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PROCESS IMPROVEMENT PROJECTS

PROCESS IMPROVEMENT PROJECTS. Wu – Lithography Kandala – Op Amp Design Chaubal – Particles Added in ASML Gangidi – Packaging - Resist Trimming Recipe on LAM 490 - CMP for STI and Multi-Layer Metal - Resist Trimming Recipe Using Lam 490 -CMP of Oxide for STI

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PROCESS IMPROVEMENT PROJECTS

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  1. PROCESS IMPROVEMENT PROJECTS Wu – Lithography Kandala – Op Amp Design Chaubal – Particles Added in ASML Gangidi – Packaging - Resist Trimming Recipe on LAM 490 - CMP for STI and Multi-Layer Metal - Resist Trimming Recipe Using Lam 490 -CMP of Oxide for STI -CMP of Oxide for Multilayer Metal -Evaluation of Nitride Deposition/Etch Uniformity -Thick Resist Process for Advanced CMOS P-Well Litho -Evaluation of Poly Deposition /Etch Uniformity -Digital Circuit Design -Better Resist Coating Lydia -Aluminum Deposition Rate and Uniformity PE4400 -BF2 Implant Incorporated in MESA for Sub-CMOS Process -Change First Oxide Steps in MESA for ADV-CMOS Process -Testing of 1st SUB-CMOS 150 Wafers from ASML Stepper

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