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Critical Design Review

Critical Design Review. Patrick Weber , Dorin Blodgett, Michael Stephens, Heather Choi, Kevin Brown, Ben Lampe , Anne-Marie Suriano , Eric Robinson. November 19, 2010. Mission Overview. 3. 4. 2. 5. 1. 6. Presenter: Eric Robinson. Mission Overview Scientific Mission .

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Critical Design Review

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  1. Critical Design Review Patrick Weber, Dorin Blodgett, Michael Stephens, Heather Choi, Kevin Brown, Ben Lampe, Anne-Marie Suriano, Eric Robinson November 19, 2010

  2. Mission Overview 3 4 2 5 1 6 Presenter: Eric Robinson

  3. Mission OverviewScientific Mission Primary: Collect space dust. • Provide a perspective of what is in our upper atmosphere. • Particle size = nano and micro level • Donate collected aerogel tablets to UW Geology Department for further analysis • SEM photographs of particle trails – velocity analysis • Identify particles – material property analysis Secondary: • Capture optical images/video of the Earth. • Measure thermal and seismic effects throughout the duration of the launch. • Collect data for future projects. Presenter: Eric Robinson

  4. Mission OverviewEngineering Mission Engineer an extendable boom to mount a dust collector. Use aerogel and acrylic tablets as dust collectors. • Aerogel Density = 95 kg/m3 • Acrylic Density = 1200 kg/m3 • Engineer a water shield to protect dust collector. Engineer modular electronic systems for: • Capturing and storing images from optical devices. • Recording thermal and seismic data in real time throughout launch using sensors and transferring recording data via provided NASA Wallops Telemetry. Presenter: Eric Robinson

  5. Mission OverviewOrganizational Chart Project Manager Shawn Carroll Engineering Faculty Advisor Dr. Carl Frick Physics Faculty Advisor Dr. Paul Johnson Team Leader Patrick Weber Telescopic Boom (TB) Patrick Weber Eric Robinson Dorin Blodgett Electrical Power System (EPS) Michael Stephens Ben Lampe Integrated Sensors (IS) Michael Stephens Heather Choi Optical Camera (OC) Kevin Brown Nick Roder Charles Galey Presenter: Eric Robinson

  6. Mission OverviewTheory and Concepts Underlying Science and Theory • Attempt to capture space particles using telescoping boom, aerogel, and acrylic discs. • Quantification of varying flight parameters. Presenter: Eric Robinson

  7. Mission OverviewTheory and Concepts Previous Experimentation • Previous flights have included multi-sensor packages. • Temperature, Humidity, and Pressure Sensors • Accelerometers / Seismic Sensors • Magnetometers • Data Storage (SD Cards) • Results provided a basis for improvement on future data collection and retrieval. • SD Cards impervious to low exposure to salt water • Payload electrical orientation Presenter: Eric Robinson

  8. Mission OverviewConcept of Operations t ≈ 1.7 min Shedding of Skin Boom Extends via First Timed Event t ≈ 4.0 min Boom Retractsvia Arduino Controller Boom Power Shut Down t ≈ 2.8 min Apogee t ≈ 0.7 min End of Orion Burn t ≈ 15 min Splash Down Payload Power Down t ≈ 8.2 min Chute Deploys t ≈ 0 min Launch Systems Power On (t = -2 min) -Collection of Sensor Data Begins Presenter: Eric Robinson

  9. Mission OverviewExpected Results Successfully collect space dust • Space Dust Composition(10-6) • Exhausted Rocket Fuel • Meteor / Metal Fragments • Other Miscellaneous Gases • Detailed data throughout flight duration • Thermal Data • Seismic/Vibration Data • Earth images/video Presenter: Eric Robinson

  10. Design Description 3 4 2 5 1 6 Presenter: Eric Robinson

  11. Design DescriptionDesign Changes Since PDR Payload water shield has been removed • Complex manufacturability • Electrical components do not need to be salvaged New Telescopic Boom Control Mechanism • Steel tape reel design (akin to a tape measure) • New high torque gear box DC motor instead of stepper motor Mission Objective Changes • Pressure sensors have been removed from secondary objective Presenter: Eric Robinson

  12. Design DescriptionDe-Scopes and Off-Ramps De-Scopes • No mission objectives have been removed • All objectives are still considered feasible Off-Ramps • We do not believe we will run into schedule/budget constraints that would require a contingency. Presenter: Eric Robinson

