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R ecent developments on Monolithic Active Pixel Sensors (MAPS) for charged particle tracking.

R ecent developments on Monolithic Active Pixel Sensors (MAPS) for charged particle tracking. Michael Deveaux on behalf of IPHC Strasbourg, IKF Frankfurt/M. Outline The MAPS sensor (reminder) Radiation hardness How to speed up News on system integration A roadmap for MAPS for CBM

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R ecent developments on Monolithic Active Pixel Sensors (MAPS) for charged particle tracking.

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  1. Recent developments on Monolithic Active Pixel Sensors (MAPS) for charged particle tracking. Michael Deveaux on behalf of IPHC Strasbourg, IKF Frankfurt/M Outline The MAPS sensor (reminder) Radiation hardness How to speed up News on system integration A roadmap for MAPS for CBM Summary and conclusion M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  2. The operation principle of MAPS +3.3V Reset +3.3V Output SiO2 SiO2 SiO2 N++ N++ P+ N+ P- P+ M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  3. Non-ionising radiation Energy deposit into crystal lattice Tolerance against non-ionising radiation +3.3V Output +3.3V GND SiO2 SiO2 GND SiO2 SiO2 N+ P++ P++ N++ P++ Bulk damage M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  4. Tolerance against non-ionising radiation +3.3V Output +3.3V GND SiO2 SiO2 GND SiO2 SiO2 N+ P++ P++ N++ P++ M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  5. E Tolerance against non-ionising radiation +3.3V Output +3.3V GND SiO2 SiO2 GND SiO2 SiO2 N+ P++ P++ N++ P++ Electric field increases the radiation hardness of the sensor Draw back: Field cannot be applied due to high doping in CMOS-process M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  6. The “impossible” chip: MIMOSA-25 • MIMOSA-25 (XFAB 0.6µm PIN) • Lower doping in epitaxial layer • => Electric field can be applied • 13k Pixels • Pixel pitch: 20, 30, 40µm • Only 3 metal layers • => No onchip – CDS possible Irradiated with up to 3x1013 neq/cm² at the FRM – II Reactor Garching (Forschungsneutronenquelle Heinz-Maier-Leibnitz) Tests ongoing. M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  7. MIMOSA-25, first results Ru beta source Update: An XFAB 0.35 µm PIN process is expected early 2010 latest. The process is compatible with fast column parallel readout. First test chips will be submitted by as soon as the process is available. Very promising. Beam test is needed to conclude. Draw back: Process is NOT compatible with on-pixel CDS Noise: < 15 ENC M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  8. Chapter 2 How to speed up? M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  9. How to build fast MAPS for the MVD: IPHC Strasbourg On - chip zero suppression Discriminators Sensor array Bondingpads + output Amplis. Design goal: ~10 µs (~100 kFrame/s) Readout bus Pixel column SUZE-1 MIMOSA-16 and 22 M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  10. Status last year • MIMOSA-26 • Pixels + Ø-suppression • Expanded surface: • 1152 cols x 576 pixels • 21.2 x 10.6 mm² • 18.6 µm pixel pitch • ~ 100 µs time resolution • Data rate: 80 Mbits/s SUZE-1 Ø -suppression circuit MIMOSA-22 Sensor MIMOSA-26 M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  11. MIMOSA-26 Analog pixel outputs for tests 1152 discriminators 3 mm zero suppr. logic On-chip voltage generators JTAG slow control Output memories Suited for up to 9 hits/line => ~ 1% occupancy M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  12. MIMOSA-26 – Test2 Tests of the discriminators temporal noise: 0.02 mV Fixed pattern N: 0.11 mV Tests of pixels + discriminators temporal noise: 0.3 mV Fixed pattern N: 0.65 mV Corresponds to: 12-14 ENC As expected from MIMOSA-22 M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  13. Beam test results of Mi26 Test performed at the CERN-SPS Beam: 120 GeV/c pions MIMOSA-22 MIMOSA-26 • MIMOSA-26 shows slightly worse performances than MIMOSA-22 • Possible origin: • Weak point in discriminator (identified and easy to fix) • Preliminary analysis (not yet optimal) However: > 99.5% detection efficiency with 10-4 fake hit rate M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  14. Zero suppression Discriminators Sensor Bonding Pads Sensor Discriminators Zero suppression More speed 2 x faster Spatial resolution: < 5 x 5 µm² Time resolution: ~ 30 µs Spatial resolution: < 5 x 15 µm² Time resolution: < 10 µs Time resolution will get better with shorter columns Rectangular pixels foreseen in XFAB – 0.35 µm PIN submission M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  15. Special process Opto electronics readout Zero suppression Small, fast transistors Noise ! CDS + Discriminators Low noise transistors Radhard Sensors Low doping => Big transistors 3D-Integration On - chip zero suppression Discriminators Sensor array Bondingpads + output Amplis. Integrating everything on one chip is always a compromise How nice would it be: M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  16. 