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Aug 19, 2013

2014 Thunderball RFQ ME Proposal. Aug 19, 2013. Contents. Thunderball ME Proposal System footprint 11.6” & 13.3” major impact of X, Y, Z … … … P3 Open item study & suggestion Audio jack proposal (8/20 update) .. … … … P17 DC – IN proposal … … … … … … … … … … … … P19

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Aug 19, 2013

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  1. 2014 Thunderball RFQ ME Proposal Aug 19, 2013

  2. Contents • Thunderball ME Proposal • System footprint • 11.6” & 13.3” major impact of X, Y, Z … … … P3 • Open item study & suggestion • Audio jack proposal (8/20 update).. … … … P17 • DC – IN proposal … … … … … … … … … … … …P19 • Bonding force reference data … … … … … … P21 • Connector list / Cable list (8/20 update).. … P22 • Panel with screw bracket Proposal (8/20 update) …P24 2

  3. Form Factor Outline Dimension • Form Factor : 11.6” & 13.3” Slate • 11.6” & 13.3” Y dimension reduce by antenna, 13.3” Z increase by panel X Z Y 3 Update note :1.Same for touch black mask area. 2.Increased dimension detail ,pls saw X, Y stack up analysis.

  4. Slate Stacking Height For 11.6” analysis • Base on new placement Z stack up • Glass Air Gap 0.5mm • Between MB to Panel keep Gap 0.4mm WWAN module WLAN module Battery CPU TS PCB Converter board 4 Note : For SVTP 5-8 test, between panel to MB keep 0.4m gap.

  5. Slate Stacking Height 288.2 For 11.6” analysis Panel=268.5 ID edge to LCD edge8.3 • X stack up ID edge to LCD edge 10.8 Bezel to LCD edge ID edge to Bezel Bezel to ID edge LCD edge to Bezel Battery=78.3 A Cover 1.5mm (PC+ABS) Glass Adhesive Frame Glass Adhesive Frame Frame LCD edge to Battery Battery to LCD edge Battery=78.3 MB=62.6 Frame 0.8 MB Speaker 9.45 FHD LCD=268.5 Rubber 0.5 Bezel Bezel Rubber 0.5 VOL BTN DCIN Black area 10.79 Black area10.79 Touch Screen X =279.4 Rubber 1.8 Rubber 1.8 Active area 256.32 ID to Cover ID to Cover gap=0.75 ID edge to Glass=4.1 gap=0.75 ID edge to Glass=4.1 Note : Bonding area was critical item Same Black mask width Version

  6. Slate Stacking Height For 11.6” analysis • X stack up for structure 0.5mm 0.5mm 4.mm 6.3mm FHD=268.5mm 3.8mm 4mm 287.6mm Version

  7. Slate Stacking Height 193.5 For 11.6” analysis Panel=158.5 ID edge to Panel edge 16.07 ID edge to Panel edge 18.93 • Y stack up LCD to MB LCD to Battery MB to LCD Dock to ID LCD to Dock ID to Snap Glass Adhesive Glass Adhesive A Cover=1.5(PC+ABS) Frame Frame Shielding Cap MB Frame 0.8 WWAN Card Battery Shielding Cap Converter Board Speaker 9.45 Dock Board WLAN LCD=158.5 Rubber 0.5 Dock Conn Bezel Rubber 0.5 Bezel Black area 16.72 Black area 15.72 Touch Screen Y =178.12 Rubber 1.8 Active area 144.18 Rubber 1.8 ID to Cover ID to Cover gap=0.75 ID edge to Glass=11.28 gap=0.75 ID edge to Glass=4.1 Note : Top side stack up was critical item Difference Black mask width Version

  8. Slate Stacking Height For 11.6” analysis • Y stack up for structure 0.5mm 4mm 9.8mm 8.43mm 11.57mm FHD=158.5mm 193.5mm Version

  9. 11.6” bonding summary A 10.79(Black mask) 10.79(Black mask) 6.2 3.7 D D C C B 16.72(Black mask) 15.72(Black mask) 7.16 11.46 A B Note : Touch Glass dimension 279.4mm x 178.12mm

