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Recent achievements and projects in Large MPGDs

This workshop highlights advancements in Large GEMs production at CERN, company contacts, resistive protection, and process challenges. It also covers ongoing projects like Kloe and DHCAL.

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Recent achievements and projects in Large MPGDs

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  1. Recent achievements and projects in Large MPGDs Rui de Oliveira 21/01/2009 RD51 WG1 workshop

  2. Content • Large GEMs • CERN production situation • Companies contacts • Large Bulks • CERN production situation • Resistive protection • Companies contacts

  3. Large size process • Conventional process : ok but difficult • LDI : Problem of alignment • Large glass mask : mask planarity problem • Single mask + electro-etch: not accurate • Single mask + chemical selective etching: ok

  4. Single mask technique quick reminder Raw material Single side copper patterning Chemical Polyimide etching differential etching or second metal etch

  5. Raw material Resist lamination UV exposure 100 meter 500mm 100 meter 500mm 2 meter x 500mm Drying GEM Resist development 100 meter x500mm 2 meter x 450mm Active area In theory with CERN equipments 2 meter x 500mm Diff etch Polyimide etch Copper etch 100 meter x500mm 2 meter x 500mm 2 meter x 500mm

  6. Goal • 2 meter x 450mm GEM • Single mask process • 2um Copper on both sides 70um 70um 55um 50 to 60um Single mask STD

  7. Single Mask GEMs produced in 2008 (650mm x 400mm) Problems: -large rims on the top -up to 90um copper diameter on top -uniformity on large pieces -lower gains Bottom Top

  8. Single Mask GEMs produced in 2009 (30mm x 30mm)!! Problems: -Still some delamination on top layer -Hole shape to deep for classical differential etching -Needs a protecting metal before second spray etch -uniformity seems good but need to be verified Top Bottom -Up to 30 different chemistry tested (for polyimide) -Effect of ultrasonic bath tested (for polyimide and metal) -NI/Au protection layer tested -removable Tin for production still to test

  9. Detail on second metal spray etch Chemical Polyimide etching NI/Au or Tin plating on top Resist protection on bot Conventional spray etching stripping : Tin on top Resist on bot

  10. Next large GEMs productions • Kloe 700mm x 450mm • DHCAL 1000mm x 330mm • 2 slides following given by Mr Jae Yu

  11. UTA’s 100cmx100cm Digital Hadron Calorimeter Plane

  12. Readout Board 330x500 mm2 1000 mm 990 mm Basesteel plate, t=2 mm

  13. Future large volume production Visit November 2008, organized by Changwon university Company: NEW flex technology Started in 1992 Activities: circuits for Telecom, displays and Automotive 400 Employee Situation: South Corea near Seoul

  14. Double sided flexes capacity 10 000 m2/month !

  15. Smaller than needed for GEMs

  16. Roll to roll exposure, etching and stripping

  17. Strategy for low to medium volume • Use the CERN equipment • Create tool to handle 2meter GEMs for chemical treatment (done) • Subcontract artwork ( 0.5m x 2m) (Ok) • Upgrade UV exposure and Polyimide etching equipment ( but still dead baths) • Existing ones sufficient to start

  18. Strategy for large volume • Subcontract roll to roll copper patterning • Buy or create equipment for roll to roll polyimide etching (spray or static etching) • Buy equipment for roll to roll Tin plating • Buy equipment for roll to roll Tin stripping • Subcontract roll to roll electrode definition • Buy equipment for roll to roll cleaning

  19. Micromegas Bulk • About to start 1 large Bulk for SLHC • Should be built within 1 month • Points to be verified (production) • size capability • Resistive protection against discharges • Mesh sectors creation

  20. 1300mm x 350mm Active area 1500mm x 500mm Outer size Mesh Drift frame 6 different patterns Gas box

  21. High voltage supply 6 sectors + drift 500um Full plane 250um 500 um pitch 400um line and space Signal outputs 250 um pitch 150um line and 100um space 250 um pitch With resistive protection

  22. Resistive protection Spark or charges 50 to100um Signal out PCB Copper Photo-imageable coverlay Resistive dot, pad or line

  23. Spark or charges dot dot Signal out R Serial resistor limiting max current High enough to limit energy of spark C Serial parasitic capacitor High pass filter High enough to transfert signal charges

  24. Spark or charges dot dot Signal out Change the paste 100 Ohms to 1 MOhms R Serial resistor limiting max current High enough to limit energy of spark C Serial parasitic capacitor High pass filter High enough to transfert signal charges

  25. Spark or charges dot dot Signal out Change the paste 100Ohms to MOhms R Serial resistor limiting max current High enough to limit energy of spark C Serial parasitic capacitor High pass filter High enough to transfert signal charges Introduce a metallic hat C Increase the distance C

  26. Dot architecture -Min : 0.15mm diameter -Pitch: 0.25mm -Possibility to avoid alignment between track and dots Pad architecture -needs alignment

  27. Detail on the sector partitioning Coverlay 0.8mm 0.8mm 0.6mm Read-out board Mesh Milling or scalpel cut Scalpel cut prefered No dust! Spacer pillar

  28. First contact for large size large volume productions CIRE Group 8 companies in France Possibility to make large patterns in some of them They have already produced some small BULKS Other details are being discussed We are ready to discuss also with any other company

  29. Thank you

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