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How is Consumer Electronics Industry Driving Demand for Silicon on Insulator?

According to a report by P&S Intelligence, the global silicon on insulator (SOI) market is predicted to generate a revenue of $2,285.5 million by 2024, increasing from $684.9 million in 2018, progressing at a 22.7% CAGR during the forecast period (2019u20132024). The market is growing due to the rising investments in the SOI ecosystem and increasing requirement for SOI wafers in the consumer electronics applications. In terms of wafer size, the market is divided into 300 mm, <200 mm, and 200 mm. <br>

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How is Consumer Electronics Industry Driving Demand for Silicon on Insulator?

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  1. How is Consumer Electronics Industry Driving Demand for Silicon on Insulator? According to a report by P&S Intelligence, the global silicon on insulator (SOI) market is predicted to generate a revenue of $2,285.5 million by 2024, increasing from $684.9 million in 2018, progressing at a 22.7% CAGR during the forecast period (2019–2024). The market is growing due to the rising investments in the SOI ecosystem and increasing requirement for SOI wafers in the consumer electronics applications. In terms of wafer size, the market is divided into 300 mm, <200 mm, and 200 mm. Out of these, the 200 mm division accounted for the largest share of the market in 2018, due to the increasing demand for RF-SOI substrates, specifically designed for automotive and mobility industries, from Asia-Pacific and North America. On the basis of wafer type, the market is categorized into imager-SOI, radio frequency-SOI, photonics-SOI, fully depleted SOI, power-SOI, and partially depleted SOI, out of which, the RF-SOI category held the major share of the market in 2018. Get @​https://www.psmarketresearch.com/market-analysis/silicon-on-insulator-market/r eport-sample the Sample Copy of this Report RF-SOIs are widely being utilized in innovative LTE smartphones. In addition to this, the increasing investments for the development of 5G network is also driving the demand for RF-SOI. The FD-SOI category is expected to witness the highest CAGR during the forecast period in the SOI market. These wafer types are widely used for ultra-low power applications such as wearable devices and smart appliances. Moreover, the cost-efficiency and relatively high performance of these wafers is leading to the category’s demand.

  2. The Asia-Pacific (APAC) region held the largest share, of 55.4%, of the SOI market in 2018. Countries including South Korea, China, and Japan are widely focusing on the introduction and expansion of the 5G network services in the years to come, which is the major driving factor of the regional market. Moreover, the rising investments for the development of the 5G technology in APAC is also predicted to result in the growth of the regional market during the forecast period. A major driving factor of the SOI market is the increasing demand for SOIs from the consumer electronic industry across the globe. The reason for this is the applications of SOIs in various consumer electronics, including notebooks, smartphones, tablets, and digital cameras. Furthermore, the increasing adoption of smartphones, majorly in India and China, which have advanced multimedia features is also predicted to drive the demand for SOIs in the years to come. Make https://www.psmarketresearch.com/send-enquiry?enquiry-url=silicon-on-insulator- market Enquiry Before Purchase @ The miniaturization of devices is a key trend being witnessed in the SOI market. The reduced cost of manufacturing chipsets is also predicted to further accelerate the demand for these devices. The need for miniaturization of devices is coming from the requirement for smaller assemblies in certain applications and the demand for cutting material cost, which can be done by using smaller parts that function similarly to larger one. The adoption of miniaturized devices is particularly high in the consumer electronics and automotive industries. In conclusion, the demand for SOI is growing due to the expansion of the consumer electronics industry and need for miniaturization of devices.

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