  10. Slate Stacking Height For 13.3” analysis • Base on new placement Z stack up • Glass Air Gap 0.7mm • Between MB to Panel keep Gap 0.7mm WWAN module WLAN module Battery CPU TS PCB Not overlap to Converter board 10 Note : For SVTP 5-8 test, between panel to MB keep 0.7m gap

  11. Slate Stacking Height 324.5 For 13.3” analysis Panel=306.79 • X stack up ID edge to Panel edge 9.1 ID edge to Panel edge 8.62 Bezel to LCD edge ID edge to Bezel Bezel to ID edge LCD edge to Bezel Battery=78.3 A Cover 1.5mm (PC+ABS) Glass Adhesive Frame Glass Adhesive Frame Frame LCD edge to Battery Battery to LCD edge Battery=78.3 MB=62.6 Frame 0.8 MB Speaker 9.45 FHD LCD=306.8 Rubber 0.5 Rubber 0.5 Bezel Bezel VOL BTN DCIN Black area 10.35 Black area 10.35 Touch Screen X =315.67 Rubber 1.8 Rubber 1.8 Active area 293.47 ID to Cover ID to Cover gap=0.75 ID edge to Glass=4.42 gap=0.75 ID edge to Glass=4.42 Note : Bonding area was critical item Same Black mask width Version

  12. Slate Stacking Height For 13.3” analysis • X stack up for structure 0.5mm 0.5mm 4.mm 4.3mm FHD=306.8mm 3.8mm 4mm 323.9mm Version

  13. Slate Stacking Height 216.6 For 13.3” analysis Panel=180.94 ID edge to Panel edge 16.41 ID edge to Panel edge 19.25 • Y stack up Battery to MB LCD to Battery MB to LCD Dock to ID LCD to Dock ID to Snap Glass Adhesive Glass Adhesive A Cover=1.5(PC+ABS) Frame Frame Shielding Cap MB TS control Board Frame 0.8 Battery WWAN Card Shielding Cap Speaker 9.45 Dock Board WLAN FHD LCD=180.94 Dock Conn Bezel Rubber 0.8 Rubber 0.8 Bezel Black area 18.8 Black area 15.8 Touch Screen Y =201.18 Rubber 0.8 Active area 165.08 Rubber 0.8 ID to Cover ID to Cover gap=0.75 ID edge to Glass=11.3 gap=0.75 ID edge to Glass=4.12 Note : Top side stack up was critical item Difference Black mask width Version

  14. Slate Stacking Height For 13.3” analysis • Y stack up for structure 0.5mm 4mm 10.64mm 8.43mm 11.91mm FHD=180.94mm 216.6mm Version

  15. 13.3” bonding summary 11.79mm Black mask=15.8 3.7mm Black mask=10.35 Black mask=10.35 4.18mm 7.45mm Black mask=18.8 Version Note : Touch Glass dimension 315.67mm x 201.18mm

  16. Audio Proposal Update on 8/20 16

  17. Audio Jack Location Analysis **Simulate result base on side bend difference dimension. **Follow simulation result, audio jack opening should not cross the side bend, then can pass SVTP . Current ID Propose ID 4.5mm 6.5mm

  18. DC-IN Proposal 18

  19. LOTES 3 PIN PROPOSAL • DC-IN connector 3 pin design on left side study. • Propose opening 22.0mmx4.0mm, force 1kgf (Min.) • Connector 7.4mm dimension include plastic cap. Slate side : Magnet Plug side : Metal Units:mm Notes： ●System side terminals process by CNC，total 3Pin asymmetrical arrangement，solder PCB adapter plate. ●Magnet in the middle，material selection N48，nickel plated. ●Connector needs chassis positioning for alignment. Version

  20. Bonding force check 20

  21. Bonding force Bonding force

  22. 8/20 Update • Connector list / Cable list 22

  23. Panel with screw bracket Proposal 8/20 update 23

  24. Thunderball 11.6” LCD EAR Bracket interference issue • Current Darwin’s panel has screw fix plate, it will had interfere risk. • Suggestion removed TOP side plate and adjust one of left side plate. LCD ear bracket interference Antenna Darwin Panel LCD ear bracket interference DCIN CONN

  25. Thunderball 13.3” LCD EAR Bracket interference issue • Current Wolverine/Turing’s panel has screw fix plate, it will had interfere risk. • Suggestion adjust left/right side plate. LCD ear bracket interference Volume PCB Wolverine/Turing’s Panel LCD ear bracket interference DCIN CONN

  26. Thunderball 13.3” LCD EAR Bracket interference issue • Proposal for adjust ID location for common panel. VOL BTN Need to adjust VOL BTN (12mm) Need to adjust DC-IN (20mm) DC IN Proposal2:Move ID location.

