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“OCP-IP UPDATE and importance of Infrastructure supporting global design standards”

“OCP-IP UPDATE and importance of Infrastructure supporting global design standards”. IPSoC Grenoble 2006, Grenoble, France Ian R. Mackintosh (12-07-06) President, OCP-IP. Agenda. OCP-IP introduction Importance of infrastructure for design standards

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“OCP-IP UPDATE and importance of Infrastructure supporting global design standards”

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  1. “OCP-IP UPDATE and importance of Infrastructure supporting global design standards” IPSoC Grenoble 2006, Grenoble, France Ian R. Mackintosh (12-07-06) President, OCP-IP

  2. Agenda • OCP-IP introduction • Importance of infrastructure for design standards • UPDATE on Infrastructure surrounding OCP-IP • SUMMARY

  3. AGENDA • OCP-IP introduction

  4. Public Membership List • Ecole Polytechnique de Montreal • EDA Consortium • ECSI • EDACafe • eInfochips • Ernst & Young, LLP • Esterel Technologies • European Space Agency • Evatronix • First Silicon Solutions • Flextronics Semiconductor • Forte Design Systems • FueTrek • GDA Technologies • GeoLogic • Georgia Tech University • GreenSocs • Hantro Products Oy • HDL Design House • Hughes Network Systems • IBM • Icera Semiconductor • IDT • Imagination Technologies • Infineon • Inicore • IPTC • ITRI • Jasper Design Automation • Jeda Technologies • Jetstream • Kawasaki Microelectronics • Leiden University • LIRMM • LSI Logic • LTRIM Technologies • Manhattan Routing, Inc. • Marvell • Mentor Graphics • Mercury Computing Systems • Micronas • MIPS Technologies • MIT • MITRE Corporation • Motorola • Nallatech • Nascentric • National Tsing Hua University • NEC • NoBug • Nokia • nVIDIA • Open SysetmC Initiative (OSCI) • OnDemand Microelectronics • Paradigm Works • Philips Semiconductors • Pixelworks • Polarity • ProDesign • Prosilog • PUCRS • Qualcore Logic • QThink • Realtek • Regulus Co., LTD • Royal Institute of Technology • Savant Company • Ricoh • Royal Institute of Technology • sci-worx • Shenzen Graduate School of Harbin Institute of Technology • Si2 • Siemens • Silicon & Software Systems • Silicon Interfaces • Silicon Designs International • Silicon Valley PA, Inc. • Silistix LTD. • SIPAC • Sonics • SpiraTech • SSIPEX • STARC • STMicroelectronics • Stream Processors, Inc. • Summit Design • Synergetic Computing • Synfora • Synopsys • System Design Frontiers • Tampere University of Technology • Technical University of Denmark • TechOnLine • Temento • Tensilica • Teradici • Texas Instruments • Toshiba Semiconductor Group • Tower Semiconductor • TransEDA • TranSwitch • TrustIC Design SRL • TSMC • UFCG • UMC • University of Bologne, Italy • University of British Columbia • Université de Bretagne Sud • University of Houston • UC Berkeley • University of Southampton • VaST • VDEC • Virtual Component Exchange • Virtual Silicon • VSIA • VTT Electronics • Washington State University • White Eagle Systems Technology • WiQuest Communications • Xilinx • Yamaha Corporation • YogiTech • Zuken • 3Plus1 Technology • AccelChip • Accent • Acculent Corporation • Actvision • Advanced Architectures • Aerie Logic • Alcatel • Alpha Data • Amphion Semiconductor • ARC International • Artec Design Group • Arteris • Artisan Components • ASICS World Services • ATI Technologies • Atrenta • Beach Solutions • BlueSpec • Broadcom • Cadence Design Systems • Carbon Design Systems • Carnegie Mellon University • CAST, Inc. • CCLRC • Celoxica • Chip Implementation Center • Cologne Chip • ControlNet India • CoWare • CSIP • DAFCA • Denali • Design And Reuse • Digital Dynamics Corporation • Digital Media Professionals • Dolphin Integration • Duolog • Doulos • eASIC

  5. OCP – Applications Served – 100’s Mu’s Settop Box Printers Mobile Phones Wireless LAN Video Recorder DTV’s Games

  6. OCP-IP Mission “….to promote and support OCP as the completesocket standard that ensures rapid creationand integration of interoperable virtual components.” _____________________ Note: OCP is a standard socket for IP-cores used in block-based SoC design. “virtual components”= IP cores.

