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Lecture 14.0

Lecture 14.0. Packaging. Final Deposition. Si 3 N 4 layer Protective coating Except for the bonding pads For soldering to wires Connection to the outside circuits. Wafer to Chip. Diamond Saw. Cuts Die from wafer. Die Mounting. Wire Bonding. From Die Bonding Pads

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Lecture 14.0

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  1. Lecture 14.0 Packaging

  2. Final Deposition • Si3N4 layer • Protective coating • Except for the bonding pads • For soldering to wires • Connection to the outside circuits

  3. Wafer to Chip

  4. Diamond Saw • Cuts Die from wafer

  5. Die Mounting

  6. Wire Bonding • From Die Bonding Pads • To external circuit mounting carriage

  7. Epoxy Bonding • Embed chip and soldered wiring to mounting carriage in epoxy.

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