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Report from the Tracking Group : October 7, 2015 M. Artuso , R. Lipton. Brief Introduction. Future science drivers for energy and intensity frontier tracking CMS and ATLAS phase 2 upgrades Possible extensions beyond current baselines 100 TeV hadron collider
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Report from the Tracking Group:October 7, 2015M. Artuso, R. Lipton
Brief Introduction • Future science drivers for energy and intensity frontier tracking • CMS and ATLAS phase 2 upgrades • Possible extensions beyond current baselines • 100 TeV hadron collider • Lepton-based Higgs factory, linear or circular collider • Rare decays, flavor physics, LHCb and Belle II • Structure of parallel session • Discussions of technologies • Particle ID, Muon Systems, Fast tracking sensors (vertex and particle ID), IC design, Mechanics and Power, Interconnections • The sessions were somewhat collider-centric. We did not fully cover rare decays and flavor physics CPAD Workshop, October 7, 2015
Parallel Session CPAD Workshop, October 7, 2015
Findings • Phase 2 Upgrades for CMS and ATLAS will move from R&D to project stage in the next ~3 years • Trackers will have substantially lower mass and improved triggering capabilities, LHCb will push data off-detector in real time and utilize a software trigger. • There has been substantial progress in studies of fast tracking elements using microchannel plates, avalanche diodes, and SIPMs • Test beam devices have achieved resolutions <10 ps • Silicon-based sensor technology continues to advance, there are prospects for lower cost arrays based on commercial CMOS • Interconnect technology is a limiting factor in experiment design and cost. Technologies such as 3D electronics can achieve interconnect pitch <5 microns. CPAD Workshop, October 7, 2015
Findings • ASIC technology is deeply imbedded in all aspects of modern experiments. The current state of the HEP art is 0.65 micron CMOS. These circuits can be radiation hard to ~100s of Mrad. • Phase 2 trackers for CMS and ATLAS have reduced mass by a factor of 2-3 while substantially increasing functionality. This has been achieved by advances in power delivery (DC-DC and serial power) cooling (CO2 dual phase systems) and low mass composite based supports • LHC Muon identification systems have achieved 100 micron resolution in systems whose areas can be measured in acres. • Future systems are likely to continue to be gas-based • There are many technology options (GEM, RPC, MDT, CSC,TGC) all trace their heritage to Charpak • 100 TeV colliders will challenge muon spatial resolution, multi-track occupancy CPAD Workshop, October 7, 2015
Comments Low mass tracking systems with time resolutions less than 20 ps could be a vital tool in identifying primary interaction vertices at HL-LHC. Applications in particle ID and intensity frontier experiments are also appealing. These technologies can have application in areas outside of HEP such as PET imaging. Technologies such as microchannel plate sensors or avalanche-based silicon sensors are candidates. Facilities such as the composite facility at LBL and SiDet at Fermilab are important centers of expertise and infrastructure. It is important that they be supported (by R&D, NP …) between large HEP projects. The IC community in the US would benefit from efforts to improve coherence and access to students and postdocs. Recommendations to achieve this are contained in the Snowmass report. CPAD Workshop, October 7, 2015
Comments • Particle ID has reached an impressive level of sophistication. Current technologies appear to be adequate to meet near-term physics needs. • Development of CMOS sensors (MAPS, HV CMOS, HR CMOS) in the US is very limited compared to Europe. This is an important area that deserves attention. These devices could provide a basis for precise, low mass, low cost, radiation hard trackers. • Muon systems for future colliders will probably use the tracker for muon momentum (a la CMS) using the muon system for triggering and ID. Gas-based trackers have been developed with fine spatial segmentation, excellent time resolution, and large areas. Continued development in these areas is promising for future colliders. CPAD Workshop, October 7, 2015
Comments • Intelligence in tracking detectors can enable selctive event triggering within very high luminosity data. In the future on-detector intelligence will compete with increasing data bandwidth, power efficiency, and off-detector processing capability. CPAD Workshop, October 7, 2015
Identification of Risks and Opportunities • What risks is the field exposed to if certain R&D does not get done • In the past we have developed technologies (3D sensors) but have not been able to develop US-based commercial infrastructure to exploit the technologies and act as R&D partners. • What opportunities exist? • Increased collaboration with industrial partners exploiting HEP expertise to explore and develop promising technologies. Effective use of the SBIR program to develop long term vendor relations. • Development of CMOS sensors (MAPS, HV CMOS, HR CMOS) in the US is very limited compared to Europe. This is an important area that deserves attention. • Development of 3D electronics and interconnect technologies • Trackers with ps timing capability utilizing microchannel plates or avalanche-based silicon. CPAD Workshop, October 7, 2015
Recommendations Laboratories and agencies should work to make facilities and technical resources more available to university-based detector R&D researchers. Ways of funding limited activities without excessive bureaucracy should be found and implemented. CPAD should work with the community to explore mechanisms to implement the recommendations of the US IC design task force. Search for ways to reduce costs through combination of R&D efforts, value engineering and industrialization. Implement “grand challenges” modeled on RD efforts at CERN CPAD Workshop, October 7, 2015
Snowmass 2013 recommendations on ASIC R&D CPAD Workshop, October 7, 2015
Possible Grand Challenge Ideas • Large area low cost, high resolution, low mass, radiation hard semiconductor trackers based on CMOS technology, large area wafers, and low cost fine pitch interconnection. • Development of arrays of sensors with <20 ps time resolution, 20 micron position resolution, low mass, low power consumption and (of course) affordable. • Low mass, radiation hard power delivery and data transmission systems. CPAD Workshop, October 7, 2015