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Organization of hydrogen energy technologies training No. ESF/2004/2.5.0-K01-045 Main organization - Lithuanian Energy Institute Partner - Vytautas Magnus University Ramun ė Kazlauskaitė. Report on surface profilometry measurements technique and analysis of the experimental results
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Organization of hydrogen energy technologies training No. ESF/2004/2.5.0-K01-045 Main organization - Lithuanian Energy Institute Partner - Vytautas Magnus University Ramunė Kazlauskaitė
Report on surface profilometry measurements technique and analysis of the experimental results 2005.10.03 - 2005.10.23 Training at Poitiers University Metallurgic Physics Laboratory France
The purposes of this work: • Specimens preparation: • Grinding; • Polishing; • Surface profile measurements: • Used The Dektak IIA profilometer. Polishing with machine and by hand Grinding with machine Surface profile measurements
Such filmsare not useful for further analysis because: • its are scratching; • have some defects; • its are crumbled. Fig.1 The surface of thin film
For specimen preparation we used grinding and polishing machine, called RotoForce-1 on RotoPol-11 (Fig.2). The main RotoForce-1 components: A – control keys and display(5-50N in 5N steps); B – lupo drip lubricator; C – release handle; D – support column; E – pressure feet; F – fastening screws and support hole. Fig. 2 The scheme of RotoForce-1 on RotoPol-11
Silicon carbide papers features: • silicon carbide abrasive; • exellent grain adhesion; • waterproof papers backing; • strength and resistance to deterioration when used wet; • ideal for finish sanding • exellent for machine and hand rubbing; • the grit size represents the number of holes per linear inch in a sieve screen. Fig.3 Silicon carbide waterproof abrasive papers
Resultants of grinding process: A B Alloy600 specimens after different grinding step: A - grit size P600, F=10N, t=10min; B - grit sizeP800, F=10N, t=10min; C - grit sizeP1200, F=10N, t=10min; C – grit sizeP1200, F=10N, t=15min; C D Figures 4. The specimens after different grinding steps
After grinding with silicon carbide disk we begin to polish with felt disks and diamond polishing abrasives. • Felt disk features: • They are die cut from the finest grade of felt, woven from 100% wool. • Felt discs have magnobase - magnetic disc, self adhesive for attachment to polishing platens (magnoplate)for use with our polishing specimens. Figure 5. Black key felt disk
Implements for polishing: • DP-Lubricant red (lubricating liquid for diamond polishing); • Diamond polishing abrasives, grain size 6, 3, 1 micron; • Products features: • Diamonds products fasters way to obtain a perfect surface due to the polycrystalline properties; • Non-setting stable suspensions with thixiotropric characteristics are ideally suited for automated systems; • DP products are environmentally safe; • All suspensions are non-toxic, non-combustible and water-based. Figure 6. Implements for polishing
Resultants of polishing process: A B Alloy600 specimens after different polishing steps: A - grain size 6 µm, F=5N, t=5min; B - grain size3 µm, F=5N, t=10min; C - grain size1 µm, by hand F~5N, t=10min; C – grain size1 µm, by hand F~5N, t=15 min; C D Figures 7. The specimens after polishing steps
Surface profilometry measurements • The Dektak IIA profilometer is an instrument for measuring: • the thickness of thin films (from 20nm to 65000 nm); • the vertical surface profile of a sample (from 50 microns to 30mm); • The Dektak decompounds of two parts: the Dektak itself, and the computer to its left that is used to control the machine. Figures 8. The Dektak IIA profilometer
The illuminator Camera Focusing knob Slylus Rotory stage Fig. 9 The scheme of the Dektak IIA profilometer Fig. 9 The scheme of the Dektak IIA profilometer
Tracking force and linearity are closely connected. The linearity determines the tension with which the stylus is held. • Dektak IIA works by gently dragging a mechanical diamond tipped stylus across a surface. • Vertical movements of the stylus are sensed to computer, digitalized, and stored in the instruments memory. Fig 10. Tracking forse and linearity Fig 11.Surface profile measurement
Conclusions: • In this work I polished substrate of Alloy 600 with grinding and polishing machine and saw that it is impossible to get more than 50Å roughness quality surface with it. • I got structure of Alloy 600 and saw that there are homogenous grains over all surface. • Surface profilometry measurements show, that surface roughness depend on abrasivesgrain sizes: it variable from 430Åto 180Å during grinding and from 180Å to 50Å during polishing.