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Al - Kapton Bus development at RIKEN

Al - Kapton Bus development at RIKEN. Process Sticking Al – Kapton Etching Through hole Stacking Gold plating Issues Plan. Atsushi Taketani (taketani@riken.jp). ALICE Full Al BUS. 5 to 7 m m Al. 12 m m Polyimide. 5 to 7 m m Al. 5 m m glue. 12 m m Polyimide. 5 m m glue.

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Al - Kapton Bus development at RIKEN

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  1. Al - Kapton Bus developmentat RIKEN • Process • Sticking Al – Kapton • Etching • Through hole • Stacking • Gold plating • Issues • Plan Atsushi Taketani (taketani@riken.jp) 2004-11-15 ALICE ITS

  2. ALICE Full Al BUS 5 to 7 mm Al 12 mm Polyimide 5 to 7 mm Al 5 mm glue 12 mm Polyimide 5 mm glue 15 mm Al 5 mm glue 12 mm Polyimide 5 mm glue 50 mm Al 5 mm glue 12 mm Polyimide 5 mm glue 50 mm Al 5 mm glue 12 mm Polyimide Glue 35 mm 0.0122% X0 Al 125 -130 mm 0.140% X0 Polyimide 60 mm 0.0210% X0 Total radiation length = 0.173 % X0 2004-11-15 ALICE ITS

  3. Aluminum Aluminum Polyimide Polyimide Polyimide Manufacture Process 4 Through hole 1 Glued 5 Alignment and Etching 2 Etching 3 Glued 6 Gold plating 2004-11-15 ALICE ITS

  4. 8 micron m Polyimide (Ink) 12 micron m Al Sticking Al - Kapton Press with heat No glue! 2004-11-15 ALICE ITS

  5. Etching ALICE BUS Vertical ALICE BUS Horizontal I bring most of the samples which I show in slides. Trying 30 micron line width! 2004-11-15 ALICE ITS

  6. Our Trial pattern 12 micron Al 8 micron Kapton Single layer 80 micron space 80 micron width 2004-11-15 ALICE ITS

  7. Bad etching sample Fatal case Dimple along the line We expect to avoid these problem by washing with NaOH before photo resist painting. 2004-11-15 ALICE ITS

  8. 8 micron m Polyimide (Ink) 8 micron m Polyimide (Ink) 12 micron m Al 12 micron m Al Sticking next layer No glue! Press with heat Not Etched Etched 2004-11-15 ALICE ITS

  9. Through Hole (Laser drilling) 2004-11-15 ALICE ITS

  10. Through Hole (Cross section) 0.5mm 2004-11-15 ALICE ITS

  11. 8 micron m Polyimide (Ink) 8 micron m Polyimide (Ink) 12 micron m Al 12 micron m Al Stacking layer Project line patterns with alignment (Common technique for Cu board) Photo resist Not Etched Etched 2004-11-15 ALICE ITS

  12. Top 2nd 3rd 3 signal layers + Power/GND layers 2004-11-15 ALICE ITS

  13. Gold Plating • We already made a Al -Ni-Au plated sample. • It worked for Al wire boding. 2004-11-15 ALICE ITS

  14. Issue We do not have an idea how to make these steps 50 mm Al 50 mm Al 2004-11-15 ALICE ITS

  15. Possible Solution Additional through hole and bonding pad 50 mm Al 50 mm Al 2004-11-15 ALICE ITS

  16. Plan • We almost establish essential techniques which we need. • I am requesting a board including all essential techniques( etching, through hole, stacking with alignment, gold-plating) • It will come end of Dec. 2004. • After we confirm them, we start to design PHENIX board in Jan. 2004 and fabricate until Mar. 2005.(fastest guess) 2004-11-15 ALICE ITS

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