Particles and Fields Package Monthly Status Review (MSR) March 15, 2011

1. Particles and Fields Package Monthly Status Review (MSR) March 15, 2011 Dave Curtis, PFP PM

2. SSL Contracting Status Provided estimated cost (in Phase E) for 5 week transition timeline

3. Schedule Status EMs have made a lot of progress this month All EM PWBs in test but ~2 (HVPS boards, in fab) SEP, LPW, SWEA. MAG mechanical in assembly STATIC TDC complete acoustics SWIA/STATIC analyzers final parts out to fab this month EM Package I&T starts March 22 with LPW Pushing to complete before CDR Instrument calibrations don’t complete till after Package I&T Adjusted flight electronics test schedule to reflect reality of limited pool of test engineers Prioritized testing No change to critical path this month 15 weeks margin to delivery Achieved by starting flight fab prior to EM test completion for selected subsystems Working to improve post-CDR schedule. Adjust schedule to take advantage of changes to flight software Build 1 design includes less diagnostic code, more code that is useable for Build 2 should get FSW off critical path, improve margin +2-3 weeks.

4. Manpower • RBSP-EFW instrument still not delivered – this month? • All of the people we need have transitioned 100% • Down to final thermal vac test • Solar Probe Plus is starting to impact a few team members • Adding two new people around the time of CDR to make up for one retirement and people split with SPP • One from RBSP, one from JDEM • We are still under planned FTE rate • but climbing a bit • Mostly due to people splitting time between projects • Plan was based on conservative assumptions about covering people

5. Accomplishments All PWBs layed out, most loaded and in test see below On schedule for start of Package integration LPW/PFDPU 3/22 PFDPU/Spacecraft 4/5 Most EM Mechanical parts are in fab, many delivered MAG sensor Assembled SEP, LPW boom, STATIC TDC, SWIA & STATIC MCP mounts in assembly Some part-level design work still in progress on SWIA/STATIC Last analyzer parts out for fab this month STATIC EM TOF Acoustics Test complete successfully SEP EM attenuator started life test SWEA FM analyzer mechanical parts delivered to SSL for plating Forwarded to the plating house More in instrument sections…

6. Ongoing Work Supporting Project planning process Supporting EMC, Payload, SDT working groups Completing EM board testing Completing SWIA/STATIC EM mechanical part drawings, getting parts fabricated Start PF Package EM I&T, LM EM I&T Prepare for CDR

7. EM Status

8. PFP RFA Status All Done!

9. Trades, Issues HV801 issue still open Two options: Amptek HV801, Micropac 66353 Amptek delivered some EM HV801s Have parts for EM Current plan is to buy HV801s from LADEE NMS, who has parts on order they no longer need Also have an offer of some extra parts from LASP Working on an analysis to decide if the PFDPU mechanical design needs to be augmented to support the PWBs to avoid excessive displacements in vibe MAG EM PWB has option for a center support, others do not Looks like we can probably eliminate center support, analysis about ready for review Analysis Submitted to GSFC Comparing analysis technique to recent flight history.

10. Thermal Status Updated Thermal Model delivered being used by LM to generate thermal environments, due ~3/18 Provided boom deployment heater power requirement last of the heater requirements Also waiting on deep dip case Also promised by 3/18

11. Top Risks P-21 new

12. Risks List

13. PFP Mass Small change to MAG sensor and EUV harness CBE this month Submitted CCR262 to reallocate NTE amongst PFP See ‘New NTE column)

14. Mass Tracking Chart

15. PFP Power Small increase in EUV heater power Small decrease in LPW operational power.

16. PFP Power Trend

17. PFP Data Rate Per 2009-6-9 allocations from Bruce

18. Requirements Verification Status Submitted a CCR (265) to update PFP Functional Requirements (Level 3) some old requirements need updating Once updated, will start mapping into Verification matrix Need DOORS verification output for ICD and ERD to include in the matrix ERD and ICD still evolving When do we snapshot these? Boot software verification has started against software level 5 requirements, which link back to FRD and ICD. STATIC TOF EM Acoustics test complete Waiting on analysis of foils Will repeat on full EM and FM

19. MAVEN Magnetometer Status March 2011 Connerney, Sheppard, Schnurr, Oliversen, Espley, etc.

20. GSFC/MAG - Accomplishments Last Month EM sensor assembly and pigtail completed. GSE sensor harness fabrication complete. Hypertronics connectors received; breakout PWBs assembled. Draft MAG Flight Software Requirements Specification (for PFDPU). Completed parts stress analysis for MAD board and ACHE board ( MIS MAVEN-MAG-ANYS-0020, MAVEN-MAG-ANYS-0018) EM magnetometer analog/digital (MAD) board assembly completed. EM Magnetometer board tuned w/nominal scale factors and in test. Completed Parts Control Board meeting (March 2, 2011), parts list dispositioned (XX parts of XXX total) pending meeting minutes. Initiated radiation testing plans for lot of MIL spec CD4066 quad bilateral switches. Completed rev 0 Aeroflex FPGA design; ready to burn.

