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1. 1 Cross-sectioning and Parallel lap Buehler Ecomet 3 grinding wheel
Various grit sanding with suspended particulate polishing
Experience with fragile sensitive devices
Parallel lapping of die, PC boards, solar cells, etc
Direct inspection of bumps, solder balls, die attach
Solar, medical devices, ICs, LEDs, PCB boards, MEMs, disk drive
2. 2 Cross-sectioning