1 / 14

Assembly and Packaging

Assembly and Packaging. Assembly and Packaging. 82 Members 22 present for Summer workshop Focus of activities for 2010 The only change to tables will be AP1: Difficult Challenges Preparation for 2011 with expanded coverage for: Medical electronics, 3D integration Interposers

theresa
Download Presentation

Assembly and Packaging

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Assembly and Packaging

  2. Assembly and Packaging • 82 Members 22 present for Summer workshop • Focus of activities for 2010 • The only change to tables will be AP1: Difficult Challenges • Preparation for 2011 with expanded coverage for: • Medical electronics, • 3D integration • Interposers • Automotive electronics • Optoelectronics • Printed electronics • Handling of thinned wafers and die • Embedded components • MEMS integration • Rewrite of the System in Package paper • Cross TWG coordination • Major collaborations include ERM, ERD, ESH, Interconnect, Design, Test • Coordination with other Roadmaps • iNEMI • CTR/MPC • JISSO • Difficult Challenges changing: 3D integration, new materials, more “Moore”

  3. Assembly and Packaging Technical Working Group Summer Meeting 2010

  4. Expanded Coverage of Emerging Requirements for 2011:Medical Electronics • Medical electronics Categories to be addressed: • Portable medical electronics • Implantable medical electronics (Parkinson’s disease symptom control) • Selected Issues for Medical electronics • Power requirements: energy scavenging; wireless radiated power; batteries • Safety issues (voltage, biocompatibility, power delivery) • FDA certification • Reliability requirements • Environmental issues • Connectivity (wireless) • Optical components (cameras) • Microfluidics • Implantable micro-robotics • Sensors • MEMS

  5. Expanded Coverage of Emerging Requirements for 2011:3D Integration • Selected Issues for 3D Integration • Die stacking methods • Homogeneous stacking • Heterogeneous stacking • Test challenges for 3D • Test access • Test cost • Through silicon Vias • Thermal management for 3D structured • Power integrity • 3D SiP • Bonding methods • Codesign and simulation

  6. Expanded Coverage of Emerging Requirements for 2011:Interposers • Selected Issues for Interposers: • Systems integration for 2D and 3D • Interposer features • Redistribution wiring • Passive networks • Thermal management • Stress management • Materials selection • Si • Ceramic • Glass • Organics

  7. Expanded Coverage of Emerging Requirements for 2011:Automotive Electronics One side air cooling Cooling on both sides Liquid immersion cooling • Automotive electronics Categories to be addressed: • Internal combustion • Hybrid • All electric • Selected Issues • Communications (including optical networks) • Thermal management • In cabin • Hostile environments • Safety • Sensors • Controls for improved efficiency • Cost

  8. Expanded Coverage of Emerging Requirements for 2011:Thin Wafer and Die Handling • Selected Issues for Thin Wafer and Die Handling • Testing: contactors with ohmic contact without damage • Holding mechanisms • Electrostatic chucks • Bernouilli chuck • Temporary bonding (sacrificial layer) • Vacuum chucks (porous ceramic chucks) • Dicing of thin wafer • Warpage

  9. Expanded Coverage of Emerging Requirements for 2011:Embedded Components • Embedded Component Categories to be addressed: • Active devices • Passive devices • Selected Issues for Embedded Components • Performance enhancement due to reduced distance between die and passives • Incorporation of additional functionality (heat pipes; wave guides) • Keep out area around embedded components • Charge source close to the die for current surge • Reduced size by placement of passives under die • Placement accuracy for small thinned die • 3D alignment tolerance for assembly • Improved resistance to shock • Thermal management

  10. Expanded Coverage of Emerging Requirements for 2011:MEMS Integration Microfluidic pump • MEMS Integration Categories to be addressed: • Sensors • Accelerometers • RF Switches, Oscillators, and filters • Microfluidics • Optical • Selected Issues for MEMS Integration • Low stress interconnect between MEMS device and package cavities • Low cost, high reliability mechanical mounting • Electrical and environmental connections • low electrical parasitic interconnect • Low cost hermetic cavities • Stress management

  11. Difficult Challenges

  12. Difficult Challenges

  13. Difficult Challenges

  14. Thank You

More Related