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PHENIX FVTX Status of Mechanical and Thermal Design Work

PHENIX FVTX Status of Mechanical and Thermal Design Work. Eric Ponslet, Shahriar Setoodeh, Roger Smith HYTEC Inc. Los Alamos, NM May 2, 2007. Final Design Package. Final Report and Drawing Package Documents the Preliminary Design of FVTX structures and cooling system

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PHENIX FVTX Status of Mechanical and Thermal Design Work

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  1. PHENIX FVTXStatus of Mechanical and Thermal Design Work Eric Ponslet, Shahriar Setoodeh, Roger Smith HYTEC Inc. Los Alamos, NM May 2, 2007

  2. Final Design Package • Final Report and Drawing Package • Documents the Preliminary Design of FVTX structures and cooling system • delivered to LANL on 04/24/07 • Available on Twiki at http://pvd.chm.bnl.gov/twiki/bin/view/VTX/FVTXDesignReports Drawings: 111-PHX-01-3000 to -3012 Report: HTN-111006-0003

  3. Latest Baseline Design • Change since last status presentation (UNM, March 12, 2007) • Modules staggered in Z to provide sufficient space on HDI for FPHX chips, wire bonding pads, and decoupling capacitors • Modular Design • Sensor module (“wedge”)  Half Station  Half Cage  FVTX • Wedge built on a Graphite Fiber/Cyanate Ester Thermal Backplane • Serves as structural support and heat transfer path to edge cooling • 0.76mm thick K13CU/CyE • Very high thermal conductivity fiber • Wedges are Fastened to Support Panel • Two alignment pins (ceramic/glass?) and 3 screws (nylon) per wedge • RT-cured silicone bridge provides thermal interface to cooled support panel • Allows replacement of single defective wedge • BUT: requires cutting the Silicone thermal bridge • Half-Disk Support Panel and Support Cage • Sandwich construction: Graphite fiber (M55J) faces and aluminum honeycomb • Liquid Cooling • Tube embedded in support panel in place of core, near OD of half disk • Single phase coolant at high flow rate (turbulent)

  4. Sensor Module • Two variations: upstream and downstream • HDI tail folded forward or backward Backplane HDI Connectors for extension cables Sensor HDI Screw (nylon) Pin hole (for alignment) Detector FPHX chips FPHX Chips Backplane (0.76mm graphite fiber composite) Screw (nylon) Pin hole (for alignment) (All bonds use rigid epoxies) Rigid, thermally conductive epoxy Rigid epoxy

  5. Half-Station Sub-Assembly Not enough space if modules side by side Support Tab FPHX chip Sensor HDI High-mounted module Pin Low-mounted module Screw Support Tab Support Panel Conductive silicone bond (for heat transfer) Support Tab

  6. Cooling and Support Tab Detail Silicon detectors, HDIs, and back-planes made transparent for clarity Hose barb for coolant (back side) Screw hole (mounting to cage) Pin (alignment to cage) Screw (holds wedge on disk) Built-in cooling tube CC (TBC) heat transfer bridge Pin (aligns wedge on disk) Silicone heat transfer interface (RT-cured, conductive silicone) FPHX chip Sensor

  7. Support Panel Construction Locating pin Insert for pin (TBD plastic) GFRP Face sheet (0.25mm) Standoff plate (TBD Plastic) Insert for screw (TBD plastic) Cooling tube Hose barb Foam core (TBD mat’l) Core insert for pins and screws (TBD plastic) Honeycomb core (4.76mm, 32 kg/m3) GFRP Face sheet (0.25mm) Mounting tab

  8. Half Cage Sub-Assembly Cooling hose (silicone) Y Z Station 2 Station 1 Station 3 Station 4

  9. FVTX–VTX Interference / Space Allocation VTX Strip Layer (#4) VTX Strip Layer (#3) VTX Pixel Layer (#2) VTX Pixel Layer (#1) Interference! (Wrap FVTX cage behind station 1 Reduce radius of station 1 Possibly move VTX4 out 1cm) FVTX Station 4 FVTX Station 1 FVTX Station 2 FVTX Station 3

  10. Radiation Length Status (1/2) • Total RL of Station 2, 3, or 4 (normal incidence) • Area averaged to active area (45mm IR, 170mm OR) = 2.41%

  11. Radiation Length Status (2/2) • Local RL of Station 2, 3, or 4 (normal incidence) • Local extremes range from 1.8% to 9.1% 4.4 1.8 2.2 4.8 1.8 5.4 2.2 2.3 3.9 3.9 7.3 5.0 Local values of %RL at normal incidence 4.4 6.6 6.6 9.1

