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Pixel detector development: sensor

Pixel detector development: sensor. Epitaxial wafer with sensor: first design. 5 readout chip sensor. pixel . Pad for bump bonding . 4 readout chip sensor . Pixel detector development: readout electronics. ToPix specifications:

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Pixel detector development: sensor

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  1. Pixel detector development: sensor Epitaxial wafer with sensor: first design 5 readout chip sensor pixel Pad for bump bonding 4 readout chip sensor

  2. Pixel detector development: readout electronics ToPix specifications: Custom made pixel readout chip developed using 130 nm CMOS technology

  3. Pixel detector development: Front-end electronics ToPix_v2: Custom made pixel readout chip Electrical scheme of the readout cell ToT bus Prototype with 320 readout cells Ifb 7 12 12 CLK: control logic Cint le_reg INPUT preamp comp te_reg mask latch enable baseline restorer 5 12 cfg_reg mask DAC DIGITAL ANALOG Pixel readout cell, 100 mm x 100 mm size

  4. Characterization of front-end and sensor prototypes ToPix: Custom made pixel readout chip Channel to channel ToT dispersion:  10 % Epi-Sensors Tests with a 90Sr source

  5. Measurements with epitaxial pixel prototypes connected to ToPix front-end chip with wire bonding Epitaxial silicon pixel size: 125mm x 325mm, 50 mm thick

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