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Miniature Loop Heat Pipes for Electronics Cooling

Miniature Loop Heat Pipes for Electronics Cooling . Research Review . Essential Vocabulary. Two-phase Latent heat Surface tension Capillarity Viscosity Heat flux. What is Loop heat pipes . Two-phase heat transfer device that operates on the basis of a capillary driven loop .

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Miniature Loop Heat Pipes for Electronics Cooling

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  1. Miniature Loop Heat Pipes for Electronics Cooling Research Review

  2. Essential Vocabulary • Two-phase • Latent heat • Surface tension • Capillarity • Viscosity • Heat flux

  3. What is Loop heat pipes • Two-phase heat transfer device that operates on the basis of a capillary driven loop

  4. Background • Challenges of cooling computer components • Small heating area • Space limitation • Maintaining temperature below 100°C • Achievements • Cylindrical evaporator with ammonia as coolant (25-30W) • Flat evaporators • Ammonia and stainless steel (87W) • Ethanol and nickel wick (120W) • Research based of water-copper configuration ( 130-160W)

  5. Research Goal • Study further the development and capability of Miniature LHP (mLHP) • Meet computer development • Consideration of miniaturizing LHP • Overcome space limitation • Testing water-copper configuration • Reach cooling below 100°C

  6. Study Conditions • Flat evaporator- 30 mm • Transport 70 W • Loop length of 150 mm • Water as coolant

  7. Method Description • Non-uniform heating area (3/5) • Thermocouple readings- every 10 seconds • Forced convention- fan • Testing was done in the horizontal configuration • mLHP thermal performance measured: • Max heat capacity • Evaporator temperature • Total thermal resistance

  8. Assembly Description

  9. Experiment Method

  10. Results Discussion • Reliable startup and steady state at low and high power

  11. Results Discussions • Capability to transfer 70W at around 100C • mLHP auto-regulate the evaporator temperature

  12. Results Discussions • Decrease of HP thermal resistance (merit number, liquid distribution)

  13. Observation • Capability of handling non-uniform heat distribution • Consideration of other positions than symmetrical • Assumption of capability of uniform distribution • Measurement of heat load was not indicated • Consideration of angled configuration • Conducting the test in an enclosure/confinement

  14. References

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