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— Test board for CBM01B2 baby detectors —

Microstrip detector testing at GSI. — Test board for CBM01B2 baby detectors —. Anton Lymanets & Johann Heuser. CBM collaboration meeting GSI, 27 February 2008. Detector CBM01B2. 256  256 orthogonal strips; 50.7 µm pitch; AC readout; 285 µm thick Dimensions:

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— Test board for CBM01B2 baby detectors —

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  1. Microstrip detector testing at GSI — Test board for CBM01B2 baby detectors — Anton Lymanets & Johann Heuser CBM collaboration meeting GSI, 27 February 2008

  2. Detector CBM01B2 • 256  256 • orthogonal strips; • 50.7 µm pitch; • AC readout; • 285 µm thick • Dimensions: • 1.56 1.56 cm2

  3. Let’s make a test board • test global detector characteristics • e.g. IV, CV • access both detector sides • contact a few strips for detailed measurements, including n-XYTER readout • do all this as quickly and as simple as possible

  4. Test board • Read-out CBM01B2 sensor (“small baby”, 50.7 μm pitch) • Read-out 32 strips in the middle of sensor on both sides • Ultrasonic wedge bonding • PCB → sensor • Ordinary line density • Two test zones 1 cm2 each for • adjustment of bonding head • Standard ERNI 114805 • connector to n-XYTER kit Advice from: H. Deppe (bonding, PCB)R. Lalik (connection to n-XYTER board) • PCB: • Standard manufacturing limits • in particular the pitch size of the • bonding pads: 200 µm line pitch • Wire bonding: • Max. recommended bond wire • length @ 50 µm pitch: ~ 2.5 mm • Fan-out bond pattern required. • Max. opening angle: ~ 40 deg

  5. PCB top side • PCB bottom side SMD 1 M, 4 x total 100 mm 100 mm 70 mm 70 mm opening for detector legs bias pads pad 10 x 10 mm2 copper with chemical gold

  6. 15.6 mm 15.0 mm 15.6 mm 15.0 mm "balcony" bond wire 0.3 mm PCB 1.0 mm glue detector 0.6 mm "balcony" Top view Opening in PCB for detector mounting Side view 15.6 mm PCB 1.6 mm

  7. Connector: ERNI model 114805 Dual row, male, type B Pins: 68 (unused pins marked red) Height: 8.2 mm Size: ~(6.3×46.3) mm2 Pin pitch: 1.27 mm (both x and y) http://www.erni.com/smc.htd?gID=4654590 4 bias pads Four 1MΩ resistors

  8. PCB to Si sensor bonding Max angle: 51° Max bond length: 3.3 mm CBM01B2 PCB Pads layout at PCB: Line width: 100 μm2 (no pads) Pitch: 200 μm

  9. "balcony" bond wire ~ 1.5 cm PCB PCB glue ~ 1.6 mm "balcony" ~ 300 µm Mechanical mounting of the detector

  10. PCB Layout Layout made by P. Skott

  11. 100 12 50 120 Metal support structure to support PCB and sensor during bonding

  12. Conclusions & work plan • Design finished, Layout finished • Production @ ILFA, Hannover: ongoing (incl. gold plating, machining of hole) Weeks 8, 9, 10 2008 • Al bonding fixture: to be manufactured • Setup of testing station in C27 (Power supply, etc.)

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