inversion. Test numerical effectiveness in simulation studies.on target SFR Workshop - Overview
SFR First year Milestones, due September 30, 2001Recipe Generation, Process Optimization and Control • Install automated OES on LAM 9400 reactor and build large statistical database of process fingerprinting data. (Spanos) on target • Install the Z-scan sensor and explore the spectral RF signature of plasma instabilities. (Spanos, Lieberman) on target • Publish ellipsometric detection specifications for full-profile, 100nm metrology. (Spanos) done • Demonstrate simulator tuning for full profile matching over a range of focus and exposure conditions. (Spanos) on target • Develop performance metrics for CMP and lithography. Assess input sensitivity and controllability. (Poolla) on target SFR Workshop - Overview
SFR First year Milestones, due September 30, 2001Education • Second offering of the cross listed 133 course: increase student numbers from 16 to 24. Additional experiment: spin coating low k dielectric. Add plasma diagnostics to etch experiment. (Graves) refined/modified to: Additional experiment: spin coating low k dielectric. (Switched with year 2 milestone). Add plasma diagnostics to etch experiment. done Offer 133 as summer UC Extension course. planned Develop web-based equipment simulation. begun • Organize two workshops (Fall and Spring) for all the project participants. (Spanos) done SFR Workshop - Overview
SFR Second year Milestones, due September 30, 2002 Novel Technologies Conduct and quantitatively interpret resist processes, polarization masks, and multi-parameter test structures. (Neureuther) Study effects of surface preparation, type and temperature on film properties. Measure key radical-surface kinetics. (Graves) Characterize plasma instability using V-I-phase probe. Model for reduced electron temperature and density. (Lieberman) Demonstrate polymer surface modification with plasma implantation (Cheung) Modeling and Simulation Guidelines for 3D defect sizing and feature interactions. Extend line-end shortening to underlying topography. (Neureuther) Code to study ion-induced surface diffusion. Compare results to phenomenological theory and experiment. (Graves) Wafers processed at AMD finished with varying, and well-characterized LER. (Bokor) Model diffusion of dopants in isotopic multilayer structures. Study interference between diffusion and native defects. (Haller) Integrate initial chemical models into basic CMP model. Validate predicted pattern development. (Dornfeld, Talbot) Sensors and Metrology Build and demonstrate 8” on-wafer ion flux probe array in industrial plasma etcher with external electronics. (Aydil) Demonstrate MEMS based thermal flux probe in plasma with external electronics. (Poolla) changed Integrate the inorganic electrolyte into the battery structure. Develop an in-situ lithium formation process. (Dunn) Implement Prototype Plasma Tomography Sensor, test for etch rate metrology. (Poolla) changed Recipe Generation, Process Optimization and Control Automated fault detection using RF fingerprinting. Automated generation of syntactic rules for RF fingerprinting. (Spanos) Feasibility of building 100nm capable profile extraction using small footprint, in-line spectroscopic ellipsometry. (Spanos) Demonstrate simulator tuning (using Prolith) for full statistical profile matching over a range of conditions. (Spanos) Design optimal recipes for unit processes, evaluate robustness using simulators and experiments. (Poolla) Education Offer 133 as summer UC Extension course. Develop of web-based equipment simulation. (Graves) Development and first offering of 1- and 2-hour freshman seminar modules on semiconductor manufacturing. (Lieberman, all) Organize two workshops (Fall and Spring) for all the project participants. (Spanos, all) SFR Workshop - Overview
