OCP-IP Introduction

1. OCP-IP Introduction Ian R. Mackintosh President, OCP-IP

2. S P P OCP-IP Industry Vision NATIVE WHOLE INFRASTRUCTURE VALUE ADDED Proprietary/Closed Proprietary/Closed Proprietary/Closed Best-of-Breed/Open P Corporate Growth (Product-centric) Industry Growth (Standard-centric) Source: Mackintosh Model

3. Public Membership List • EDACafe • eInfochips • Esterel Technologies • First Silicon Solutions • Flextronics Semiconductor • FueTrek • GDA Technologies • GeoLogic • Hantro Products Oy • HDL Design House • Hughes Network Systems • Icera Semiconductor • IDT • Imagination Technologies • Infineon • Kawasaki Microelectronics • Leiden University • LIRMM • LSI Logic • LTRIM Technologies • Manhattan Routing, Inc. • Mentor Graphics • Micronas • MIPS Technologies • National Tsing Hua University • NEC • NoBug • Nokia • nVIDIA • Open SysetmC Initiative (OSCI) • Paradigm Works • Philips Semiconductors • PUCRS • ProDesign • Prosilog • Qualcore Logic • QThink • Royal Institute of Technology • Shenzen Graduate School of Harbin Institute of Technology • Savant Company • Si2 • Siemens • Silicon & Software Systems • Silicon Interfaces • Silicon Designs International • Sonics • SpiraTech • STARC • STMicroelectronics • Summit Design • Synergetic Computing • Synfora • Systems • Synopsys • Tampere University of Technology • Technical University of Denmark • TechOnLine • Tensilica • Texas Instruments • Toshiba Semiconductor Group • Tower Semiconductor • TransEDA • TranSwitch • TSMC • UFCG • UMC • University of British Columbia • University of Houston • UC Berkeley • VaST • Verisity • Virtual Component Exchange • Virtual Silicon • VSIA • VTT Electronics • White Eagle Systems Technology • WiQuest Communications • Yamaha Corporation • YogiTech • 3Plus1 Technology • AccelChip • Accent • Acculent Corporation • Advanced Architectures • Alcatel • Amphion SemiconductorARC International • Artec Design Group • Artisan Components • ATI Technologies • AXYS Design Automation • Beach Solutions • Bitboys • Broadcom • Cadence Design Systems • CAST, Inc. • Chip Implementation Center • ControlNet India • CoWare • DAFCA • Denali • Design And Reuse • Dolphin Integration • Duolog • eASIC • Ecole Polytechnique de Montreal • ECSI

4. OCP-IP Mission “….to promote and support OCP as the completesocket standard that ensures rapid creationand integration of interoperable virtual components.”

5. Important OCP Facts • ONLY complete and proven SoC socket • Essential for “reuse without rework” • The only path to Plug and Play • NOT tied to any one supplier • Tools/Interconnect/Design style, Independent • Specification freely available

6. OCP SOCKET Interface Target Bus A SOCKET IS NOT A BUS INTERFACE OR Interface Target Bus B IP Core Core-centric Interface

7. Charter • Governance of OCP Specification • Evolution and enhancement • Compliance testing and certification • Community source products administration • Specification • Tools, support, services, etc. • Promotion of the standard • Non-profit operation • HQ Portland, Oregon

8. Membership Structure • Governing Steering Committee (“GSC”) • The founding BoD • Sponsor • Eligible for Working Groups • Community • Free Community Source Products Note: Sponsor fees $25K, Community $10K per year

9. University Program • Launched January 2003 • World-leading participants • Suitable for undergraduates and post-graduates • Free software tools, support and training

10. OCP-IP Benefits are Compelling Industry-wide Breadth of Standards and Specifications • Successful interface adoption requires depth • OCP-IP provides this depth Interface Specification Focused Depth Continuous Enhancements Implementation Tools High-level APIs Training Programs Compliance Program Certification “Plugfests” Technical Support

11. Extensive OCP Infrastructure Validation Suite Specification Test / Packaging Tool Data C-Level API Control VCI Bridges Test Training Programs Technical Support Only OCP Socket has ALL these Silicon Proven Commercially Adopted Bus/Interconnect Independence Self Certification Program Further Community Source Tools

12. Governing Steering Committee (GSC) • Texas Instruments- major semiconductor/wireless platform provider • Nokia - leading telecom player • STMicroelectronics- major semiconductor supplier • Toshiba Semiconductor Group- major semiconductor and ASIC supplier • Sonics- inventor of plug-and-play Micronetworks

13. OCP-IP Working Groups (WGs) • Vision • Marketing • Specification • System-Level Design • Memory Semantics • Verification …all groups meet weekly or bi-weekly

14. OCP Benefits • Bus/interconnect independent (vendor neutral) • ONLY complete socket • Industrial-grade tools environment • IP core-centric (key to true reuse)

15. Membership Benefits Matrix

16. VSIA/Participant Membership Benefits

17. OCP-IP Promotional Benefits • Access to OCP-IP endorsed promotional activities such as tradeshows, technology pavilions, presentations, etc. • Company listing, URL and logo on the member roster • Collaboration or support on article placement • Promotion in OCP-IP’s libraries • IP: www.ocpip.org/socket/libraries/ip • EDA Products:www.ocpip.org/socket/libraries/eda • Related Services:www.ocpip.org/socket/libraries/services • Newsletter feature • Joint press releases

18. Organizational Growth • OCP-IP plan Mar ‘01 • Formal founding Jun ‘01 • Web site/products/services Sep ‘01 • “GSC” BoD Formation Oct ‘01 • Public announcement Dec ‘01 • OCP 2.0 Release Candidate Feb ‘03 • Official OCP 2.0 Release Sep ‘03

19. OCP-IP Membership Join OCP-IP now by contacting: admin@ocpip.org OCP-IP Association 5440 SW Westgate Drive, Suite 217 Portland, Oregon 97221 USA Tel: 1-503-291-2560 Fax: 1-503-297-1090

20. Becoming an OCP-IP Member • Get membership application:www.ocpip.org/data/OCPIP_Membership_Application.pdf • Complete application form (takes two minutes!) • Fax completed application to 1-503-297-1090

21. OCP-IP Introduction Ian R. Mackintosh President, OCP-IP