  7. Important OCP Facts • ONLY complete and proven SoC socket • Essential for “reuse without rework” • The only path to Plug and Play • NOT tied to any one supplier • Tools/Interconnect/Design style, Independent • Specification freely available

  8. OCP SOCKET Interface Target Bus A SOCKET IS NOT A BUS INTERFACE OR Interface Target Bus B IP Core Core-centric Interface Note: OCP separates the computational IP core from its communication activity.

  9. Charter • Governance of OCP Specification • Evolution and enhancement • Compliance testing and certification • Community source products administration • Specification • Tools, support, services, etc. • Promotion of the standard • Non-profit operation • HQ Portland, Oregon

  10. Membership Structure • Governing Steering Committee (“GSC”) • The Governing BoD • Sponsor • Eligible for Working Groups • Community • Free Community Source Products Note: Sponsor fees $25K, Community $10K per year ($1K for company with annual revenues < $10million)

  11. University Program • Launched January 2003 • World-leading participants • Suitable for undergraduates and post-graduates • Free software tools, support and training • Research Copies of OCP Specification • Many, many hundreds of universities hold copies worldwide

  12. OCP-IP Benefits are Compelling Industry-wide Breadth of Standards and Specifications • Successful interface adoption requires depth • OCP-IP provides this depth Interface Specification Focused Depth Continuous Enhancements Implementation Tools High-level APIs Training Programs Compliance Program Certification “Plugfests” Technical Support

  13. OCP-IP in Asia: Supporting Global Design • Multiple, existing local-language websites: • Chinese, Japanese and Korean • Reach homepages via www.ocpip.org • Technical support in Japanese, available now • Contact jptech@ocpip.org • OCP and CoreCreator Training in Japanese, available now • Contact admin@ocpip.org • Expansion planned into India, CY 2006 • Several Indian companies already hold membership with OCP-IP

  14. Governing Steering Committee (GSC) • Texas Instruments- major semiconductor/wireless platform provider • Nokia - leading telecom player • Toshiba Semiconductor Group- major semiconductor and ASIC supplier • Sonics- inventor of plug-and-play Micronetworks

  15. AGENDA • Importance of infrastructure for design standards

  16. Infrastructure “Theory” • The infrastructure surrounding (say) a standard evolves through distinct phases with well-defined characteristics • Foundation – relating to processes • Emergence – from existing processes • Growth – from attained critical mass • Decline – natural life-cycle

  17. Infrastructure for Design Standards • What is Infrastructure? • The surrounding services, tools, technology, products, support and information that complement the standard • Importance of Infrastructure: • Increases VALUE of Standard • SIMPLIFIES adoption: less internal work! • Maximizes resource SHARING • Lowers COSTS • Commoditizes EXPERT knowledge, etc.

  18. Why Do We Care About Infrastructure? • Simplifies adoption decision • Accelerates usage • Reduces risk of standard fragmentation • Maximizes industry re-use efficiency • Grows markets

  19. S P P Impact of Infrastructure on Industry: Model 1 NATIVE WHOLE INFRASTRUCTURE VALUE ADDED Proprietary/Closed Proprietary/Closed Proprietary/Closed Best-of-Breed/Open P Corporate Growth (Product-centric) Industry Growth (Standard-centric) Source: Mackintosh Model

  20. Impact of Infrastructure on Industry: Model 2 Available Market as Function of Corporate Strategy $ TAM Infrastructure Whole Corporate Strategy Value Added Native Time Source: Mackintosh Model

  21. A Proven Method for Driving Infrastructure • Unless you have a “lock” on compelling and essential technology you will need… • A NEUTRAL community: sharing contributions • Focused activity: • Central organization – neutral! • Resource commitment – different ways • Structure – working groups • Communication – promotional, too!

  22. Example Organizations in Electronic Design Space • The familiar protagonists: • IEEE • OCP-IP • PCI • Si2 • SPIRIT • USB • VSIA…, etc. • Representing diverse: • Methods of standards creation • Time-to-market • Success • Organization and operational structures, etc.

  23. Communicating Infrastructure: OCP-IP Example View @ www.ocpip.org

  24. Communicating Benefits: OCP-IP SLDWG Output Checkers introduced • Regular Releases • Features constantly being added • Backward compatibility maintained • Support for OCP-IP delivered • Already planning future releases. TL3 channel introduced Examplespackagereleased OCP-IP 2.1 supported 2.1.2a 2.1.2 2.1.1 OCP-IP 2.0 supported Monitors introduced 2.1 Adapters introduced 2.0.3 2.0.2 2.0.1 2.0 1.1.1 1.1 Sept 2003 July 2003 Aug 2004 Dec 2003 Oct 2004 March 2006 April 2006 Feb 2004 May 2004 Feb 2005 July 2005 May 2006