SFR Third year Milestones, due September 30, 2003 Novel Technologies Design and test apparatus, interpret data for resist, polarization masks, and multi-parameter test structures. (Neureuther) Study effects of surface preparation, surface type and surface temperature on REALCVD film properties. Measure key radical-surface kinetics (Graves) changed Develop and test instabilities control. Reduce electron temperature and density in discharges. (Lieberman, Spanos) Demonstrate concomitant plasma treated/deposition surfaces as effective diffusion barrier. (Cheung) Modeling and Simulation Defect modeling to relate inspection to printing. Link resist, tool and substrate effects to line-end shortening. (Neureuther) Model etch product creation, transport and redeposition for various Si etch chemistries. Compare experimental results to simulations (Graves) changed Device characterization on AMD wafers completed and data analyzed. (Bokor) Comprehensive model on dopant- and self-diffusion in Si. Properties of dopants and native point defects in silicon. (Haller) Comprehensive chemical and mechanical model. Experimental and metrological validation. (Dornfeld, Talbot, Spanos) Sensors and Metrology Integration of Si-based IC with sensor arrays. Characterize and test integrated thermal flux array. (Aydil, Poolla) changed Battery operation between room temperature and 150°C. Battery survivability to sensor soldering operation. (Dunn) Implement Prototype Plasma Impedance Tomography Sensor, test for plasma potential. (Poolla) changed Recipe Generation, Process Optimization and Control Study systems of real-time instability detection and plasma stabilization control. Spanos) Perform field studies of automated OES classification for fault diagnosis. (Spanos) Implement lithography controller that merges full profile in-line information with available metrology. (Spanos, Poolla) Model-based RTR control schemes, assess theoretical, simulated and experimental performance on SFR variance. (Poolla) Education Add new spin-coating low k dielectric experiment.Develop web-based equipment simulation. Second offering UC Extension summer short course. (Graves)changed Freshman seminars related to semiconductor manufacturing at all SFR-participating campuses (Lieberman, all) Organize two workshops (Fall and Spring) for all the project participants. (Spanos) SFR Workshop - Overview
New Tools • UC Berkeley Microlab 6” process is functional. • ASML DUV stepper + SVG track. • Hitachi CD SEM. • Novellus M2I 5-chamber sputtering tool. • Complete planarization (CMP/back etch). • State of the art electrical CD metrology. • State of the art RF and OES sensing capabilities. • State of the art thin-film and scatterometry tools. SFR Workshop - Overview
A new 200mm, 20,000ft2 facility by 2004: CITRIS SFR Workshop - Overview
Achievements in Education • New teaching lab operational, course started in Spring 2000 • EE143 lab has been completely refurbished, ~55 students enrolled (up almost 60% since before SFR). • Biweekly teleconferencing seminars continue with technical talks this semester. • ~30 graduate students, 14 Professors, 5 UC campuses. >20 graduate(d) students now work for SFR companies. SFR Workshop - Overview
Some of the SFR Graduates… • Luan Van, MS (Photoresist roughness studies) – Etec • Alex Goretsky, MS (plasma modeling) – Novellus • Harmeet Singh, PhD (plasma diagnostics) - Lam Research • Kurt Salloux - Hughes Aerospace (to be Boeing eventually); Ph.D. Spring, 2000 • Xinhui Niu, PhD in EECS, December 1998, co-founder of Timbre Tech, now a TEL company. • Nickhil Jakatdar, PhD in EECS, January 2000, co-founder of Timber Tech, now a TEL company. • Scott Eitepence, BS in EECS May 2000, summer 2000 internship with Etec, now at AMAT. • Yongsik Moon, PhD Mechanical Engineering, September 1999, now at Applied Materials, CMP. • Gary Lam, BS Mechanical Engineering, Spring 1997 Applied Materials. • Yaoxi Wu, PhD in Materials Science and Engineering, May, 2000. • Alexei Marakhtanov, PhD student in EECS, summer 2000 internship at Lam • Junwei Bao, PhD student in EECS, 2000 internship at AMD, continuing with Timbre/TEL. • Michiel Kruger, PhD student in ME, summer 2000 internship at Applied Materials. • Jiangxin Wang, PhD student in EECS, June 2001, Lam Research. • Junwei Bao, PhD student in EECS, June 2001, Timbre Tech, now a TEL company. SFR Workshop - Overview
SFR Technology Reaches the Real World… SFR Workshop - Overview
