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Packaging and Mechanical Aspects

Packaging and Mechanical Aspects. Overview. Package Types Dual In-line Package (DIPs) Flatpacks Pin Grid Arrays (PGAs) Ceramic Quad Flat Packs (CQFP) Plastic Quad Flat Pack (PQFP) Plastic Package Qualification Lead/Ball Pitch Mass Characteristics Shielding. UTMC UT22VP10 - DIP-24.

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Packaging and Mechanical Aspects

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  1. Packaging and Mechanical Aspects

  2. Overview • Package Types • Dual In-line Package (DIPs) • Flatpacks • Pin Grid Arrays (PGAs) • Ceramic Quad Flat Packs (CQFP) • Plastic Quad Flat Pack (PQFP) • Plastic Package Qualification • Lead/Ball Pitch • Mass Characteristics • Shielding

  3. UTMC UT22VP10 - DIP-24

  4. Northrop-Grumman 256k EEPROM

  5. PGA Packages

  6. PGA Packages (cont'd)

  7. CQFP Packages

  8. PQFP Package

  9. Plastic Qualification • MIL-PRF-38535 Qualified Manufacturer Listing (QML) • Actel, June 1999 • Xilinx1 • Guaranteed over MIL temp range • Quicklogic 1 Trying to obtain verification and date of their certification.

  10. Nominal Lead/Ball Pitch CQ84 0.025" CQ132 0.025" CQ172 0.025" CQ196 0.025" CQ208 0.50 mm PQ208 0.50 mm CQ256 0.05 mm CG560 1.27 mm Note: Pin spacing for PGAs is typically 0.1"

  11. Mass CharacteristicsApproximate values (in grams) CQ84 2.2 CQ132 5.8 CQ172 8.8 CQ196 11.1 CQ208 8.8 CQ208 18.5 PQ208 5.2 CB228 17.6 CQ256 13.0 CQ256 20.2 PG84 8.0 PG133 11.0 PG176 19.0 PG207 24.5 PG257 27.3 1 BG560 11.5 CG560 11.5 1 1With heat sink. Over the years, there has been a lot of variation as to which parts have heat sinks. Check each package.

  12. Shielded Packages - Rad-Pak™ • This package, with tie bar, 24 grams • Shielding thickness may vary between lots • Shield is 10-90/copper-tungsten • Density of shield is ~ 18 g/cm3 (need to verify) • EEPROMs and other devices also packaged similarly

  13. Shielded Packages - Rad-Coat™ • High-Z metal powder • Adhesive binder • Viscous fluid during conformal application. • This package, with tie bar, 19 grams. • Shielding thickness may vary between lots. • Shield is only present on top for this experimental device • Density of shield is: 13 g/cm3 • Shield dimension is ~ 0.81" x 0.81" x 0.055" • From NASA SBIR

  14. Spot Shielding Qualification Board - Maximum Thickness

  15. Spot Shielding Qualification Board - Maximum Thickness

  16. Rad-Coat™ On PCB (1)

  17. Rad-Coat™ On PCB (2)

  18. Thermal Performance • Junction temperature the critical parameter • Often derated to ~ 100 ºC • tJ = P • J-C tJ = Junction temperature in ºC P = Power in watts J-C = thermal resistance, junction to case, in ºC/watt

  19. Thermal Performance - DevicesJ-C for Flight Devices in ºC/watt Ceramic Pin Grid Array PG84 6.0 PG133 4.8 PG176 4.6 PG207 3.51 PG257 2.81 Notes: 1These packages are "cavity down." 2With embedded heat spreader 3Estimated 4Typical Ceramic Quad Flat Pack CQ84 7.8 CQ132 7.2 CQ172 6.8 CQ196 6.4 CQ208 6.3 CQ256 6.2 Other PQ208 8.0/3.82 PQ240 2.84 HQ240 1.54 CG560 0.83

  20. CQFP256 w/ Heat Sink

  21. Cavity Down PGA Package

  22. Thermal Performance - DevicesHeat Sink Orientation Note: Some packages can be "lead bent" either way, depending on whether the device will be used with either convection or conduction cooling.

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