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An analytical approach to bga components in random vibration environments

An analytical approach to bga components in random vibration environments. Milan J Lucic, MANE 6980 Engineering Project. Project Overview. BGA components are integral to the design of advanced electronic systems like your cell phone, or computer

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An analytical approach to bga components in random vibration environments

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  1. An analytical approach to bga components in random vibration environments

    Milan J Lucic, MANE 6980 Engineering Project
  2. Project Overview BGA components are integral to the design of advanced electronic systems like your cell phone, or computer Aerospace electronic controllers use BGA components for processors or programmable gate arrays Reliability of these components greatly reduced by mechanical vibration environments in Aircraft Green Compliance (ROHS) driving electronic components to use lead free solder and components
  3. Problem Statement Goal is to study the stress and high cycle fatigue of BGA components on card rack style circuit boards Random vibration from RTCA DO-160F for fixed wing aircraft Taking in account of several variables: BGA position on board Lead vs. Lead-free solder (also lead free components) Random vibration level Component will be modeled after the ACTEL 484 PBGA commonly used in the aerospace industry
  4. Methodology and Approach Accurately model the ACTEL 484 PBGA with 3-D hex elements (balls and solder joint), and 2-D Shell elements (PCB and component body) Using NX7.5 Advanced simulation for Pre-Processing and MSC PATRAN/MD NASTRAN as the post processor and solver PATRAN Random utility to solve for frequency response (Mode Shapes), displacements, and RMS stresses Using hand calculations, solve for the Miner’s Damage Index of electrical components and the high cycle fatigue of the BGA components.
  5. Expected Outcomes To develop a better understanding of lead vs. lead free BGA components used in common Aerospace environments Correlate data with actual industry test data to refine future models Greatly reduce risks early in the design phase Eliminate the need for development testing of BGA components (expensive and time consuming) Generate plots of high cycle fatigue life for lead vs. lead-free BGA components
  6. Project Progress-FEA Model Pin Grid Snapshot BGA Model ACTEL 484 PGA Solder Ball and Solder Joint FEM
  7. Project Progress-FEA Model Lower Left Corner Center Left Side Center Position
  8. Project Schedule Week 1: Develop Project Definition Week 2: Preliminary Project Proposal Week 3: Project Proposal Week 4: FEA Model Development/Research Week 5: Random Analysis/Model Refinement Week 6: Random Analysis/Model Optimization Week 7: Random Analysis/Model Optimization, First Progress Report Week 8: MDI Calculations/Random Analysis Week 9: Business Trip, out of the country. Week 10: Post Processing, Second Progress Report Week 11: Post Processing (extra time for model refinement) Week 12: Final Report Draft Week 13: Final Report Draft Week 14: Final Report
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