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Basics of MultiBand OFDM Ultrawideband Technology Semiconductor development and UWB Ecosystem

IEEE CCNC January 5, 2005. Basics of MultiBand OFDM Ultrawideband Technology Semiconductor development and UWB Ecosystem. October 27 th , 2004 Roberto Aiello, CTO r@staccatocommunications.com. About Staccato. Headquarters in San Diego, California WUSB Products

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Basics of MultiBand OFDM Ultrawideband Technology Semiconductor development and UWB Ecosystem

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  1. IEEE CCNC January 5, 2005 Basics of MultiBand OFDM Ultrawideband Technology Semiconductor development and UWB Ecosystem October 27th, 2004 Roberto Aiello, CTO r@staccatocommunications.com

  2. About Staccato • Headquarters in San Diego, California • WUSB Products • Single-chip all-CMOS PHY module • Single-chip all-CMOS MAC+PHY module • Sampling single-chip, all-CMOS, standard-compliant, 480Mbps, in Q1’05. • Veteran management and engineering team • Broadcom, Intel, Nokia, Motorola, National, PCSI, Qualcomm Silicon Wave, Texas Instruments • Proven technical team • Key author and contributor of the standard (MBOA, WiMedia, 1394TA, Wireless USB). • Several key single-chip CMOS radio designs thru production (Bluetooth in iPAQ, etc. .11bag, CDMA – Nokia handsets, etc) • Key innovator of UWB technology: impulse-radio → multiband → multiband OFDM • Blue-chip funding • A-Round (April 2003) - $7.5M by Allegis, Bay Partners, Charles River Ventures • B-Round (March 2004) - $20M by original investors, Intel, InterWest • Key partnerships and alliances established

  3. UWB is spectrum • UWB is about low power transmission and non-harmful co-existence with other services • Unlicensed use sharing licensed spectrum • Radio systems are smarter than 70 years ago • Spectrum management based on old assumptions • Future UWB systems will be different from systems analyzed before rulemaking • UWB spectrum characteristics allow • high bit rate, short range (MBOA) • low power, location awareness (IEEE 802.15.4a) ISM: Industrial, Scientific, Medical U-NII: Universal National Information Infrastructure MBOA: Multiband OFDM Alliance UWB: Ultra-wideband

  4. Source: Ed Thomas, FCC, 2003

  5. MBOA(*) specification summary (*) www.multibandofdm.org

  6. RF CMOS for UWB Using appropriate design techniques and optimizations an ultrawideband multiband-OFDM analog front end can be implemented in low-cost standard CMOS. Standard CMOS Ultrawideband Single-Chip Solutions

  7. 3Q03 1Q04 3Q-4Q04 1Q05 2Q05 4Q05– 2Q06 … IC Samples Boards (PCI, mini-PCI, etc.) Silicon & RF modules Silicon prototypes Silicon Vendors End products Interoperability Testing interop Industry timeline Specs • Reqs • PC • CE • Mobile • W-USB • W-1394 IC Development C&I ProgramComponents Development Platform Multi-Vendor Interoperability CommercialDeployment Standards & Technology Creation EcosystemFormation TechnologyDemonstration(Intel Developers Forum) Corporate R&D Business Groups Engaged Product Development

  8. Staccato Communications • UWB is available spectrum • Ideal for very high bit rate, low power, short range application • Wireless USB standard is set • First UWB high volume application • Interoperable products to market in 2H 2005 • Staccato is first to market with single-chip • All-CMOS radio implementation • Low cost, small size, efficient power consumption • Single-chip enables volume products

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