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Innovative 3D Chip Multiprocessor Design Flow using RF Reconfigurable Interconnects

Explore the 3D CMP Physical Design Flow leveraging RF technology for reconfigurable interconnects. This cutting-edge approach features three silicon layers, including cache data components in Tier 3 and advanced interconnects in Tier 2. Learn about the Design Driver3D Chip Multiprocessor, based on the OpenRISC 1200 architecture, and the key role of NoC Interconnect in enhancing performance. Delve into the detailed Design Flow for 3D IC Physical Design Flow 2, providing insights into the optimized design process. Stay informed about the latest advancements in 3DM2 development and the innovative strategies shaping the future of semiconductor design.

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Innovative 3D Chip Multiprocessor Design Flow using RF Reconfigurable Interconnects

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