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BTev Pixel Detector Mechanical Design

Explore the conceptual mechanical design and assembly of BTev pixel detector, meeting stringent requirements and challenges for precision and stability. Initial stage of complex engineering process. Extensive further work and development anticipated.

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BTev Pixel Detector Mechanical Design

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  1. BTev Pixel Detector Mechanical Design Alexandre Toukhtarov Fermilab, PPD / Mechanical Department

  2. Introduction The goal of this presentation is to give an overview BTev pixel detector conceptual mechanical design and major steps of detector assembly procedure

  3. Mechanical Design Requirements • The Pixel Detector mechanical support structure should have low mass within the geometrical acceptance (300x300 mrad2) of the spectrometer • The detector needs to be retractable to a distance of 2 cm from the beam and after each refill, the detector has to be moved back in position. The reproducibility should be better than 50 mm and the relative motion must be read out with a precision of 1-2 mm • The whole detector will be placed inside the aperture of a dipole magnet with a field strength of 1.6 T; it should not have any effect on the magnetic field strength

  4. Mechanical DesignRequirements (Continuation) • The design must take into account that the operating temperature of the detector will be in the range between –10 degrees C and –5 degrees C • The detector must be shielded electronically from the circulating beam which is a significant rf source.Multiple scattering in the rf shielding (which also serves as the secondary vacuum envelope) and exit plates should be kept to a minimum and yet strong enough to withstand the differential pressure of 10-4 torr

  5. Mechanical Design Requirements (Continuation) • The pressure inside the “clean vacuum” where the colliding beam will go through has to be better than 10-7 torr. The differential pressure between the “clean” and “dirty” (where the pixel detector resides) vacuum has to be no more than 10-4 torr • The two halves of the detector must be aligned to each other with an accuracy better than 50mm in x and y, and 200 mm in z (longitudinal direction) • The individual half planes must be mounted with a precision of 20 microns or better, and the positions known to 10 microns before the half-planes are inserted in the vacuum container

  6. Mechanical DesignRequirements (Continuation) • The System must include some means of alignment monitoring online • The system should be stable to within 2 microns during data-taking

  7. Pixel Detector Conceptual Design and Detector Assembly Procedure. General Notes • Some small details like screw holes, screws, bolts, washers and nuts are omitted • Some components have a simplified shape • Present design based on using Be substrate. Using fuzzy carbon design will require some minor modifications on detector design

  8. Assembled Half -Plane & Support Brackets

  9. Half- Support Cylinder

  10. Assembled Half –Support Cylinder

  11. Assembled Half –Support Cylinder(View From Another Side)

  12. Half- Plane Installation

  13. Half- Plane Installation (View From Another Side)

  14. 30 Half- Planes Are Installed (Only 4 Are Shown)

  15. 30 Half- Planes Are Installed (Only 4 Are Shown). View From Another Side

  16. All Flex Cables Are Attached to PC- Board

  17. Flex Cables Are Attached to PC- Board (Close Look)

  18. Assembled PC- Board. View From “Beam Side”

  19. Assembled PC- Board. View From Another Side

  20. RF- Shield and Displacement Sensors Are Installed

  21. RF- Shield 100 micron aluminum foil 100 microns aluminum foil 500 microns aluminum foil

  22. Two Pixel Half- Planes Are In Front of RF- Shield

  23. Pixel Detector Vacuum Vessel

  24. The First Half- Detector Is Inserted Into Vacuum Vessel

  25. First Half- Detector Is Installed

  26. Second Half- Detector Is Inserted Into the Vacuum Vessel

  27. Second Half- Detector Is Installed Into the Vacuum Vessel

  28. All Pixel Detector Components Are Installed

  29. Pixel Detector Is Ready for Tests

  30. Pixel Detector Is Installed on the SM-3 Magnet

  31. Conclusion • We understand, that we are far away from the detector final design, so extensive engineering and design work is needed • The vacuum and cooling subsystems are not yet well defined, it can have a big impact on the present design • Step-by-step assembly procedure is not yet well established and a lot of work on design of assembly fixture is required

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