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Volker Lindenstruth

Status and Planning For TRAP/MCM production OASE GTU. Volker Lindenstruth Chair of Computer Science Kirchhoff Institute for Physics University Heidelberg, Germany Phone: +49 6221 54 9800 Fax: +49 6221 54 9809 Email: ti@kip.uni-heidelberg.de WWW: www.ti.uni-hd.de.

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Volker Lindenstruth

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  1. Status and Planning For TRAP/MCM production OASE GTU Volker Lindenstruth Chair of Computer Science Kirchhoff Institute for PhysicsUniversity Heidelberg, Germany Phone: +49 6221 54 9800 Fax: +49 6221 54 9809 Email: ti@kip.uni-heidelberg.de WWW: www.ti.uni-hd.de

  2. MCM and ROB Production Status for the ALICE TRD Thomas Blank Forschungszentrum Karlsruhe Institut für Prozessdatenverarbeitung und Elektronik (IPE) Romania, 23.09.2005

  3. Step 1 PCB Design & material • PCB material: • Warpage was significantly reduced !! • -> modified curing procedure of Glob Top • Material for the production of 6400 MCM’s ordered Step 7 MCM Tester • General information • The tester has a contact issuse actions taken: -> solution: increase depth, with which the needles are driven into balls -> clean MCMs before testing (flux residues) -> checked needle position with endoscope (ok!) • Probably a Chip has to be contacted twice

  4. MCM Production schedule • General information • 340 MCM’s needed for ROB assembly. -> 170 will be delivered on Wednesday 28.09.05, • -> 170 will be delivered on Friday 29.09.05 • Afterwards the production will be ongoing: • Target: minimum 4000 MCMs until end of 2005

  5. Action Items • OASE • Clock source  quartz oscillator (adds latency) • Proof with V2 MGT RX • Finalise PCB and produce 100 units ASAP • Radiation tests (?) • GTU • Finalize layout (October) • Produce 1 ... 2 PCBs and get them running (at least with a few MGTs • Integration with detector in Q1/06 • Wafer Testing • Positioning problems solved  Laser ID OK • Contact problems urgent • Verify contact quality manually for next tests • Clean needle card (again) • Test second needle card • MCM production

  6. Action Items • Launch DCS board production • Full TPC • 60% TRD now? • Wafer production • 100 TRAP3A wafers in January 2006 for 60% TRD completionlocked in at UMC (they are at 100% allocation again) – confirmed by IMEC – final pricing confirmed • Remaining wafers depending on yield in January 2007

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