  27. Thank You! 27

  28. 0807 Back Up data 28

  29. Slate Placement Update 11.6” Top View • Separate 8 small board and 1 M/B. • Front webcam off center 9.9mm. • LTE antenna not same with 13.3” LIGHT_SENSOR BOARD WLAN_Main WLAN_AUX WWAN_AUX WWAN_Main Mic Front Webcam AUDIO Jack BOARD POWER Btn BOARD VOLUME Btn BOARD WWAN CARD WLAN CARD Battery LGC_ICP3076120L Battery LGC_ICP3076120L MB DC-IN TOUCH BOARD LCD CONVERTER BOARD SPK R FG1813Q2S SPK L FG1813Q2S 29 Micro SDBOARD DOCK_BOARD Micro SIMBOARD

  30. Slate Placement Update 11.6” Bottom View • Placement Update • Rear webcam at center. Rear Webcam DDR3L CPU 30

  31. Slate Placement Update 13.3” Top View • Same 11.6” separate 8 small board and 1 M/B. • Front webcam at center. • LTE antenna not same with 11.6” LIGHT_SENSOR BOARD WLAN_AUX WLAN_Main WWAN_Main WWAN_AUX Mic Front Webcam POWER Btn BOARD AUDIO Jack BOARD 87 X 14 70 X 14 VOLUME Btn BOARD WWAN CARD WLAN CARD Battery LGC_ICP3076120L Battery LGC_ICP3076120L MB TOUCH BOARD DC-IN LCD CONVERTER BOARD SPK L FG1209 SPK R FG1209 31 Micro SDBOARD DOCK_BOARD Micro SIMBOARD

  32. Slate Placement Update 13.3” Bottom View • Placement Update • No Rear webcam. DDR3L CPU 32

  33. Slate Cables Routing Update 11.6” Top View • FPC*2, FFC*6, Cable*5, Antenna*4 5 4 FPC: 1.MB to Dock PCB 2.MB to TS PCB FFC:1.MB to Audio PCB 2.MB to Volume PCB 3.MB to Micro SIM PCB 4.MB to Power PCB 5.MB to Light sensor PCB 6.Micro SD to TS PCB Cable: 1.LVDS 2.DC-IN 3.Batt 4.Speaker L 5.Speaker R Antenna: 1.WLAN 2.WWAN 2 1 3 6 1 2 33 3 5 2 4 1

  34. Slate Cables Routing Update 13.3” Top View • FPC*2, FFC*6, Cable*5, Antenna*4 5 4 FPC: 1.MB to Dock PCB 2.MB to TS PCB FFC:1.MB to Audio PCB 2.MB to Volume PCB 3.MB to Micro SIM PCB 4.MB to Power PCB 5.MB to Light sensor PCB 6.Micro SD to TS PCB Cable: 1.LVDS 2.DC-IN 3.Batt 4.Speaker L 5.Speaker R Antenna: 1.WLAN 2.WWAN 2 1 3 6 1 2 34 3 5 2 4 1

  35. Audio Proposal 35

  36. Slate Placement AUDIO JACK • Study1-1 (4th Contact pin on Top) - Audio Jack on Top corner. • Audio jack X position by audio jack plug and • Y position by LCD panel , base on current ID • will had two surface impact to audio jack design • and cause to contact pin broken. LCD Panel Cover surface 3rd Contact pin Corner surface 4th Contact pin

  37. Slate Placement AUDIO JACK • Study2-1 (4th Contact pin on Side) - Audio Jack on Top corner. • Audio jack X position by audio jack plug and • Y position by LCD panel , base on current ID • will had two surface impact to audio jack design • and cause to contact pin broken. LCD Panel Cover surface 4th Contact pin Corner surface 3rd Contact pin