  25. Summary of thoughts about Infrastructure • Standards require infrastructure to proliferate • Mature industries are centered around standards • Numerous and diverse pitfalls normally compromise a standard’s success • Adoption of standards is very mixed in the electronic design space- we are beginning to make progress! • Liabilities standards might encounter can be predicted and minimized by infrastructure • There is little adoption without actual AND well-communicated VALUE

  26. AGENDA • UPDATE on Infrastructure surrounding OCP-IP

  27. OCP-IP Working Groups (WGs) • Vision • Annual planning Jan ‘07 • Marketing • Specification • Cache Coherence • System-Level Design • Verification • Debug • NoC Benchmarking …all groups meet weekly or bi-weekly

  28. Individual Working Group updates • Specification • OCP 2.2 NOW in member review till Dec 11th • Four NEW Features, security profile and integrated compliance section complete v2.2 • Get copy and provide feedback, asap! • CACHE Coherence • Addressing needs of ALL processor-types (not just embedded!). • Two schemes in play: • Local processor clusters (“snoopy-style” scheme- has products in development now) • Physically distributed processors (more complex- 2H07)

  29. Individual Working Group updates (contd.) • System Level Design • High quality, well-documented regression-suite driven System C TLM package shipping with years of on-schedule, road-mapped releases • Many1000’s of channels shipped over several years: Released v2.1.3 Oct.2006 with interoperability upgrades enhancing system-level modeling productivity • Expect OCPv2.2 alignment soon after official release, in early 1Q07 • Strong collaboration with OSCI is maintained • Verification • Compliance section integrated with main spec this QTR. • Formal assertions and Functional checks (v2.2) in Member Review –completing Dec.11th

  30. Individual Working Group updates (contd.) • De-bug • Goal: produce unifying OCP-based De-bug spec • Collaborating with Spec. WG: Expect De-bug spec DRAFT 1H07. • Approach is fully inclusive to groups, products/workers in this space • NoC benchmarking • Initially, primarily University-based (UBC, CMU, WSU, Tampere, KTH) team quantifying the challenges and defining benchmarking schemes • White Paper nearing completion, NOW: drive dialog • Expect 1H07 seminars and events at conferences: watch website at www.ocpip.org

  31. Newer WG’s: Focus on Heterogeneous Processor, Multi-Core Systems • Cache Coherence • Currently refining directory-based portion of protocol as well as interconnect model • Debug • Exploring Draft Specification to unify autonomous debug tools. Collaborating with other industry alliances working in this area • NoC Benchmarking • Multi-university collaboration underway to establish benchmarks more relevant to measuring performance in heterogeneous, multi-core designs

  32. Membership Benefits Matrix

  33. OCP Membership Benefits

  34. OCP-IP Promotional Benefits • Access to OCP-IP endorsed promotional activities such as tradeshows, technology pavilions, presentations, etc. • Company listing, URL and logo on the member roster • Collaboration or support on article placement • Promotion in OCP-IP’s libraries • IP: www.ocpip.org/socket/libraries/ip • EDA Products:www.ocpip.org/socket/libraries/eda • Related Services:www.ocpip.org/socket/libraries/services • Newsletter feature • Joint press releases

  35. Organizational Growth • OCP-IP plan Mar ‘01 • Formal founding Jun ‘01 • Web site/products/services Sep ‘01 • “GSC” BoD Formation Oct ‘01 • Public announcement Dec ‘01 • Official OCP 2.0 Release Sep ‘03 • Official OCP 2.1 Release Mar ’05 • OCP 2.2 Member Review Q4 ‘06

  36. AGENDA • SUMMARY

  37. SUMMARY * When standards are successfully deployed, industries and markets experience their most prolific growth phases * Design standards are only adopted when they have high value and are supported by valuable infrastructure * OCP-IP offers a high-value and extensive infrastructure that supports a large and expanding, global membership base * Many FREE individual OCP-IP membership deliverables ensure hundreds of $1000’s in COST savings alone, in addition to growing market opportunities (OCP-based libraries, PSL properties, SystemC channel/TLM’s, etc.)

  38. OCP-IP Membership Join OCP-IP now by contacting: admin@ocpip.org OCP-IP Association 3855 SW 153rd Drive Beaverton, OR 97006 Tel: 1-503-619-0560 Fax: 1-503-644-6708

  39. Becoming an OCP-IP Member • Get membership application:www.ocpip.org/data/OCPIP_Membership_Application.pdf • Complete application form (takes two minutes!) • Fax completed application to 1-503-644-6708

  40. “OCP-IP UPDATE and importance of Infrastructure supporting global design standards” IPSoC 2006, Grenoble, France Ian R. Mackintosh President OCP-IP

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