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A PROPOSED TF JOINT DESIGN FOR THE NSTX CENTERSTACK UPGRADE. Robert D Woolley 22 January 2009. NSTX CSUG CONCERNS. Reliability of TF Joints in CSUG Cost & time to implement CSUG Costs are dominated by PPPL labor Costs are driven by design complexity Reliability of other CSUG items
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A PROPOSED TF JOINT DESIGN FOR THE NSTX CENTERSTACK UPGRADE Robert D Woolley 22 January 2009
NSTX CSUG CONCERNS • Reliability of TF Joints in CSUG • Cost & time to implement CSUG • Costs are dominated by PPPL labor • Costs are driven by design complexity • Reliability of other CSUG items • Structural supports (e.g., vacuum vessel) • Interturn insulation shear in TF central bundle • PF coils and their supports
PRESENT NSTX CENTERSTACK DESIGN • 2 TF layers in centerstack • TF Flags on 2 elevations • TF Flags bolted into centerstack conductors • TF Flags supported by flag boxes and annular hub rings • Conducting flexes • Spline locks rotation to umbrella, vacuum vessel • Lid not directly involved
TF OUTER LEG TERMINATIONS WITH CENTERSTACK REMOVED • Each of 12 TF Outer Legs includes 3 conductors • Each center terminal is above 2 side terminals, to align with 2 TF layers in centerstack
NSTX TF JOINT DESIGNS HAVE BEEN A SOURCE OF TROUBLES • Arc and fire occurred after a TF joint of the first design opened while powered. (Cost=1 yr & $) • TF joints of the second design then failed due to inadequate potting quality (Cost=0.5 yr & $) • Third try still behaves strangely above 0.5 Tesla (Cost=No higher field operations to 0.6 Tesla) • Pitting of joint contact surfaces continues, perhaps due to localized current concentrations & arcing • A fundamental issue is support of the radials.
TF JOINT APPARENT RESISTANCE • P VS R MEASUREMENTS (2003) FOR SILVERED CU JOINTS LED TO THE FOLLOWING PLOT • THIS WAS CHECKED BY A MARCH 04 TEST USING A SPARE TF FLAG & DIFFERENT BOLT TENSIONS.
TF JOINT APPARENT RESISTANCE(2) • •EACH OF THE 72 TF FLAG JOINTS HAS TWO VOLTAGE PROBES, ON LEFT AND RIGHT SIDES RESPECTIVELY. EACH PROBE IS IN A GROOVE HALFWAY UP ITS JOINT SIDE. • PROBE MEASURE VOLTAGE DROP BETWEEN ADJACENT TF TURN FACE AND FLAG POINT LOCATED A “SETBACK” DISTANCE AWAY. •EACH RECORDED VOLTAGE SIGNAL IS SAMPLED 2000 TIMES PER SECOND, WITH 8192 SUCCESSIVE SAMPLES ARCHIVED FOR THAT SHOT.
TF JOINT APPARENT RESISTANCE(3) • FOR EXAMPLE, THE ADJACENT MATLAB PLOTS DISPLAY VOLTAGES VS. TIME FOR ALL 72 JOINTS DURING PLASMA SHOT NUMBER 112987, AND ON THE SAME TIME BASE SHOWS COIL AND PLASMA CURRENTS. • The APPARENT RESISTANCE OF A TF JOINT IS THE TIME-VARYING RATIO OF THE MEASURED VOLTAGE TO THE TF CURRENT
TF JOINT APPARENT RESISTANCE(4) • Additional tests on a spare TF flag (By H. Schneider) showed that applying vertical or horizontal pressure changed these apparent resistances. Test measurements were fitted and corelated with an ANSYS model. • The resulting “Rosetta” curve and associated ANSYS model allowed the structural situation to be inferred from voltage measurements.
TF JOINT APPARENT RESISTANCE(5) • Pressure Profiles vs. Net Moment (0-5E4 inch-lbs) 2004 Probe data showed many TF joints were in trouble 2004 disassembly then showed Flag Box potting was deficient
PITTED TF JOINTS • Before operation joint faces were silvered • After operation silver was eroded in regions and underlying copper was locally pitted • Pitting has continued even after fixing potting in 2005
REASONS FOR THE PREVIOUS NSTX DESIGNS’ TROUBLES (IN MY OPINION) • TF flag stiffness transmits to joints torques resulting from lateral & vertical flag forces • Two competing load paths: TF flag stiffness vs flag box potting compound • Joint lift-off occurs at full field, but occurs at lower field if potting is bad • The design's right-angle turn in current direction concentrates current at joint corner • Current concentration jumps to new location when lift-off occurs (thus arcing?) • Magnetic forces do not clamp joints closed, they only rock joints laterally or vertically • Contact surfaces are cut by bolts which concentrate current in the heightened contact pressure zones surrounding bolt holes while also reducing overall net contact area
TF FLAG CURRENT TURNS CORNER • Note that current streamlines bunch more at corner than these current direction arrows
TF JOINT DESIGN CONCEPT SHOULD BE REPLACED FOR THE CSUG • The new NSTX operations will increase toroidal field, plasma current, poloidal field, and pulse duration, so forces and temperature rises will increase at many locations. • These force and temperature increases could challenge the original design concept.
