DDi Group Strengths

1. DDi Corp. is a leading provider of time-critical PCB manufacturing and assembly services to OEMs and EMS providers Strategically positioned at the front-end of customer product development and innovation Multiple production facilities based both in North America and Europe positioned to respond to customer demands Technological leadership in manufacturing. 2,200 employees worldwide Comprehensive and flexible product and service capabilities. Over 2,500 customers worldwide DDi Group Strengths

2. =  EMS Providers Customers Competitors DDi Group Diversified, Blue Chip Customer Base • Strong Customer Relationships • Approximately 90% of quarterly revenuefrom existing customers • End-Market Diversity • Limited Customer Concentration Risk • No customer >10% • Top 10 customers represent 34% of revenues versus 50-60% for EMS companies End Markets Medical Computer,Peripheral Communications Other: Defense, Industrial, Aerospace EMS Providers OEMs

3. DDi Group Established International Platforms • Europe • Established presence in 1997 • Europe currently accounts for 30% of Group business • Adding customers and expanding end-markets • Recently completed add-on acquisition in the UK to expand international platform and range of services • Canada • Established Northeastern footprint • Penetration of new markets

4. Ddi Group Global Locations North America United Kingdom French Sales Offices

5. DDi Europe Time for DDi

6. DDi Europe

7. DDi Tewkesbury DDi USA Customer Customer DDi Technologies DDi Precision DDi Marlow International Where we sit within the group DDi

8. DDi Technologies Time for DDi

9. Manufacturing Capability • 7,000 m² facility • SMT and Conventional assembly • Low to medium volume production • On site inspection and test • Dedicated Fastrack facility • (Prototype, time critical service) • Project management • Complete turnkey engineering design • Design to assembly in 3 - 10 days • QFP & µBGA placement to 0.3mm pitch • X-Ray & Environmental stress screening facility on site • Approvals including ‘List X’ • Standard practice to manage sensitive information

10. Technical Strengths • DDi Technologies is a well established, full capability, low volume, high value added contract manufacturer • The company operates from a new 7,000 m² purpose built facility in Calne and employs 190 people (115 direct) • Dedicated in-house Fastrack facility enables quick turn prototype production • Historically, the company has focused on the aerospace, military and industrial markets

11. Technical Strengths • The company's reputation and new facilities now allow it to broaden its customer base whilst retaining its focus on low volume, value added business • DDi Technologies offers design and procurement through to the delivery of engineering prototypes, pre-production and low volume assembly including final equipment build and full functional test. • This unique group capability enables DDi Technologies to become a true partner with its customers

12. Reputation

13. Procurement • Project procurement (buy it – make it) - Fastrack • Project procurement to cost targets • Repeat Product procurement i.e lowest cost, contracted procurement • Full project procurement • Consignment Stock and Management • Specialised procurement • Full estimating – Project costing • Component sourcing and obsolescence • Dedicated resource (customer specific) • Project resource – Project based • Estimating resource

14. Materials and Inventory Management • Sage CS3 ERP System • Tetra 2000 MRP • Secure Stock Holding and Rotation (automation) • Bonded Stores • Dedicated Kitting Area’s • Consignment Stock • Kan-Ban capability • Partnerships with Key Distributors • Leverage Buying from Multi-customers • Supported Factory Buys

15. Project Management • NPI Process • Transfer strategy • Focus on key processes • DDi resources at Customer site • Last-off & First off checks to validate processes and ongoing control of key parameters • Disciplined Project management (MSProject) and Review mechanism • Utilise existing experts to minimise risks through transfer and settling in period • Risk management and contingency plans

16. Services available Floor 1 Services Floor 2 Services Front End Engineering Fastrack Box Build Assembly SMT Assembly Final Assembly T/H Assembly Test

17. Manufacturing Process

18. PCB Assembly Capabilities • Configured Line • Dek 265 Fully Auto Printer, High volume (50K/hr) - Siemens Is-place HS50/F5 + 10 Zone BTU Pyramax Oven • Configured Line • EKRA E5 Fully Auto Printer, Medium - high volume (20K/hr) - Mydata MY15+ 10 Zone BTU Pyramax Oven • Configured Line • Dek 248 + Vision, Medium volume (15K/hr) – 2 x Tenryu + 5 Zone Sirocco Oven • Configured Cell • Dek 248 + Vision, Low - medium volume (6K/hr) - 4 x Mydata TP9 2 x 6 Zone Surf

19. PCB Capability • To 0.4mm BGA placement and rework capability (advanced @ 0.25mm) • QFP placements to 0.3mm pitch • Full off-line machine set-up using Valor • Water soluble, no-clean, lead free and HMP chemistries • 4 x Flow line conventional assembly (PAF) • 2 wave solder machines • Ultrasonic Co-Solvent Cleaning System • Full ESS on site (with Nitrogen) • Conformal Coating on site (Spray & Dip)

20. In the last 12 months DDi have placed: over 3 million 0402 components Over 45,000 BGA’s 20,000 less then 0.8mm pitch Technology statement

