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Optoelectronics Packaging Research 2002

Optoelectronics Packaging Research 2002. Peter Borgesen Project Manager. Teardown, Product Development, Prototype Assembly.  Identify potential improvements to current designs and assembly practices, as well as generic problems to be researched, through

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Optoelectronics Packaging Research 2002

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  1. Optoelectronics Packaging Research 2002 Peter Borgesen Project Manager

  2. Teardown,Product Development, • Prototype Assembly  Identify potential improvements to current designs and assembly practices, as well as generic problems to be researched, through ‘teardown’ analysis of active and passive components working with manufacturers to solve individual process and design problems and, in some cases, develop complete products building generic model components, assembling these into corresponding ‘prototype products’

  3. Optical Fibers  Cleaving, stripping, splicing, pigtailing, connectorization of SMFs, DSFs, EDFs, PM fibers  Damage & Failure: Develop test & data interpretation (‘life in service’) Optimize above processes Specs

  4. AuSn Soldering  Fundamental metallurgy (phases, kinetics) for different reflow profiles, contact pad and solder structures (predeposited, composition, multilayers)  Materials properties vs. reflow profile & metallurgies  Assembly process development Scrubbing, pressure, ambient Multilayer design

  5. Adhesives  Deposition -- reproducibility & location control  Pin transfer, dispensing, dipping  Dependence of cure kinetics on dimensions & configuration  Dependence of properties on cure, dimensions & configuration Creep, moisture uptake & permeability, adhesion, optical performance

  6. Flip Chip VCSEL  Bonding of Au-bump die Thermocompression Adhesive (dipping, printing)

  7. Selective Soldering  Automatable process for soldering of butterfly packages etc to PCB Solder (paste) deposition Reflow process parameters Intermetallic formation (embrittlement) Dependence on package (Au) supplier?

  8. Qualification, Robustness, Reliability  Telcordia: How do we pass? What are we missing? Characterize damage and failure of model structures in specified tests Develop faster (screening) tests for process & materials optimization Identify realistic damage mechanisms and check if these are properly accelerated  Assess effects of mechanisms not addressed.

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