3D-Integration - 2 6µm chip + 7.5µm capton HgCdTe R. Yarema, FNAL, Ziptronix 0.25µm CMOS 0.18µm CMOS 99.98% good pixels M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  17. FAST R.O. architecture Subdivide sensitive area in ”small” matrices running INDIVIDUALLY in rolling shutter mode Adapt the number of raws to required frame r.o. time  few µs r.o. time may be reached (???) Digital Memory and Digital Readout LATCH_D DREAD Discriminator Tier-2 Tier-1 IRFU & IPHC 3D MAPS: RSBPix (C. Hu, IPHC) Status: Sensor submitted for production. Expect results end 2010 M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  18. MIMOSA roadmap for CBM (by Marc Winter) • MimoSIS-1: • 2D-chip for SIS100 (D mesons in pA collisions) • Established AMS 0.35µm process, potential XFab 0.35 µm PIN • 3 prototypes (2010,2011,2012) final prototyp by summer 2012 • tInt < 40 µs, rad. tol. ~ 3 x 1012 neq/cm², potentially >>1013 neq/cm² • MimoSIS-2: • 2D-chip for SIS300 (D meson in AA collisions) • Novel process with small feature size, stitching? • tInt < 30 µs, rad. tol. <1014neq/cm² • final prototyp by 2015 • MimoSIS-3 • 3D-chip for SIS300, phase 2 • tInt < 10 µs, rad. tol. ~1014neq/cm² • Development start by 2009 • final prototyp > 2015 if 3D technology works M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  19. Chapter 3 System integration M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  20. PLUME “ILC-Demonstrator” System integration At IKF => MVD – Demonstrator project (see following talks) For ILC: PLUME = Pixel Ladder with Ultra-low Material budgEt • Goals: • Build a very thin (~ 0.16 X0), double sided ladder for the ILC • Final ladder dimensions: ~ 1 x 12.5 cm² • Particular (additional) challenges: • - Mechanical stability despite power cycling in 4T magnetic field • - Alignment • Partners: Bristol University, DESY, IPHC, Oxford University Inoffical Partner: IKF Frankfurt IPHC – IKF common beam test: November @ CERN-SPS M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  21. System integration: Butted sensors Misalignment Dead zone • Why not? • Build sensors without intermediate • zones already on the wafer? • Cut full ladders out of the wafer? Technology is becoming available Evaluation of this option is will be done with modified MIMOSA-20 in 2010 Presumably common IKF-IPHC project M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  22. How to make things thinner: HP-2 Project - WP26 (ULISI) Partners: IPHC, IKF, IMEC M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  23. Diamond 300 µm How might it look like Equivalent material budget: ~ 60 µm Si ~ 200 µm Si ~ 60 µm Si ~ 320 µm Si => ~ 0.3% X0 Factor 5 thinner than conventional solution M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  24. Summary and Conclusion A first column parallel sensor with on-chip data sparsification (MIMOSA-26) was successfully tested. First 3D-integrated sensors were submitted for production The XFAB 0.35µm PIN process will allow for column parallel and very radiation hard chips. MAPS with <10µs readout time are possible (Combine high spatial resolution stations and fast time stamping stations) A development of ultra thin ladders with Chip-On-Polyamide has starting M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  25. Backup slides M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  26. MIMOSA-26 – Test3 Distribution of fake hits is not uniform along the discriminator steering blocks. Effect is understood, to be fixed in future chips. => Globally very good result M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  27. HP-2 Project: WP26 (ULISI) M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

  28. HP-2 Project: WP26 (ULISI) Common project of IPHC, IKF, IMEC M. Deveaux, 14th CBM Collaboration Meeting, 5 - 9 Oct. 2008 Split, Croatia

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