1 / 9

LL/MIT REXIS/OBF Telecon

LL/MIT REXIS/OBF Telecon. 11/2/12. Agenda (MIT Action Items). Open RFAs pertaining to LL Scheduling for EM and flight CCDs Dummy CCD packages Available metrology data for packages Epoxy stackup Heat treatment of metal parts CCID-41/MKI detector electronics compatibility update.

tate
Download Presentation

LL/MIT REXIS/OBF Telecon

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. LL/MIT REXIS/OBF Telecon 11/2/12

  2. Agenda (MIT Action Items) Open RFAs pertaining to LL Scheduling for EM and flight CCDs Dummy CCD packages Available metrology data for packages Epoxy stackup Heat treatment of metal parts CCID-41/MKI detector electronics compatibility update REgolith X-ray Imaging Spectrometer - REXIS - LL/MIT REXIS/OBF Telecon 11/2/12

  3. Detector/Packaging RFAs • DP-1, DP-2, DP-3 closed by Keith • Other LL RFAs belong to Bob Reich • DP-4: Flexprint cost/schedule • Being held up by connector choice—see next slide; response could be submitted next week • DP-5: Power dissipation of CCID-41 • Cannot be closed until CCDs can be driven • DP-7: Flexprint routing • Will be closed after engineering model flexprints are redesigned by 11/19 REgolith X-ray Imaging Spectrometer - REXIS - LL/MIT REXIS/OBF Telecon 11/2/12

  4. Detector/Packaging Schedule AirBorn connectors that mate with existing detector electronics have longer than expected lead time Delivery to LL slips to 1/14/2013 Scheduling not a serious problem for REXIS if flight CCD delivery can be delayed until 1/2014

  5. Dummy CCD Packages • We think it may be beneficial to have dummy CCD packages for use in testing assembly methods • Allows for redesign cycle to be done without use of real packaged CCDs, which could damage them before integration tests with EM electronics • Our concept of a dummy package would be just an aluminum tee bonded to an alumina substrate • Flexprint not necessary to redesign packaging or support structures • Any thermal testing could be done with Kapton/foil heaters • We would provide extra parts if LL could do this for us • Thoughts? REgolith X-ray Imaging Spectrometer - REXIS - LL/MIT REXIS/OBF Telecon 11/2/12

  6. Package Metrology Data • What metrology data for is available from LL upon delivery of completed CCD packages to MIT? • What metrology data should be taken at MIT to assess current design? • Can it be taken in MIT facilities? Maybe in NE80? REgolith X-ray Imaging Spectrometer - REXIS - LL/MIT REXIS/OBF Telecon 11/2/12

  7. Epoxies for CCD Packaging • Keith—Any updates to the middle column of this table? REgolith X-ray Imaging Spectrometer - REXIS - LL/MIT REXIS/OBF Telecon 11/2/12

  8. Heat Treatment • Corresponded with Al regarding heat treatment • Beryllium parts do not need heat treatment • Optical mounts need heat treatment for stability over > 1 year • Dummy DAM, if constructed, should not need heat treatment • EM DAM, when constructed, may need heat treatment • Depends on useful life of EM DAM • Depends on if stable alignment of CCDs is necessary for EM use • For now, plan is to not heat treat any parts REgolith X-ray Imaging Spectrometer - REXIS - LL/MIT REXIS/OBF Telecon 11/2/12

  9. TESS Detector Electronics/CCID-41 Do CCID-41s work with MKI detector electronics? Joel and Barry—Charge injection? Chris—When do you want to visit MIT? REgolith X-ray Imaging Spectrometer - REXIS - LL/MIT REXIS/OBF Telecon 11/2/12

More Related