SMART Microfabrication Equipment Lab Overview • Joint EECS/ChE/ME/MSME course at Berkeley available to B.S., M.S., and Ph.D. students • Focus on equipment and processes; existing labs focus on device fabrication (e.g. UCB/EE143) • Emphasis on chemical and physical processes occurring within equipment, including transport, plasma and chemical kinetics, materials science • Offered for 2nd time spring ‘01 to 24 students, up from 16 in ‘00. • Plans to offer course as UC Extension short course, summer ‘01 SFR Workshop - Overview
SMART Equipment Lab Update • 3 new PC’s added in laboratory • Added statistical analysis of experimental data (JMP) • Simulation of chemical vapor deposition reactor (FLUENT) • Vacuum system simulation: pumpdown, conductance, pumping speed. • Plasma simulations • Plan to upgrade plasma experiment to include optical emission spectroscopy and Langmuir probe • Modification to electrochemical deposition experiment to test effects of organic additives on growth rates SFR Workshop - Overview
EE 143 – IC Processing Enrollment Statistics 35 Fall 98 46 in Fall 99 57 in Spring 2001 We will further enhance the training laboratory. We will disseminate course modules to other schools. SFR Workshop - Overview
Enrollment in Semiconductor Manufacturing Courses at Berkeley~ 100 more students a year get exposed to IC Technologies! SMART Lab EE 143 SFR Workshop - Overview
2000-2003 Education Goals • Freshman seminar program at all campuses • One seminar per faculty member per year - 13 seminars/yr • 15 freshmen per seminar • Related to semiconductor manufacturing and the Department discipline • UC Extension summer offering of Equipment Lab • First offering in Summer 2001 • Undergraduate internships at participating companies • At least five positions • Seminar series with industrial speakers? • Biweekly, with emphasis on business and technology SFR Workshop - Overview
Freshman Seminars • Freshman seminar offered fall 2000 in chemical engineering (24 students) • Seminar emphasizes semiconductor industry and semiconductor processes. • ~10 such seminars will be deployed in fall 2001 and spring 2002, reaching ~200 students across 4 campuses. SFR Workshop - Overview
Example of Freshman Seminar TV with cover off - PC/disk drive - Laser printer - Silicon run - Moore’s law - Liquid crystal - Cell phones - MEMS - IC design / fabrication sequence - super clean manufacturing… etc. SFR Workshop - Overview
Internships at Participating Companies • At least five summer undergraduate positions each year • Student applications late in Fall Semester • Advertise among 300+ students taking semiconductor manufacturing courses • Identify positions by end of January • Select and fill positions by end of March • Company Mentors and UC PIs coordinate exchange • Coordinate with EECS BS/MS Internship Program SFR Workshop - Overview
Seminar Series With Industrial Speakers • Create bi-weekly seminar series with invited speakers from the participating companies • Emphasis on business and technology highlights We are now asking/selecting presentation proposals! SFR Workshop - Overview
Today’s Objectives 1. Present and discuss 2000-2001 progress. 2. Bring PIs, students, industrial participants together. Emphasis of presentations shifted to poster session. 3. Collect Feedback from Steering Committee Closed meeting and feedback session this afternoon. SFR Workshop - Overview
Web site, etc. Xuan Nguyen 550 Cory Hall, phone: (510) 643-7542 fax: (510) 642-2739 nguyen@uclink.berkeley.edu Account Management Diane Chang & Dianne Ollila 558 Cory Hall, ERL phone: (510) 642-4043 fax: (510) 642-2739 changd@eecs.berkeley.edu People to Meet and Places to Go Administrative Support Charlotte Jones 558 Cory Hall, ERL phone: (510) 642-1818 fax: (510) 642-2739 cmjones@eecs.berkeley.edu University of California, Berkeley CA, 94720-1770 http://sfr.berkeley.edu Access restricted by password SFR Workshop - Overview
3rd Annual SFR Workshop & Review, May 24, 2001 8:30 – 9:00 Research and Educational Objectives / Spanos 9:00 – 9:45 CMP / Doyle,Dornfeld, Talbot, Spanos 9:45 – 10:30 Plasma & Diffusion / Graves, Lieberman, Cheung, Haller 10:30 – 10:45 break 10:45 – 12:00 Poster Session / Education, CMP, Plasma, Diffusion 12:00 – 1:00 lunch 1:00 – 1:45 Lithography / Spanos, Neureuther, Bokor 1:45 – 2:30 Sensors & Controls /Aydil, Poolla, Smith, Dunn, Cheung, Spanos 2:30 – 2:45 Break 2:40 – 4:30 Poster Session / all subjects 3:30 – 4:30 Steering Committee Meeting in room 373 Soda 4:30 – 5:30 Feedback Session