  13. Design DescriptionSubsystem Overview STR Telemetry Wallops PWR Wallops Temp. Sensor TB/STR Interface Aerogel Accel. Sensor Motor Boom Boom IS/STR Interface Optical Camera Optical Camera Arm Control MCU EPS/STR Interface OC/STR Interface EPS TB OC IS IS/EPS Interface Control Box OC/EPS Interface TB/EPS Interface Optical Camera Temperature Sensor Accelerometers Presenter: Eric Robinson

  14. Design DescriptionMechanical Design Elements Presenter: Eric Robinson

  15. Design DescriptionMechanical Design Elements Presenter: Eric Robinson

  16. Design DescriptionMechanical Design Elements • Retracted – 11 in boom • Extended – ~19 in boom – ~12 in reach Presenter: Eric Robinson

  17. Design DescriptionElectrical System : Components • 16G 2-Axis Accelerometer • Temperature Sensors • Motor Driver • Encoders • Power Regulators Arduino Controller 5M Digital Camera 16 Mbit data flash 100:1 Metal gear motor 250 G Accelerometer Presenter: Michael Stephens

  18. Design DescriptionElectrical System : Arduino Atmega 328 @ 16 MHz 32Kb of Program Storage 2KB of Ram Digital Pins : 14 • 6 PWM Analog Pins : 6 • 10 Bit • 10 KHz sample time Provide control over payload Presenter: Michael Stephens

  19. Design DescriptionElectrical System : XY Accel. 2 axis ± 18G 36 / (2^10) = 0.03515625 G Resolution @ 10 bit 5V @ 350 µA 50 Hz cut off filter Used last year as well Provide acceleration in the non extreme XY axis. Presenter: Michael Stephens

  20. Design DescriptionElectrical System : Z Accel. 1 axis ± 250 G 500 / (2^10) = 0.48828125 G resolution @ 10 bit 5V @ 1.5 mA 400 Hz cutoff filter Provide acceleration data in the extreme Z (up) axis Presenter: Michael Stephens

  21. Design DescriptionElectrical System : Motor 100:1 gear ratio 140rpm @ 6V 6V @ 90mA 800mA stall current @ 6V 0.9375 in-lb motor torque @ 6V Provide winding action of tape. Presenter: Michael Stephens

  22. Design DescriptionElectrical System : Motor Driver 3 wire interface (In1, In2, PWM) 1.2 A max @ 15 V Presenter: Michael Stephens

  23. Design DescriptionElectrical System : Temp. Sensor TMP36 -50C to 125C = 175C range 175 / (2^10) = 0.170898438 degree resolution @ 10 bits SLOW (300s for full range change) 5V @ .5uA Presenter: Michael Stephens

  24. Design DescriptionElectrical System : Optics DVR 623V 5M DSC/DV module Presenter: Michael Stephens • 5.1 megapixel • Internal shutter trigger • SD Data up to 4GB • 5V @ ? mA • Provide photos/video of flight

  25. Design DescriptionElectrical System : Flash Storage 16 Mbit (2MB) 3.3V @ 7 mA 36 Kbytes/second write time SPI Interface (4 digital pins) Presenter: Michael Stephens

  26. Design DescriptionElectrical System : Storage Used for redundant storage of acceleration data Maximum sensor sampling time 400 Hz 3 x 10 bit = 30 bits ~ 4 bytes (((16 000 000 / 8) / 4) / 400) / 60 = 20.8333333 minutes of recording time. Presenter: Michael Stephens

  27. Design DescriptionElectrical System : Power 12 V regulators 6V regulators 780X series max input voltage 35 volts. Presenter: Michael Stephens

  28. Design DescriptionElectrical System : Encoder Digital light sensor 2 Wires (1 enable, 1 output) 5V @ 25 mA Used to sense black and white pattern on spool. • Used to detect stalls • Used to verify extension Presenter: Michael Stephens

  29. Design DescriptionElectrical System : Telem. IF Presenter: Michael Stephens

  30. Design DescriptionElectrical System : Power IF Presenter: Michael Stephens

  31. Design DescriptionSoftware Design Elements Programmed on Arduino in “C” Heavy use of interrupts Presenter: Michael Stephens