  12. Cooling System • Keep FVTX near Room Temperature • Gas enclosure also at room temperature • Power Dissipation • 8W per half disk (stations #2, 3, 4) • Cooling Tube Embedded in 3/16” Support Panel • Square cross section (3/16” by 3/16”) with super-thin (<50μm) nickel wall • Vendor currently under contract for trial fabrication of tube (~ 4 weeks) • Coolant • 3M Novec HFE-7000 • Completely harmless to (even live) micro-electronics • Environmentally friendly • Dense (1.4 × water) • Flow Regime • Single phase • Strongly turbulent • Re ~ 10,000 • Flow velocity ~ 0.7 m/sec • Flow rate ~ 20 g/sec = 14 gallons/hour (per ½ cage) • Flow-induced vibrations? • Need testing

  13. Wedge Analysis • Warmest FPHX is 4.3ºC Warmer than Back Edge of Backplane • 9.3ºC warmer than coolant • Thermal stresses are very low • Rigid adhesives are fine Min Tº = 15ºC (Boundary condition at back side of backplane) Deflection (m) Temperature (°C) Max deflection 8.1μm Max Tº = 19.3ºC Warmest FPHX Cooling-induced Distortions (assembled at room temperature) Temperature Contour

  14. Coolant to ROC Thermal Path • Use Simple Correlations to Evaluate • Pressure drops • Temperature drop from fluid to cooling tube Approximate temperatures with 10°C coolant flowing at Re~10,000 (0.76mm K13CU backplane, 50μm Nickel tube, 0.2 W/mK epoxy, 0.75 W/mK silicone)

  15. Liquid Cooling Circuit • Run 4 Half-disks in Series

  16. Station- and Cage-Level Modeling Max deflection within active area ~ 8μm Max deflection ~ 21μm 138Hz Distortion due to Cooling (assembled at room temperature) Fundamental Vibration Mode

  17. Conclusions • We have a fairly detailed preliminary design • But not a final design; detailing and some material selections pending • Meets key requirements • Dimensional stability • Stiffness • RL • Some remaining questions and issues • See next slides • More work needed before fabrication phase • See next slides for details • Evolve design (following VTX and system-level evolution) • Resolve pending design issues • Prototype & Test • Our FVTX design contract is now closed • No FVTX funding at this time • Funding request in place with BNL for R&D funding • Cover minimal manpower level & prototypes through end of CY • What are our chances of getting funded? When?

  18. Remaining Technical Issues • Flow-induced vibrations: • Must insure that vibration level from turbulent flow is low • Requires testing • Support and cooling of sensor modules at edges of stations • Sensor modules at separation plane (6 and 12 o’clock) are insufficiently cooled and could use better mechanical support • HDI tails tool long for Station 4 • Little space available downstream of station 4, within space allocation • Requires tight bend radius • Connectors/backing plate are in the way • VTX/FVTX Interference • Solutions have been identified • Will be implemented as soon as funding is available

  19. Future Work: Before Construction Phase • Short-term (before construction phase) • System Design (shared with / largely funded by VTX) • Gas enclosure • “Big wheel” • Routing and support of utilities • Initial alignment / surveying approach • Other • Effect of radiation on coolant (exposure tests) • Effect of coolant on materials (exposure tests) • Continue evolving FVTX design • Prototyping • See next slide • Construction phase • Grounding • Final material selections • Detailed design and fabrication drawings

  20. Prototyping • Main focus of R&D funding request • Sensor module prototypes • GFRP backplanes + dummy HDI + dummy sensor + resistive heaters • Used to • Test assembly tooling • Thermal cycling (stresses in bonds and SSD) • Heat transfer testing • Validate temperature induced deflections (TV Holography?) – insufficient funding • Half-Station prototype • One half disk (large) • Supported by dummy structure (no cage) • Populated with dummy detector modules • Used to • Test manufacturing, assembly, and alignment concepts • Measure flow induced vibration • Heat transfer tests • Half-cage prototype • Experiment with manufacturing approach • Double-duty as iFVTX support cage

  21. Program Management Transition • Eric Ponslet is leaving HYTEC • Effective May 17 • Personal reasons: going climbing… • RJ Ponchione taking over PM role for PHENIX activities at HYTEC • Outstanding design engineer & quick learner • Rest of team remains unchanged: • Shahriar Setoodeh: analytical design and simulation • Vince Stephens: composite material expertise, PM assistance • Roger Smith: CAD modeling and packaging • Transition phase in progress • Immediate priority is VTX (stave prototypes) • iFVTX work continues as required • No FVTX funding at this point

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