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Report from the SiLC Collaboration (generic R&D group for ILC Silicon. Many activities geared towards large-area -strip system Migration of front-end chip into 0.13 m; testing undereway
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Report from the SiLC Collaboration (generic R&D group for ILC Silicon • Many activities geared towards large-area -strip system • Migration of front-end chip into 0.13 m; testing undereway • In-situ alignment schemes, including semi-transparent detectors and frequency-scanned interferometry (a la ATLAS SCT; see next slide) • SiLC Large Prototype • Sensors: Developing 50 m pitch on 6” wafers; exploring thinning of sensors • Mechanics: Structures and tooling for large prototype Several modules under beam test this week
Frequency-Scanned Interferometry Yang, Nitz, Jung, Riles, U. of Michigan Combining information from two independent scans at different frequencies reduces sensitivity to environmental conditions Achieve sensitivity of 200 nm [Nucl. Inst. & Meth. A575, 395(2007)]