  32. Design DescriptionSoftware Design Elements Presenter: Michael Stephens

  33. Prototyping/ Analysis 3 4 2 5 1 6 Presenter: Patrick Weber

  34. Analysis Results Telescopic Boom • Finite Element Analysis • Deflections, stress, and strain • Newtonian Laws Payload Frame • Finite Element Analysis • Deflections, stress, and strain Presenter: Patrick Weber

  35. Analysis ResultsTelescopic Boom - Stress Key Results Loading of 100G Presenter: Patrick Weber • Stress • Peak von Mises • 11 MPa at truss convergence point

  36. Analysis ResultsTelescopic Boom – Deflection Key Results Loading of 100G Presenter: Patrick Weber • Deflection • 6061 Aluminum • 1.12E-2 mm at • center of boom. • 1023 Carbon Steel • 1.099E-2mm at • center of boom.

  37. Analysis ResultsTelescopic Boom – FOS Key Results Loading of 100G Presenter: Patrick Weber • Factor of Safety • 6061 Aluminum • Min - 24.59 • 1023 Carbon Steel • Min – 8.59

  38. Analysis ResultsMaterial Decision Material Strength • Results showed that both materials could handle the loadings with minimal deflection Material density • Aluminum 6061 • ρ = 0.0975 lb/cu.in. • 1023 Carbon Steel • ρ = 0.284 lb/cu.in. Therefore 6061 Aluminum Alloy will be the chosen as the material for our mechanical components. Presenter: Patrick Weber

  39. Analysis ResultsMaterial Decision Aerogel Design • Results from aerogel studies have proven that an Aerogel Density of 95 kg/m3 will be sufficient in capturing the micro-scaled particles. [1] • [1] – Horz, Friedrich, Mark J. Cintala, Thomas H. See, and Keiko Nakamura-Messenger. "Penetration Tracks in Aerogel. Produced by Al2O3 Spheres." Meteoritics & Planetary Science. Presenter: Patrick Weber

  40. Prototyping Results Most prototyping is theoretical and conducted using SolidWorks. Further prototyping and testing will occur once the parts are manufactured and assembled. • Late January/Early February Presenter: Patrick Weber

  41. Detailed Mass Budget Total Mass Budget (15±0.5 lbs) • Structure (5.95 lbs) • Boom (5.05 lbs) • Circuit Trays (0.9 lbs) • Camera (0.25 lb) • Other Sensors (1 lb) • Modular Electrical System (1 lb) • Ballasting (~6.80 lbs) Presenter: Patrick Weber

  42. Detailed Power Budget Presenter: Michael Stephens Redundant Power (2,3) @ T0 launch (17%) Event Power (4) @ T+5 shield ejection (80%)

  43. Wallops Interfacing: Power Presenter: Michael Stephens

  44. Wallops Interfacing: Telemetry Presenter: Michael Stephens

  45. Manufacturing Plan 3 4 2 5 1 6 Presenter: Patrick Weber

  46. Manufacturing PlanMechanical Elements Payload Frame – 6061 Aluminum Alloy • Machined • Bolted together Telescopic Boom – Precision DOM Aluminum Tubing • Boom Housing • Tubing with Epoxied Flange • Intermediate Arm • Epoxied Rail • Aerogel Arm • CNC machined from Aluminum Barstock • Aerogel Purchased Parts submitted for machining by Tuesday, November 23rd Presenter: Patrick Weber

  47. Manufacturing PlanElectrical Elements Electrical Power System • Arduino Board Integrated Sensors • Purchase All wires will be soldered All wires and boards will be epoxied to acrylic mounting plates. • Acrylic will comply with no-voltage requirement. Parts ordered by Wednesday, December 1st. Presenter: Michael Stephens

  48. Manufacturing PlanSoftware Elements Software will be developed next semester starting mid-January 2011. Software will be developed in modules and integrated as a whole as they become functional. Software developed in Arduino “C” language. Presenter: Patrick Weber

  49. Testing Plan 3 4 2 5 1 6 Presenter: Patrick Weber

  50. Testing PlanSystem Level Testing Full mission simulation testing using physical model. Vibration testing at the University as well as Wallops. Boom extension/retraction test using electronics and mechanical models. Payload drop testing Thermal Expansion testing Presenter: Patrick Weber

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