North America Metrics Technical Committee Chapter

1. North America Metrics Technical Committee Chapter Liaison Report August 2016

2. Outline • Leadership • Organization Chart • Meetings Information • Ballot Results • New Business (5 Year Review and 3 Year SNARFs) • TF Reports • Proposed Meeting Schedule • Staff Contact

3. Leadership • N.A. Metrics TC Chapter Cochairs • David Bouldin (Fab Consulting) • Mark Frankfurth (Cymer) • ESD TF • new TF leader Chuck McClain (Micron) • Equipment Training and Documentation TF • Mark Cohran (Intel) & MalthiVenkat (Nikon)stepped down as the TF co-leaders. • TF is looking for new leaders

4. N.A. Metrics TC Updated Organization Chart Legend C Chair/Co-Chair L Task Force Leader TF Task Force TA Technical Architect TE Technical Editor North America Metrics TC Chapter C: David Bouldin (Fab Consulting) C: Mark Frankfurth (Cymer) C: Vladimir Kraz (BestESD) TE: Carolyn Busing (self) TA: Greg Francis (Cymer) Factory Level Productivity Metrics TF L: Ron Billings (Ore. State/FABQ) L: Jim Irwin (Irwin Consulting) Equipment RAMP TF L: Steven Meyer (Intel) L: David Busing (Consultant) EMC TF L: Vladimir Kraz (BestESD) L: Mark Frankfurth (Cymer) ESD/ESC TF L: Chuck McClain (Micron) Equipment Training and Documentation TF L: TBD L: TBD Equipment COO TF L: David Bouldin (Fab Consulting) L: David Jimenez (WWK) NOTE: Italics means group is currently inactive.

5. Meeting Information • Last meeting • July 13, 2016 @ SEMICON West 2016 • San Francisco Marriott Marquis Hotel in San Francisco, California • Next meeting • November 9, 2016 @ N.A. Standards Fall 2016 Meetings • SEMI Headquarters in San Jose, California

6. Ballot Results Cycle 5 - 2016

7. 5-Year Review

8. SNARFs 3 Year Status • SNARF # 5596 Metrics New Standard: Guide To Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment (author Vladimir Kraz) • SNARF extended for 1 year in Spring 2016.

9. Current Ballots • None.

10. EMC TF Report • Vote discussion • E33 Line Item Ballot • Superclean • 5596 Document • 7 “yes”, 0 “no,” “0” abstain • Small addition to 5596 was discussed and will be moved to a Letter Ballot in Fall 2016/Spring 2017 • InCompliance magazine (largest EMC-related publication) published an article on SEMI EMC standards and current progress in June 2016. The purpose is to publicize SEMI and SEMI standards and to attract larger audience to our forum. • Link to the article: http://incompliancemag.com/article/dealing-with-emi-in-semiconductor-device-manufacturing/

11. ESDA TF Report [1/2] • ESDA and JEDEC are collaborating to release joint device test standards. Working on update of HBM standard JS-001. CDM standard JS-002 has been released and is now available on both the ESDA and JEDEC websites. Collaboration with JEITA is in process. • Website - www.esda.org – Information and free download of ANSI ESD S20.20 (static control program), ANSI ESD S541 (packaging) documents. Translations into Spanish , Thai, and Chinese of S20.20 are also available. ESDA Glossary of Terms – online and searchable on the website. Device Test standards (referenced in SEMI documents) are available as a free download. • An international version of ANSI/ESD S20.20 was issued by the IEC as IEC 61340-5-1. ANSI/ESD20.20-2014 has been released and 61340-5-1 is being harmonized with the changes in S20.20.

12. ESDA TF Report [2/2] • ESD Association Technology Roadmap for semiconductor device ESD sensitivity has been updated and is available on the ESDA website. • ESDA and the Industry Device Council have activities regarding electrical overstress (EOS) test methods. Industry Device Council WP-4 is being reviewed for release by JEDEC. • ESD Standards meetings September 24-27, 2015 and April 15-17, 2016. • Next meetings September 8-11 2016 in Anaheim CA. • ESD Symposium and Tutorials September 11-15 in Anaheim CA. • Check the ESDA website for more information.

13. Subcommittee & other TF Status Updates [1/2] • Technical Editors Board • There were no new updates • Working with SEMI Publications on Revision to the SEMI Standards Style Manual • Technical Architects Board • There were no new updates • Proposal to sunset the Technical Architects Board still pending

14. Subcommittee & other TF Status Updates [2/2] • Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics TF • No TF meeting during SEMICON West 2016 • The TF focused on developing technical education materials, including webinars and STEPs • Equipment Cost of Ownership (COO) TF • No TF meeting during SEMICON West 2016 • Equipment COO TF activities planned to resume during Fall 2016 TC meeting. Expected outcome is two SNARFs to do line –item revisions to E35 and E140 for approval by the TC Chapter in Fall 2016. • Wait Time Waste Time (WTW) TF • No TF meeting during SEMICON West 2016 • Equipment Training and Documentation TF • No TF meeting during SEMICON West 2016

15. Next Meeting Schedule The next N.A. Metrics Standards Meetings are tentatively scheduled* for November 8 – 9, 2016 at SEMI Headquarters in San Jose, California in conjunction with the N.A. Standards Fall 2016 Meetings. Exact meeting date and details will be announced when finalized and available at http://www.semi.org/en/standards-events Tuesday, November 8 • ESD/ESC TF (1:30 PM – 3:30 PM) • Equipment Cost of Ownership TF – (3:30 PM – 4:30 PM) • EMC TF (5:00 PM – 6:00 PM) Wednesday, November 9 • Eq. RAMP TF (10:00 AM – 11:00 AM) • N.A. Metrics TC Chapter (2:00 PM – 5:00 PM) *All times are in Pacific Time. Times and dates are subject to change without notice.

16. Thank you!For more information or to participate in any N.A. Metrics activities, please contact Inna Skvortsova at SEMI (iskvortsova@semi.org)