1 / 24

Nikhef Annual Meeting 13 Dec 2001 Future Vertexing

Nikhef Annual Meeting 13 Dec 2001 Future Vertexing. Els Koffeman for Nikhef Vertex Group. Topics. No report on Zeus, Hermes, Alice, LHC-B, Atlas in spite of much progress No report on beautiful infrastructure R&D vertex detectors Very High Luminosity Hadron Colliders

tamarr
Download Presentation

Nikhef Annual Meeting 13 Dec 2001 Future Vertexing

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Nikhef Annual Meeting13 Dec 2001Future Vertexing Els Koffeman for Nikhef Vertex Group

  2. Topics • No report on Zeus, Hermes, Alice, LHC-B, Atlas in spite of much progress • No report on beautiful infrastructure • R&D vertex detectors • Very High Luminosity Hadron Colliders • Extreme radiation hardness (1x 1016 /cm-2) • Linear Colliders • High precision (1-5 micron point resolution) • Low material (0.1 X0 per layer) • ‘small’ detectors • Medipix • Time Projection Chamber els koffeman

  3. Electronic Department • Recent projects • Alice: analoge buffer/line driver, digital control ic (jtag + glue logic), power supply is prevented for single event latchup • LHCB: analog line driver en comparators voor beetle chip • pixel: 4 bits adc per pixel • zeus: fail safe token voor helix • general: low noise amplifier • Four FTE engineers working on VLSI • Education • EPFL (Lausanne) • Advanced Analog IC Design (5 people) • Advanced Digital IC Design (3 people) • Practical Aspects in Analog & Mixed Mode ICs (3 people) • Transistor-level Analog IC Design (2 people) • expected: low voltage analog IC (2 people) els koffeman

  4. Quick Reminder N P • Silicon as a sensor • 300 micron thick wafer • High resistivity, purity • Surface strips, pixels, pads • Silicon as readout • Poor quality wafer • Photolitography makes Integrated Circuits • All structure contained in few micron thickness • Most important component is transistor • Current technology ‘CMOS 0.25 micron’ Silicon pixel,pad,strip contact gate P els koffeman

  5. Signal! els koffeman

  6. Crystal Damage ! (vacancy, interstitials) Leakage currents Need High Voltage Less collected charge Charge generation Inside CMOS! Transistor performance degrades Chip ‘blows up’ els koffeman

  7. R&D vertexing • CERN • RD 19 Pixels • RD 39 Cryogenic operation of silicon • RD 42 Diamond detectors • RD 48 ROSE radhard silicon • RD 49 Radhard Electronics • Proposal for new R&D group • LCFI (linear collider flavour identification) • CCD detector for TESLA • 8 UK institutes, CERN, SLAC • MIMOSA • Monolithic pixels • Proposal submitted to DESY PRC • Strassbourg, Geneve, Nikhef, Liverpool, Glasgow, RAL, … els koffeman

  8. Radiation Hardness of Silicon • The leakage current damage parameter is material independent • Radiation damage very different for different particles (expressed in hardness factor K) • 24 GeV protons K =1 • Slow neutrons K=0.9 • Fast neutrons K=1.7 • Gamma 60-Co K=2x10-6 • ‘Effective doping changes’ (or increasing depletion voltage) improved by oxygenation of the material • A macroscopic damage parameter model has been developed which can be used to predict detector parameters in a given radiation environment including annealing effects els koffeman

  9. Radiation harder with oxygen? • Two methods were found to highly oxygenate silicon. • Firstly, at the ingot growing stage. • Secondly by diffusion of oxygen into ANY wafer using a high temperature drive-in • Technology has been successfully transferred to several silicon detector manufacturers (SINTEF,Micron, ST, CIS) and full-scale microstrip detectors have been produced. els koffeman

  10. Pixel systems • MCM multi chip module • ‘traditional’ 300 um thick pixel sensor bump bonded to a chips with amplifiers and readout. • CCD • Charge collection in thin surface layer • charge transferred through the wafer • Monolithic pixel • use standard CMOS wafer • simple readout per pixel chip sensor Surface sensor sensor els koffeman

  11. Monolithic Pixels • No depletion layer • charge diffusion only • < 1000 electrons • cell = • Monolithic:part of the CMOS is used as detector element • Will it work ? els koffeman

  12. MIMOSA - I 4000 pixels ! 1.2 x 1.2 mm2 els koffeman

  13. MIMOSA Signal / noise = 40 Efficiency = 99% Resolution NIKHEF proposed a ladder ‘concept’ thickness 0.05 mm 12 cm long 3 x 2 cm wide 0.9 g silicon 0.8 g support els koffeman

  14. Diamond – Pixel detector els koffeman

  15. Medipix- recent developments • Chip Design (0.25 mm) (TMR EU project) • DAC's for Alice/LHCb chip (radhard) • DAC's for Medipix2 chip • MUROS2 Interface for Medipix2 • Multi-Chip Board for 2x4 multichip Medipix2 imager • Dynamical Defectoscopy • micro-crack development in Aluminium (Marie Curie EU project) els koffeman

  16. Multi-Chip Board Vbias PC+DIO Chipboard MUROS2 10 Mhz SCSI-5 Cable 160 Mhz LVDS 8 ASIC chips Medipix2 chip size 14 x 16 mm2 1 Sensor 28 x 56 mm2 (fully sensitive area) 512 x 1024 Pixels of 55 x 55 mm2 (0.5 Megapixel) Prototype, useful for e.g. Small Animal Imaging els koffeman

  17. 3 different micro ADC's David San Segundo Bello <100 x 100 mm area <1 mW power els koffeman

  18. Chipboard Top layer metal High Density Interconnect Technology 9 metal layers (5 in kapton build-up) 1840 staggered m-via's 366 drilled-through via's 80 SMT capacitors els koffeman

  19. X-ray Defectoscopy 1mm Hole 7 Si GaAs Si + FlatField Correction 5 mm 0.5 mm els koffeman

  20. TPC for a linear collider • Traditional TPC: signal collected on wires • Principle of GEM introduced by Sauli • Used in conjunction with MSGC’s or plain electrodes • New idea: get the electrons directly in a chip! (Harry v.d Graaf, Jan Visschers, Erik Heijne) • If successful (with 60 *60 micron pitch) • Resolution limited by diffusion • Optimise gas max for this • Much better track separation • Can improve all time favorite Aleph TPC with 30-40 % els koffeman

  21. TPC + medipix chip Medipix chip kathode Sensitive area ~ 1m ~ 1mm GEM els koffeman

  22. TPC plans • Build proto type • If charge measured = > connect to Medipix chip. • Develop prototype for TESLA…. • Need 15 m2 of chips! els koffeman

  23. Conclusion…. R & D • Medipix • Diamond • CMOS sensors • micro-electronics • Novel TPC R&D is in good shape we need a vertex group ! Do we need a vertex group ? els koffeman

  24. els koffeman

More Related