High energy Ions From this direction

23. R3B Si Tracker Layout Optimised for tracking of high-energy protons to select events from QFS reactions e.g. (p,2p), (p,pn)… Calorimeter Vacuum Chamber High energy Ions From this direction 3 Layers of Silicon Liquid Hydrogen Target Gold Foil surround (Not Shown)

24. Shared Si module support PCB. No active parts, routing only (Probably 1 annular shape PCB handling all 30 modules) Feed through connectors. 68 way. Diagram to show how a single Si module (ladder) is connected to the Si support module and feed-throughs. Rigid PCBs with flex tail 1 per side of module with Al cooling plate between ASICs (12 or 16 per side of each module) Buffer board including LVDS buffers, power regulation and signal isolation. • Connector with all connections for up to 16 ASICs on one side of Si module. 150 pins per connector: • 4 diff pairs for serial data • 1 diff pair for TS clock • 3 single ended for I 2C • 1 wired OR for FT OR • 1 diff pairs for Val/gate • 1 single ended for reset • 4 pins ladder address (3 levels) • 8 pins for 2x PT100 • 1 pin for Si bias voltage/return • 64 Ground pins 4 per ASIC • 32 Power pins 2 per ASIC (A & D) • 24 Extra grounds Silicon Power connection for ASICs and Si bias (common for all modules) • The R3B Si tracker comprises 30 double sided modules like the one shown here: • Outer layer 12 modules (16+16 ASICs each) • Middle layer 12 modules (16+16 ASICs each) • Inner layer 6 modules (12+12 ASICs each)

25. White Rabbit timing DAQ in Air Detectors in Vacuum Si Inner CALIFA Timestamp & coincidence links FMC i/f FPGA ASIC Clk & trig i/f enet Si Inner ASIC x6 FMC i/f FPGA ASIC enet ASIC 3x uTCA crates Si Middle Slow Control FMC i/f FPGA ASIC enet ASIC Si Middle x12 10G Switch FMC i/f FPGA ASIC DAQ PC(s) enet ASIC Si Outer FMC i/f ASIC FPGA 10G Switch To R3B DAQ Si Outer ASIC enet x12 FMC i/f ASIC FPGA ASIC enet 120k strips 912 ASICs 30 uTCA FEE cards + switches and clock card R3B Si Tracker (NUSTAR)

26. R3B Si Tracker Sensors Outer detector assembly (300µm) Plan to use the same mask set for the green detector of the outer and inner modules to reduce cost. In total 4 different masks are needed. Inner detector assembly (100µm)

27. Four different geometries (A, B, C, D), and thickness of 300 um (outer ring) and 100 um (inner ring). Number of strips ranges from 876 in D(100) detector to 2048 in C(300). Silicon sensors A B C 300 um 50.5 um strips in stereo configuration of p and n side D B 100 um

28. Three ABC mechanical pieces (single sided sensors) assembled on a PCB frame. This is being used to perfect the procedure to bond strips together. Adjusting bonding parameters on our sample pieces has allowed us to achieve good wire bonds with sufficiently good pull strengths. Alignment and Bonding

29. R3B Si Tracker Status - 19 April 2013 • Main Highlights: • First ASIC prototypes delivered and testing system constructed • Tests of ASIC so far show they are functioning • Readout tests of 300um prototype Si finished, 100um ongoing • Approval given to Micron for production of 300um Si sensors • Prototype flex cable received and assembled • Assembly procedure of ASICs to Flex trialled • Prototype ASICs bonded to flex cable and awaiting bonding • Production of prototype Si ladder underway • Production of prototype readout underway • Final R3B PDRA interviews held at Daresbury yesterday (18 April 2013) • Conceptual design for a target mechanism done • Mechanical design concentrating on supporting the Si tracker structure and vacuum chamber, insertion and removal, etc. • Status will be reported at R3B Collaboration Meeting in GSI in May.

30. ASIC chips mounted on Flex board Si C fibre structure Cu cooling blocks Coolant ~-20° C flowing in Cu pipe Dave Seddon, Liverpool

33. Day 3

34. Day 3 - Section

35. Prototype R3B Si Tracker Modules • Work underway to determine how to align • the sensors to be wire bonded together • Hoping to be able to use cut edges of the • detectors if good enough quality and relationship • with Fiducials marked on Si well established. • Work also underway on Si test assemblies • Bonding jigs built to test gluing and wire bonding with • ‘mechanical’ Si pieces (300 um so far). • Liverpool and Daresbury technicians training in • LSDC. • Confident that sensors can be wire bonded • successfully. • Next steps • Wire bonding of ‘real’ R3B Si sensors and readout • with VA1TA ASIC test boards (before R3B ASIC PCBs • available) planned for end of January 2013. • Plan to build ‘mock-up’ detector module trial assemblies • with 300um glass and glass blank ASIC chips.

36. £155k (+VAT) For masks and 14 sensors R3B Si Tracker Prototype Sensors 13 (+1) useable R3B Si prototype sensors from Micron since summer 2012. All 4 designs (A, B, C, D) and 2 thicknesses (100um and 300 um). All tested in Liverpool LSDC against specifications.

37. Goal: to assembly one detector module to test the detector performance as well as the production process. The R3B Si prototypes ASICs silicon sensors PCB mounting frame

38. Three mechanical pieces (single sided sensors) assembled on a PCB frame. This is being used to perfect the procedure to bond strips together. Alignment and Bonding At each corner, use the SmartScope’s feature finder to identify the edges, and find where these lines intersect to define the corner.

39. Three ABC mechanical pieces (single sided sensors) assembled on a PCB frame. This is being used to perfect the procedure to bond strips together. Adjusting bonding parameters on our sample pieces has allowed us to achieve good wire bonds with sufficiently good pull strengths. Alignment and Bonding

40. Full Flex PCB completed PT100 ASICs Fit here

41. All three items viewed from above. The black raised ASIC vacuum pads can just be seen on the vacuum jig underside. 200um spars in laser cut stencil to separate ASICs.

42. ASIC-Flex Assembly Procedure: I

43. ASIC-Flex Assembly Procedure: II

44. ASIC-Flex Assembly Procedure: III • Testing of chip assembly can start now

45. Flex during attachment to copper cooling plate Attached with double sided thermal adhesive coated copper tape

46. ASIC/Si test box – prototype detector Copper cooling plate(s) fixed to FR4 PCB ready to accept Flex boards.FR4 board waiting for silicon to be fitted and wire bonded.