  38. Slate Placement AUDIO JACK • Study1-2 (4th Contact pin on Top) - Audio Jack on Bottom corner. • Audio jack X position by audio jack plug and • Y position by LCD panel , base on current ID • will had two surface impact to audio jack design • and cause to contact pin broken. LCD Panel Cover surface 3rd Contact pin Corner surface 4th Contact pin

  39. Slate Placement AUDIO JACK • Study2-2 (4th Contact pin on Top) - Audio Jack on Bottom corner. • Audio jack X position by audio jack plug and • Y position by LCD panel , base on current ID • will had two surface impact to audio jack design • and cause to contact pin broken. LCD Panel Cover surface 4th Contact pin Corner surface 3rd Contact pin

  40. Slate Placement Update AUDIO JACK Proposal 1: Audio Jack at Corner JACK COVER Audio Jack HPID AFTER MOVED AUDIO JACK COVER Audio Jack plug PIN will exposed PIN3&4 Propose reduce ID corner 9 ㎜ MAIN Proposal ID GAP 1.1 ㎜ PANEL 9 ㎜

  41. Slate Placement AUDIO JACK • Audio jack overload suggestion • A cover change material to PC+ ABS+ Talc and add bump to support. 2kgf loadcause stress>60MPa that has crack risk over the weak/RED area. 3.5kgf loadcause stress>60MPa that has crack risk over the weak/RED area. Move up 0.5mm 1.2T 8kgf loadcause stress>60MPa that has crack risk over the weak/RED area.

  42. DC-IN Proposal 42

  43. Version LOTES 3 PIN PROPOSAL Outline Drawing ●System side pin type is circle pin , Use transition board ●Magnet is one part type ， Effective magnetic area 29 mm^2， Magnetic force：0.8~1.2 Kgf ● POGO Pin 3Pin， Forward force total is 60gf*3=180gf=0.18Kgf

  44. Version LOTES 3 PIN PROPOSAL Explosion Drawing： Rear Case Cover Pogo Pin PCB Housing PCB&SR Housing Magnet Front Case Magnet Mylar PIN System Side Cable Side

  45. Version LOTES 3 PIN PROPOSAL Design Features： ●Cableassembled by the front and rear cover ● Pogo Pin exposed on the outside ● PAD is located in the middle of the connector (symmetrical) ●D-shaped socket to prevent reverse insertion ●System side magnet is integrated ●Cable side setting a magnet, the magnet exposed Update item: Plug side add magnet for increase magnetic force

  46. Version LOTES 3 PIN PROPOSAL The thickness of the magnet to be thicker here to 1.0mm, A cover needs to make way for housing interference

  47. Micro SIM Proposal 47

  48. 16.35 ㎜ 11.6” Slate Placement Micro SIM 1.3 ㎜ Micro SIM interfere check with current HP ID 15.5 ㎜ Tray Connector X, Y – Had risk X moved to out side 4.6mm Z – No risk Interfere 2.6 ㎜ BEZEL_FRAME COVER PANEL Converter Board 0㎜ gap Release position 1.6mm Connector

  49. 11.6” Slate Placement Update Micro SIM Moved Micro SIM hole size and location proposal 108.25 ㎜ 112.85 ㎜ 108.25 ㎜ 108.25 ㎜ Propose ID position (11.6”) Current HP ID (11.6”) SD Micro SIM SD Micro SIM Micro SIM tray panel 16.0 ㎜ x 1.2 ㎜ Suggestion opening 16.4 ㎜ x 1.6 ㎜ Micro SIM tray panel 14.7 ㎜ x 1.2 ㎜ Suggestion opening 15.1 ㎜ x 1.6 ㎜ MICRO SIM MICRO SIM EJECT Structure

  50. 16.35 ㎜ 13.3” Slate Placement Micro SIM 1.3 ㎜ Micro SIM interfere check with current HP ID 15.5 ㎜ Tray Connector Z – No risk Keep GAP=2.0 ㎜ SIM Card Cover Bezel Converter Board Panel Gap 0.1 ㎜ FHD PANEL PCB

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