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Proposed Path Forward

Proposed Path Forward. Robert Johnson. What’s Wrong with Parlex Parts?. Work more with Parlex to try to understand what may have changed to get such dramatic differences in flex behavior from one lot to another. Analyze the plating and copper substrate on new vs. old Parlex pitch adapters.

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Proposed Path Forward

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  1. Proposed Path Forward Robert Johnson R.P. Johnson

  2. What’s Wrong with Parlex Parts? • Work more with Parlex to try to understand what may have changed to get such dramatic differences in flex behavior from one lot to another. • Analyze the plating and copper substrate on new vs. old Parlex pitch adapters. • Search for more of the pitch adapters rejected last year for dimensional reasons. We have since then determined that the criterion was much too tight, so most of those items could be used to get some production going if they were still in good shape. • This seems to be the only hope of getting some MCMs produced in the short term. R.P. Johnson

  3. New Dyconex Pitch Adapters • Analyze by DPA assemblies with Dyconex pitch adapters to try to understand why they cracked on the right-hand 25%. • Test assembly with Dyconex pitch adapters at Teledyne with reduced tension and using PWBs with good radius machining. • Test the G&A fixture with Dyconex pitch adapters. • Procure a production lot of Dyconex pitch adapters (in progress). R.P. Johnson

  4. Improved Parlex Pitch Adapters • Procure pitch adapters from Parlex with the copper grain oriented at 90 degrees and with various Ni plating thicknesses (in progress). • Start the procurement process for a production lot of pitch adapters with the new grain orientation, at least to make sure that Parlex gets the material in house. R.P. Johnson

  5. MCM Machining • Inspect the existing stock of machined PWBs to remove any without adequate machining of the radius. • Review the PWB machining with Diamond Tool & Die. • Review and improve the inspection controls on the radius machining. Examples of good and bad machining. R.P. Johnson

  6. New Tooling • Continue with the development and proving of the new pitch-adapter bonding tooling. • Introduce it into the production if and when it can be shown to work better than the existing tooling (assuming that we obtain usable pitch adapters that work at all). R.P. Johnson

  7. Encapsulation Issue • Let’s not forget that we still have to verify whether we’ve solved the issue of encapsulation delamination. • Several MCMs with non-flight chips were wire bonded and encapsulated at Teledyne and were delivered to SLAC today. • Send a subset to GSFC for acoustic microscopy inspection. • Thermal cycle the rest and then send them also to GSFC for the acoustic microscopy. R.P. Johnson

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