PROPOSED CONCEPT FOR TF JOINT & FLAG REPLACEMENT • CURRENT SHAPING GENERATES E-M FORCES PRESSING JOINTS CLOSED • FLEXIBLE CONDUCTING TF STRAP REDUCES JOINT TORQUES AND ALLOWS THERMAL EXPANSION • SINGLE-LAYER TF IN CENTERSTACK • ELECTRICAL JOINT ALSO SERVES AS SHEAR JEY • OOP SUPPORT BY LEANING ON STATIONARY INTERTURN STRUCTURE, + CS JOINT RESTRAINT
TF FLEX-STRAP SHAPE • MANY THIN FLEXIBLE CONDUCTORS • CONSTANT-TENSION CURVE SHAPES SEPERATED BY THIN GAPS • ELEVATION CHANGES OVER CT CURVES • Different Possible Ways • High Inner may maximize clamping force
THE NEW DESIGN SHOULD HAVE THE FOLLOWING FEATURES (1) • Flexible conductors should be used since they only transmit tensile forces without moments • OOP forces on flexes would be supported via nearby structural surface contact • Inplane forces on flexes would be supported via their constant-tension curve shapes
THE NEW DESIGN SHOULD HAVE THE FOLLOWING FEATURES (2) • Current should have parallel (vertical) current flow on both sides, as lap-joints
THE NEW DESIGN SHOULD HAVE THE FOLLOWING FEATURES (3) • For TF joints the vertical lap-joint configuration automatically results in magnetic forces clamping the joints closed and thus increasing contact pressure
THE NEW DESIGN SHOULD HAVE THE FOLLOWING FEATURES (4) • TF joints will not be cut by any bolts. Instead, either a radial clamp can press from an adjacent ring, or alternatively, bolts can be used in non-conducting regions above or below joints.
SINGLE-LAYER TF IN CENTERSTACK • 36 TF centerstack conductors form a single layer, with 36-fold rotational symmetry in the toroidal direction. • Existing TF outer leg terminations require additions: • Existing terminals for each end of the 12 three-conductor TF outer legs accommodate the present 2-layer version of the TF central bundle. Thus 2/3 of the existing TF outer leg terminals are at elevations closer to the plasma while 1/3 are at elevations farther from the plasma. • Vertical copper bars will be attached to the 2/3 of outer leg terminals closer to the plasma to extend them to the same elevation as the 1/3 of terminals farther from the plasma.
SINGLE-LAYER TF IN CENTERSTACK (2) • Max radius 0.1925 m • Each conductor subtends 10 degrees • Turn width is 33.5 mm (= 1.32”)
COPPER BARS FOR TF OUTERLEG TERMINALS • Bars bolted to lower TF outerleg terminals extend to match elevation of upper terminal • Bars may also need to spread sideways • 36 equal spaces • Enough space to insert bolts
THE PROPOSED TF DESIGN INCLUDES THE FOLLOWING ASSEMBLIES: • (72) TF Radial assemblies shaped to direct internal TF current in an optimized pattern. Each assembly includes the following copper components: • A Boltplate, to be bolted to an TF outer leg terminal • A VerticalBar, with a TF joint surface on the lower part of its inner vertical face, and with shearkey features registering its fit with a TF turn • Flexible cables connecting Boltplate with VerticalBar • (72) Lid-mounted OOP radial rib supports • (2) Bucket-ring Supports (if needed) • Including screw-adjusted inclined-plane clamps
CT FLEX CURVES CLOSE TO OH FIELD • This reduces OOP forces near centerstack where support is difficult • Compromised to avoid lid and to maintain EM clamping force on joint • Flexes could run closer to OH field lines if lid raised
ANSYS TF MODEL • 36-fold rotational symmetry • Multiphysics includes conduction, magnetics, structural, electromechanical contact • Includes TF Central Conductor, insulation, shearkey, joint contact, straps • Outer leg not realistic • PF not yet modeled • No Vacuum Vessel
TF CURRENT DENSITY (JS) • JS not best current est.
VM STRESS ON TURN MIDPLANE • Max VM stress < 70 MPa • (SMX value set by point restraint at model’s bottom)
VM STRESS, CENTERSTACK REMOVED • The concentration near the VerticalBar’s bottom is a clamping force artifact • VM stresses are modest
JOINT CONTACT PRESSURE • No sharp spatial variations
FLEXES SHOULD BE BRAIDED, NOT SOLID • Water-jet cut is only flexible in vertical plane. • Misalignments require horizontal flexibility • OOP Support of flexes by Lid-Mounted Radial Ribs requires horizontal flexibility • Flat braided cable isi commercially available in many sizes, including up to 500 kcm. Total needed is 6.4 mcm, so as few as 13 cables could suffice.
ADDITIONAL OOP SUPPORT • An additional OOP support may be needed. • The VerticalBar may need OOP support tying it to the TF central bundle of conductors. • The TF central bundle may need OOP support if insulation shear is excessive without it. • These can both be provided if needed via a bucket-ring structure clamped to the TF centerstack.
SUMMARY • For the CSUG with its new higher field operations, the scheme for TF radials and joints should be replaced with a better one. • A flexible radial structure with CT curve shape will eliminate competing multiple load paths. • A lap-joint configuration will provide EM clamping pressure and more uniform current