Super-Belle Vertexing

1. Super-Belle Vertexing Talk at Super B Factory Workshop Jan 20 2004 T. Tsuboyama (KEK) Super B factory Vertex group Please visit http://belle.kek.jp/superb/vtx

2. 15 cm Outline of this talk • Coverage • Angle: 17<q<150o • Full acceptance of Super-Belle detector. • Radii:13<r<150 mm. • Inner radius close to the 10 mm radius IP chamber. (Tajima and Trabelsi’s talks) • Outer radius wherever CDC can not be operated due to beam background. (Uno’s talk) • Tracking capability • Spatial resolution: the better the better • Internal tracking for small pt tracks. • DAQ/Trigger issues (Higuchi/Ito’s talks) • Occupancy: <5 % even at the inner layer. • Dead time: <10 % at trigger rate of 30 kHz. • Trigger latency • 1st level Trigger from TRG to VTX: 3 msec • Z-Trigger generated by VTX to TRG 15 msec. • Radiation hardness: 20 Mrad.

3. Belle acceptance: 17<q<150o must be covered. Outer radius is determined by CDC: 150 mm Inner radius is determined by beam pipe:10 mm 5 layers for self tracking. Inclined sensors in Layer 4 and 5 Reduce readout channels Save material budget Shorten the ladder length (Without slant sensors, length ~75 cm) Innermost layer suffers serious beam background. DSSD (striplet) option  Super-layer Pixel option  covered by G. Vernar Sensor configuration

4. Inner layer Alice type 2-layer pixel Inner layer Alice type 2-layer pixel Expected resolution • Dotted lines: SVD2(Reference) • Cyan: 0.2 GeV/c, green: 0.5 GeV/c, blue: 1.5 GeV/c, Yellow: 2 GeV/c. • DSSD (Striplet) case: • Two layer will be useful for robustness under background. • Thickness same as that of SVD2 / layer. • 20 % improvement because of the detector radius. • Alice type hybrid-pixel case: (Pixel size=50mmx400mm) • Pixel shape is flat therefore, two layers are necessary since single layer is not enough to achieve good resolution in X and Z. • Material can not be ignored although sensors and amplifiers are thinned. • Consequently, the improvement of the resolution can not be observed. • Instead immunity to background will be better than DSSD case. Impact parameter resolution (rf) Impact parameter resolution (z) Inner layer= 2 layer DSSD Inner layer= 2 layer DSSD

5. DSSD for the innermost layer • The inner most layer sensor has a size of 50mm*72mm/readout. • With 50 um readout pitch and 1msec shaping time, the background estimation results in 200 % occupancy! • In order to obtain <5% occupancy, ~40 times occupancy reduction is necessary. 5%

6. DSSD for the innermost layer • Occupancy is proportional to sensitive area* shaping time. • Readout chip with 50-100nsec shaping time is available. • Strips area should be 4 to 5 times smaller. • Narrower strips are not easy. • We should shorten the strips. • Strips can not be simply cut into 4-5 pieces • Dead regions between groups appear. • Assembly (wire bonding) becomes difficult.

7. Striplet design • By arranging strips in 45 dgrees, strip length is shortened automatically. • Small triangle dead region exists. • About 7 % in Layer1 • Benefits of this design are • Strip arrangement on p-side and n-side can be symmetric. • The above triangular dead region on one side is covered by the strips in the other side. • Strip signal can be read out at detector edge. Assembly with high-density kapton circuit is easy. • The scheme is applicable in any width/length ratio.

8. Prototype design in production Production of an R&D sensor is going on.

9. Readout pitch is 71 mm. Number of channels per DSSD (512 signals in 8mm width) is 4-5 times denser than SVD2. Multi-layer kapton flex circuit solves the readout density issues. R&D items Alignment between layers. Production yield and quality. Method of assembly Installation issue Number of front end chip is 4-5 times than the present SVD. Can hybrids be installed? Readout with kapton flex circuits

10. Kapton circuit Readout Hybrid Striplet sensor Wire bonding Readout Hybrid Kapton circuit Assembly • All strips can be read out • The kapton flex circuit is assembled as follows. • Wire bonds are done at sensor edges. • P-side and n-side are symmetric

11. Readout overview • Experience of Belle SVD2: L1 sensor • 10%occupancy /(50mm*77mm*1 msec shaping) • SuperKEKB: ~20 times larger background • Strip area ~ 1/5 of Belle SVD2 (striplet) • Additional 1/10 of shaping time gives a 1/50 occupancy. • Expected trigger rate ~30 kHz • With pipeline length of 3 msec + readout time of 3 msec, 30 kHz trigger rate causes relatively small dead time (needs evaluation). Above 30 kHz, dead time goes up rapidly. • Z-trigger from VTX • Z information is useful for reducing beam-background events. • DAQ people requests the Z trigger from VTX becomes to be ready in 15 msec from the event timing.

12. Designed for the CMS silicon tracker 50 mm pitch, 128 ch/chip. 192 stage analog pipe line. Readout: multiplexing all channels. Built-in deconvolution circuit will not be used. Radiation tolerance30 Mrad Noise= (246 + 36/pF) enc. Operation at Super Belle @42.3 MHz clock ~4.0 msec pipeline length ~3.0 msec analog output scan: small dead time upt to 30kHz trigger rate. Shaping time is adjustable between 50 and 100 nsec depending on background level. Readout chip: APV25 L0 trigger Analog output 192 stage Analog Pipeline 128 channel multiplexer Shaper preamp Inverter

13. Z vertex trigger from VTX • APV25 needs a trigger (L0) from DAQ within ~3 msec from an event. • The internal delay and analog multiplexing(MPX) takes ~7 msec at max. • This analog multiplexing is not pipelined. Therefore, the subsequent steps can not be fully pipelined. • Hit cluster search and trigger decision: ~5 msec. • Summing up, L1 trigger from VTX is ready at 15 msec. • If two triggers come to APV25 almost together, the second SVD trigger decision is done at least 3 msec later than the first decision because of MPX. • The second trigger is available at ~20 msec. • If trigger decision is given up for the 2nd event, 15 msec latency can be regained. Event timing L0 trigger from GDL APV25 internal Analog Multiplex Track finding in VTX L1 trigger from VTX 20 0 3 5 7 10 15

14. R&D items • Finalize the detector configuration • Material budget in B-factory is limited. • Minimize material in acceptance. • Design detector support system and ladder structure. • Continue pixel detector R&D • Backend electronics becoming more complex and important. • 2-3 time of channels. • 10 times of data • Radiation hardness of sensors. • Design a dedicated readout chip that improves the performance of Super Belle.

15. Summary • Basic requirements to VTX can be fulfilled with striplet sensors and APV25 readout. • In order to improve robustness of vertexing against the background at higher luminosities, preparation of pixel sensors is essential. • In parallel, design of a dedicated front-end chip may be helpful to improve the performance of the VTX system.