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XIS meeting agenda

XIS meeting agenda. S0 door trouble Hayashida AE/TCE0 TCE card trouble Hayashida DE test status at MHI Dotani FPGA failure & DSP 2-bit error countermeasure Ozaki Calibration at Kyoto/Osaka Noise level measurement Hayashida CTI measurement with CI Tsuru

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XIS meeting agenda

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  1. XIS meeting agenda • S0 door trouble Hayashida • AE/TCE0 TCE card trouble Hayashida • DE test status at MHI Dotani • FPGA failure & DSP 2-bit error countermeasure Ozaki • Calibration at Kyoto/Osaka • Noise level measurement Hayashida • CTI measurement with CI Tsuru • How to use CI MIT • Possible improvements in FI resolution Kissel • BI CCD status MIT • AE/TCE initialization sequence Kissel • Ground & Flight Calibration of BI sensor Matsumoto • SWG calibration targets Matsumoto • TCE board status MIT • Schedule of TCE card replace Hayashida • Schedule of AE/TCE vibration test Dotani • Schedule of the satellite and XIS Dotani

  2. Final Integration Test Schedule Mechanical, Electric 2004 XIS-related Carry-in, Appearance check, Integration, etc. Electric tests of DP, DHU, etc. April Overall tests of power system. Overall tests of RF system (telemetry, command, etc). (Golden week, 4/29–5/5) Carry-in XIS-S (5/14) Overall tests of AOCS. May Overall tests of XIS, HXD. Sensors are not installed on the baseplate yet. Satellite baking (5/28–6/7) XIS-S, AE/TCE may not be baked. Overall tests of XRS. June I/F check with rocket (6/16–29) (IHI Aerospace at Tomioka, Gunma) Install XIS, HXD (7/5). Overall tests of AOCS. XIS, XRS, HXD tests. July Function test: detailed. Running test. Function test: nominal (EOB extension).

  3. Final Integration Test Schedule (cont.) Mechanical, Electric 2004 XIS-related (Summer holidays, 7/31–8/8) Preparation for TV. Aug. Thermal vacuum test (8/16–25). Disassemble side panels. XIS-S is temporarily removed. Install XRS dewar. Sept. Running test (rehearsal of mission operations, 9/15–20). Preparation for the vibration tests. Overall tests of the power system. Oct. Function test: nominal (EOB extension). Satellite vibration test (10/25–11/5) Function test: nominal (EOB extension). Nov. Cool solid Ne; remove pick-ups; alignment measurement, etc. Function test: detailed. Cool solid Ne; Alignment, weight, MOI measurements, etc. Dec. Open to press. Ship the satellite to USC (ex-KSC; 2005/1/7).

  4. XIS Replacement Plan April May June July MIT BI1 BI0 ISAS FI0,1 BI0,1 Final Int. test Baking Common Inst. Rocket I/F S/S test, storage XIS test AE/TCE01 Install XIS AE/TCE Vib. test FI2,3 backup FI0-3 BI0,1 Kyoto Osaka AE/TCE23 AE/TCE01, 23 Calibration Calibration

  5. Progress of MPU tests at MHI 2003 2004 December February January … Burn-in FPGA replace PCB coating Assembly Function test Shock (HF) Thermal Vacuum Shock (LF) MPU Vibration Function test All the test results were fine.

  6. Progress of PPU tests at MHI 2003 2004 December February January … Burn-in PCB coating Assembly Function test Thermal Vacuum Shock (HF) Shock (LF) Vibration PPU01 Function test All the test results were fine.

  7. Progress of PPU tests at MHI 2003 2004 December February January … Burn-in PCB coating Assembly Function test Shock (HF) Thermal Vacuum Shock (LF) Vibration PPU23 Function test All the test results were fine.

  8. AE/TCE Vibration Test Plan April 2004 23 Fri Spot bonding of AE/TCE screws. 24 Sat Function check of AE/TCE. 25 Sun Set-up Z-axis, function check. 26 Mon AT level 27 Tue Orientation change of the machine. X-axis, function check, Y-axis, function check. 28 Wed Withdrawal & Reserve.

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