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IRC Rollout Items

IRC Rollout Items. Thank you for TWG highlights—very useful for the IRC press conference materials Final questions for 2004 Update for ITWG summaries to be resolved: Factory Integration list of focus areas to be bulletized or prioritized? ESH – clarify statement regarding Ni vs. Cr +6

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IRC Rollout Items

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  1. IRC Rollout Items • Thank you for TWG highlights—very useful for the IRC press conference materials • Final questions for 2004 Update for ITWG summaries to be resolved: • Factory Integration list of focus areas to be bulletized or prioritized? • ESH – clarify statement regarding Ni vs. Cr+6 • 450mm timing target is 2012 for 2005 ITRS • Product pacing and impact of densities for devices will be comprehended in the chip size and device performance models for ORTC 2005 ITRS • Flash model will be added with MPU and DRAM tables • MPU metal 1 contacted ½ pitch is accelerated one year: • 85nm in 2005

  2. Dec 1 • Product pace for ITRS – Alan Allan • 450 mm discussion – Alan Allan • PIDS/FEP discussion regarding planar bulk comparison to non-class. CMOS structures. • Solid State Technology draft status • Key rollout points for plenary

  3. 2005 ITRS • Group 1 – System Drivers, Design, Test, PIDS, Wireless, ORTC • Group 2 – FEP, Interconnect, Litho, Assy and Pkg, ORTC • Group 3 – ERD, ESH, Yield, Metrology, Modeling, Factory Int. ORTC

  4. 2005 ITRS • Template files are similar to 2004 Update for ease of use • all tables placed back in excel • instead of near and long term tables these are now on one spreadsheet for convenience and use of formulas

  5. Details • Challenges focus on through and beyond 32nm • Tables are now annualized in excel so easier to do • Technology requirements near-term range from 2005 through 32nm (2013 at present) • Long term ranges from below 32nm (2014 through 2020 at present)

  6. 2005 Challenges Difficult Challenges 32 nm Difficult Challenges < 32 nm

  7. 2005 Headers for Technology Requirements

  8. Example of spreadsheet template for 2005

  9. 2005 Potential Solutions Template

  10. Details • TWG chapters are due as follows • Group 1 June 10 • Group 2 July 19 • Group 3 August 19 • ~140 business days to write • Duration is more time per TWG [28 weeks vs ~23 weeks] • Earlier and staggered dates allow for better final reviews

  11. 2005 ITRS Key Dates Jan – Apr IRC teleconferences/Chip Size Tech Node Study Group mtgs Apr 10 – 13 ITRS ITWG/IRC meeting in Munich, Germany ITRS Conference in Munich, Germany Jun, July, Aug Staggered due dates for ITWG chapters Jun Pres. Drafts due to editor for preparing for July meeting Tables and 1 page summary statements by ITWGs Jul 9 – 12 ITRS ITWG/IRC meeting in San Francisco, California USA Jul 13 ITRS Conference in San Francisco [feedback for Update] Aug Drafts sent to advisory boards for review Sept Final Drafts due to editor for assembly and reviews Sept 16 Content is frozen [late material deferred to 2006 ITRS] Oct Regional Executives Advisory board approve ITRS Dec 12-13 ITRS ITWG/IRC meetings in Korea

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