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Preamplifier Integration in 3D PLUS Technology. 3D PLUS technology Electrical and mechanical design 3D PLUS quality system EM and FM manufacturing flow Schedule. 3D Manufacturing F lowchart. 4 ) – Flex stacking. 5 ) – Module Mo u lding. 7 ) – Module Plating (Ni+ Au).
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Preamplifier Integration in 3D PLUS Technology • 3D PLUS technology • Electrical and mechanical design • 3D PLUS quality system • EM and FM manufacturing flow • Schedule
3D Manufacturing Flowchart 4 ) – Flex stacking 5 ) – Module Moulding 7 ) – Module Plating (Ni+ Au) 1 ) – Flex design 2 ) – Components attachement 8 ) – Cube interconnection by laser 3 ) –Flex Electrical Test 9 ) – Module Test & screening 6 ) – Module Sawing
Input Signal Amplified Signal antenna Vin Feedback Mechanical & Electrical Design Amplifier Principle : Vout Input from calibration network Calibration Signal 1 layer in the Regulator module • 1st level of amplification • 46 dB Gain • few noise • Feedback • 2nd level of amplification • 31 dB Gain • Bandwidth 0.25mHz to 4 KHz 1 layer in the Amplifier module 1 layer in the Amplifier module
Mechanical & Electrical Design The Amplifier module : • 2 amplification levels • 3 radiation shielding levels • PGA Heating network * 1st amplification level Radiation Shielding 2nd amplification level * Circuit no included for the THEMIS mission
Mechanical and electrical The Regulator module : • 1 power Supply regulator layer • 1 Calibration layer • PGA Heating network * Temperature regulation* Input from cal. network Ground Plan Radiation Shielding* Power Supply * Circuit no included for the THEMIS mission
Materials Main materials which make up these 3D Modules are :
3D PLUS technology Qualification • Several Project/Product Qualification successfully passed since the beginning of 3D PLUS for COROT, CLUSTER II, PROBA, SMART 1, ROSETTA, MARS EXPRESS, ENVISAT… • Successful Generic Evaluation by CNES/ESA/NASA on December 2001 • See CNES/ESA Evaluation report (ESCCON 2002 – France) • See NASA Evaluation report (ESCCON 2002 – France) • Generic Qualification by CNES/ESA on 3Q2003 • Final Review of the 3D qualification (Document ref. 3300-0563-3) took place on September 24th. • Several Customer’s Internal Agreements in the Space Industry • Successful ISO 9001-2000 Certification on April 2003 3D PLUS Technology, Processes and Products benefit from a largeexperience and a high quality referential
Quality Assurance Documents • 3D PLUS Quality Manual • Generic quality process at 3D PLUS. • Process Identification Document (ref.3300-0546-3) • Freeze the qualified technological capability domain of 3D PLUS (i.e Process list, inspection criteria, material list, parts procurement rules, screening test, …) • The PID is compliant to ESA quality standard for Space applications. • Product Configuration Management : CADM • Module procurement specification • Product definition • Manufacturing flow • Test specification • Product Assurance Plan • End Item Data Package : • Include all the traceability information (material, parts, operations, LAT,…) of the manufactured lot • As built/As design configuration list for the manufactured modules
Quality levels for Space applications • 3 quality levels are defined in 3D PLUS PID and described in the document ref. 3DPA0850 : • Commercial • Industrial => Engineering Models for Space applications • Space=> Flight Models for Space applications • For the THEMIS mission, 3D PLUS has to manufacture : • 1 Regulator Engineering Model • 3 Amplifier Engineering Models • 7 Regulator Flight Models • 19 Amplifier Flight Models
EM and FM manufacturing flow • For the PreAmplifier manufacturing, there are 2 types of components : • Components procured by CETP • Components procured by 3D PLUS according to 3D procedure ref: 3DPA0350: • Documentary review • Visual Inspection • Solderability test, Lead Integrity and Lead Finish Adhesion • Lot Acceptance Test
EM and FM manufacturing flow Electrical tests and Burn-in will be done according to CETP specifications and requirements
EM and FM manufacturing flow CoC : Certificate of Compliance EIDP : End Item Data Package Module Lot Acceptance Test will be done on 1 Amplifier module and 1 regulator module