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Previous week. Zinc deposition Thermal evaporation failed: Chamber wall and quartz crystal is coated But, no zinc coating on substrate (?) Zinc is deposited by RF sputtering: Cloudy gray film is appeared
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Previous week Zinc deposition Thermal evaporation failed: Chamber wall and quartz crystal is coated But, no zinc coating on substrate (?) Zinc is deposited by RF sputtering: Cloudy gray film is appeared (Rough and porous surface) Blue-gray appearance: incorporation of zinc oxide (Ref. Characterization of mixed zinc-oxidized zinc thin films deposited by a cold remote nitrogen plasma) Blue-gray color of sputtering target surface (Corroded by reactive sputtering?) → Target grinding is required
This week Phosphoric acid etching instead of grinding Zn target → Metallic color restored Deposition with cleaned target – failed to deposit better film Deposition at higher working pressure (30mTorr) → Metallic film color obtained Next week Failed experiment will be repeated Cell fabrication with properly deposited Zn electrode
Previous week (-) (+) Silicon wafer Ag/Al on Glass ZnOnanowire Al,Ag deposition on glass
Previous week Vertical growth during 2nd growth step Suspicion: (-) charges on (0001) plane at pH 10.9 (Optimum pH 10.5~10.9 by reference) prohibits surface passivation by citrate ions TPT filling ZnOnanowire growth PDMS cover TPT filling from side Removing PDMS
Previous week Nanowire aligning → More precursor concentation (higher nucleation density) → Higher growth temperature Ohmic contact →ZnO growth on Al, ITO Vertical growth during 2nd growth step →ZnO lateral growth at pH 10.5 TPT filling → Plasma etching → Lateral growth from revealed nanowire heads → Confirm by SEM
This week Nanorod growth with increased precursor concentration ITO substrate is used – Al film was dissolved Alignment was not improved
This week TPT overcoat – PDMS conformal contact failed Plasma etching failed to reveal nanorod heads 2nd growth step is also failed
Next week • - Replace Si counterelectrode with gold wire • Nanorod growth on AZO substrate • TPT injection with applied pressure to prevent overcoat • TPT Spin-coating and print instead injection • Repeat experiments that has failed in this week