21. Quality Inspection Processes • Automated Optical Inspection (AOI) x 2 • Optical inspection • 3D X-ray (BGA) Inspection

22. Fastrack (Prototype Service) DEK249 Paste Printer Stencils available in a 4-48 hour turn round from receipt of PCB data BTU Vip 98 Reflow Oven Single and Double sided Precision zone control (5 chambers) Inspection Fully Automated Optical Inspection (AOI) 3D XRAY inspection for BGA devices Ersascope (Under BGA inspection) Visual Inspection Vision VS7 smt inspection system JVC Digital colour 12.7mm colour video camera Fixtureless Tester 2 x Takaya 9400 Flying Probes Off line programming 0.3mm and BGA Dedicated Resources Process Engineers Pick & Place Operators Leaded Assemblers Inspectors AOI / X-ray Engineers Flying Probe Test Engineers Continual training with IPC approved schemes Mydata 12 Pick & Place 20,000 placements per hour Min case 0201 Min placement 0.3mm

23. Fastrack Capability 2 x Mydata 12 Pick & Place 20,000 placements per hour Min case 0201 Min placement 0.012" (300 m) Diagnosis AOI m/c 3D X-ray (BGA) Inspection 2 xDEK249 Paste Printer Vision Alignment Reflow Oven BTU VIP 98 7 zone

24. Fastrack Turnaround 2 Day PCB Manufacture 2 Day PCB Assembly Data Received Pick and Place Program created AOI program created Flying Probe program created SMT Stencil ordered PCBs Received Kit received and checked Stencil delivered Kit loaded to Pick and Place machine Test and Despatch Day 3 Day 1 Data received & verified Print inners Etch Bond Drill Copper plate Soldermask Ident Test Final inspection Despatch Day 2 Day 4 Day 3

25. Our DFM/NPI Strategy • To be able to provide our customers:- • A Virtual Prototyping system for zero defects, first time, every time • A Reduction in pre-production (CAM) engineering cycle time by 50-60% (Reduction in cost passed to our customer) • Full job reverse engineering and manufacturability analysis • Automated DFFabrication, DFManufacture and DFTest on every board, every time • Automated creation of all machines programs Print, P&P, AOI, Test) and accurate assembly DWG's (Assy Aids, Hand Assy, No fit) • Pre and Post manufacture First article reports • Enhanced responsiveness to customer needs in Product Quality, Manufacturability and Testability. • Fully engineer job for manufacture inc job pack

26. Solutions in Place at Technologies Valor TRILOGY 5000 s/w DFx Analysis Automated Programming Comp Library Optimisation Outputs Aiges Equinox Optimisation s/w M/c line balancing M/c placement optimisation Common Loading plans Tetra CS3 ERP System Factory wide integrated Erp system Aiges Circuitcam s/w Off line m/c programming Mydata Assembly aids and documentation Off-line access to m/c libraries Siemens Si-Place Pro in Q1 2002 Off line m/c programming Siemens Assembly aids and documentation Off-line access to libraries M/c data collection SPC Myriad Engineering Viewer View all documentation viewer

27. Genesis 2000 & Enterprise 3000 CAD/DFM TOOL DDi USA Genesis 2000 Valor Universal Viewer FABRICATION CAM DDi Europe Fabrication Trilogy 5000 ASSEMBLY CAM DDi Europe Assembly Single Data Format

28. General 20 dedicated test engineers Total test experience 380 years RF or RF/Digital solutions Programming for ATE and FICT platforms Functional test covering: Precision analogue measurement, Programmable synthesis, Programmable loads, Multi-channel digital sampling, Static, Simulation, Dynamic, Diagnostic, Boundary Scan, Go/Nogo, IEEE compatible, Communications ICT programs Manufacturing defect analysis 18 off ICT / FICT capital equipment Offline programming Software conversion packages Test strategy / solution definition DFT reviews Technical Capability (Test) • The RF factor • 30 years combined RF experience between 5 employees across several projects • Create test solutions for low / medium volume RF or RF / Digital products • Partnered with clients for complex Digital / RF products up to 3.6 GHz • Working closely with RF vendors, specifically Anritsu to provide low to medium volume test solutions • Partnered with IFR to provide Radio Test Sets to replace current test equipment reducing test overheads

29. DDI Programming Capability

31. ATE TEST PROGRAM BENEFITS: -

32. W K 3900 Combinational ATE

33. PTS Minimum Requirements Recommendation

34. PTS Minimum Requirements Recommendation

35. Takaya 9400 FICT ATE

36. Peter Stoneham Director of PTS Mark Johnson Charles Phiri Mark Horton ATE Programming Manager Special Projects Snr Engineer Repairs Manager Mary Stanley Marina Thomas Special Project Engineers Bill Navarette Fabmaster Engineer Snr Engineer NPI David Slade WK 900/3900 Programmer Repair Staff ATE Programmers PTS – Programming and Test Solutions Nebeel Sulaiman Takaya Programmer Takaya Technician