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APV25 hybrid for SVD2.5. 19 Jan 2005 (Rev. 26 Jan 2005) T. Tsuboyama (KEK). Design principle. Dimension should be same as that for SVD2 hybrid. 27.0 mm x 62.3 mm Similar or less cable size. Unfortunately,. APV25 chip size is much larger than VA1TA
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APV25 hybrid for SVD2.5 19 Jan 2005 (Rev. 26 Jan 2005) T. Tsuboyama (KEK)
Design principle • Dimension should be same as that for SVD2 hybrid. 27.0 mm x 62.3 mm • Similar or less cable size.
Unfortunately, • APV25 chip size is much larger than VA1TA • “The size of the APV25-S1 chip (not including scribe channels) is 8055 x 7100 square microns.” • Pad pitch 44 um • VA1TA 9280x6120 um. • Pad pitch 45.6 um. • Power supply and ground pads are mixed in input pads.
Consequence • Hybrid width should be somewhat larger. • Can this be compatible with SVD2 design? 30.0 27.0 6.4 62.3
Power consumption (catalog) • APV manual: • Nominal 2.3 mW/ch or 0.29W/chip • VA1TA catalog: • 0.144 W/chip (from the table below) • In reality 4mW/ch or 0.5W/chip
26 Jan 2005 ladder design (I) • Close look at the L1 ladder and support • The hybrid width is wider by 3 mm on both side. • They looks like to fit the structure. However….
26 Jan 2005 ladder design (II) • L1 hybrid and L2 DSSD can interfere at one edge. • 1.5 mm excess on each edge is still very tight. • Hybrid / ladder has to be asymmetric to avoid the touch.
Summary • APV2.5 chip is wider than VA1TA and hybrid width should be larger by 3 mm. • If hybrid is symmetrically widened, L1 hybrids and L2 DSSD will interfere. • New L1 ladder will be asymmetric. • We do not know the real heat dissipation of the hybrid. Catalog value may be too small.