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First Results of Micron DSSD. SVD Meeting. 1 st delivery of Micron. Large trapezoidal DSSD (already in probe station). 1 rectangular DSSD 3 quadratic DSSDs with different p-stop configurations. Micron Wafer Layout. 3 different GCDs for the n-side. Quadratic baby sensors 2,3,4
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First Results of Micron DSSD Thomas Bergauer (HEPHY Vienna) SVD Meeting
1st delivery of Micron Large trapezoidal DSSD (already in probe station) 1 rectangular DSSD 3 quadratic DSSDs with different p-stop configurations Markus Friedl (HEPHY Vienna)
Micron Wafer Layout 3 different GCDsfor the n-side Quadratic baby sensors 2,3,4 p-side: 512 strips 50 µm pitch 1 interm. strip n-side: 256 strips 100 µm pitch 0 interm. strip different p-stop patterns Main sensor p-side: 768 strips 75-50 µm pitch 1 interm. strip n-side: 512 strips 240 µm pitch 1 interm. strip combined p-stop Teststructures for p-side 1) atoll p-stop varying distance from strip 2) conventional p-stop varying width 3) combined p-stop varying distance from strip Baby sensor 1 p-side: 512 strips 50 µm pitch 1 interm. strip n-side: 512 strips 100 µm pitch 1 interm. strip atoll p-stop 1) 2) 3) Teststructures for n-side(no GCD) Thomas Bergauer (HEPHY Vienna)
Pictures Markus Friedl (HEPHY Vienna)
Crack on one side Markus Friedl (HEPHY Vienna)
Crack on one side Markus Friedl (HEPHY Vienna)
Thickness and Bow • Thickness given by Micron: 304 um • Verified by our measurement • However: ~6% less signal compared to 320 micron of HPK • Bow: currently under investigation in vienna Markus Friedl (HEPHY Vienna)
IV measurements V_depl from IV: ~55 V Thomas Bergauer (HEPHY Vienna)
CV Measurements V_depl from CV: 30 V Markus Friedl (HEPHY Vienna)
Longterm current stability Markus Friedl (HEPHY Vienna)
Summary • Good processing • No visible scratches • One big chipping: ~600 micron into the guard ring • IV behavior comparable to HPK • Long-term Stability reasonable • Strip scan about to start end of next week Markus Friedl (HEPHY Vienna)