21. GSFC/MAG - Accomplishments Last Month(s) MAG Analog and Digital (MAD) Board A/C Heater Electronics (ACHE) Board EM Sensor Assembly

22. GSFC/MAG Near Term Plans & Open Issues Complete MAG software requirements draft and iterate w/UCB. Bench test EM MAD board with FPGA logic installed, UCB simulator. Initial MAG Test Site tests to determine MAD board scale factor resistors. Temperature cycle MAD board and thermal stability tests. Continue winding FM sensor ring cores, feedback/sense bobbins, per technician availability; fabricate sensor assembly terminal boards. Draft worst case analysis of MAD board. Schedule Peer Review (tentative: May 5, 2011 @ GSFC). Workload: RBSP box level thermal vac @ APL, Juno system thermal vac @ LM

23. MAVEN PFP SWIA Status March 2011 Jasper Halekas, SWIA Lead

24. SWIA Progress • Electrical Progress • Anode board tested • Digital board tested • Preamp/MCP loaded on preamp half • Testing started, testing with digital next week • LVPS mostly loaded, starting test • Sweep PWB fabricated, being loaded • Sweep and MCP HV waiting for shield walls, cores • Mechanical Progress • E-Box parts out for fabrication • Analyzer design finished, parts drawings in progress, final review before sending out for fabrication next week • Attenuator motor design nearing completion • MCP MGSE and MCP clamp stack fabricated and assembled • Manipulator MGSE fixture design in progress (for EM Cal) • Detector Progress • MCP testing starting as soon as Hypertronics connectors arrive (scheduled March 14th ship, overnight delivery)

25. SWIA Issues • Staffing/Schedule • Up to full speed on staffing • Trying to make up delays due to RBSP ME conflict and limited technician time • Currently planning to integrate and test electronics with PFDPU before testing with analyzer to mitigate schedule delay

26. SWIA Hardware Anode board w/ MCP Clamp Stack (channel plate not loaded, 5” diameter) MCP Test MGSE Fixture

27. MAVEN PFP SWEA Status March 2011 Dave Mitchell, SWEA Lead

28. SWEA Status, EM - CESR • Mechanical (FM) • All mechanical parts fabricated and controlled • Hemispheres and top cap sent to Switzerland for Cu2S coating • All sensor external parts at SSL for black nickel coating • Electrical (EM) • Board assembly started – completion by mid-April SWEA EM disassembled to change STEREO parts for MAVEN parts Amplifier board

29. SWEA Status, EM - SSL • Mechanical • Pedestal fabrication and test fitting complete, ready to assemble when boards available. • Rest of SSL EM refurbished and tested. • Purge port to be clocked 25o on FM (no impact to EM or to CESR design) • LVPC • Fab complete, Tested. • Digital • Fab complete, Tested. • SSL EM Ready to assemble Purge Port Redesign Old Position New Position SWEA Digital

30. MAVEN PFP STATIC Status March 2011 Jim McFadden, STATIC Lead

31. STATIC Accomplishments Carbon foils mounted in TOF units survive acoustic test Carbon foils floated successfully from mica slides - improves yield Implemented automated software for analysis of carbon foil defects Completed design for carbon mounting fixtures – design prevents small bits of carbon foil from attaching to the bottom of frame during mounting EM Digital board FPGA program loaded – ready for digital board test EM TDC board loaded (see photo) EM preamp simulated with Spice to determine component value changes needed to reduce gain. EM Anode, Preamp and TDC boards in test EM LVPS loaded – ready for test Mechanical electronics box fabricated/assembled (see photos) 3 TOF units assembled (see photos) and acoustic tests performed Clean-room (320) in service – used during TOF analyzer assembly Helmholtz coil material purchased for fabrication template 3-axis manipulator for calibration being tested and tuned

32. STATIC EM TDC

33. STATIC TOF Assembly for Acoustics

34. STATIC Anode Assembly for Acoustics

35. STATIC EM Assembly for Acoustics

36. STATIC Open Issues Carbon foil frames need to be remounted in TOF units for vibration test. Mounting fixtures for handling flight carbon foil frames need to be fabricated before additional EM carbon foils are loaded Preamp part changes needed to reduce the gain for optimal dynamic range EM HV Sweep partially loaded – waiting on shield boards (in fab) EM 15kV-MCP board partly loaded - waiting on MCP “stack stick” multiplier to return from paryline coating Waiting on second EM preamp with component changes to optimize gain (improve dynamic range) Analyzer and mechanical attenuator still in development Manipulator fixtures for calibration in development Some test harnesses and test cables still on order New calibration chamber ordered – delivery late May Additional equipment for clean-room 320 ordered (cabinets, tables, etc) Clean-room portable sink in development

37. MAVEN PFP SEP Status March, 2011 Davin Larson, SEP Lead

38. SEP Accomplishments2011-03-09 Mechanical attenuator tests started. First testing using GSE (MISG) – GSE working – but has occasional dropouts (see below). Initial assembly had micro-switch mis-aligned which resulted in failure on first overnight test because attenuator got caught in a position with both switches open. Micro-switches re-aligned, ready for retest. Resolved questions about plunger force. Performed 24 hour (1000 cycle) test in air. Successfully completed 972/1000 cycles. Failure determined due to loss of TCP/IP connection of MISG – not due to ETU. Actuator duration vs voltage test in air performed. First life cycle test in vacuum was incomplete due to MISG disconnects. (~2000 cycles were completed) Second life cycle test started on 03/09 ETU Silicon detectors are diced and tested. However delivery is overdue (Craig Tindall has been sick). Flight detectors are a few weeks away. DAP board Stuffed with parts (2 channels only) All parts now installed. Actel programing delivered, burned and inserted. Testing underway: Discovered that test pulsers is NOT operating properly due to change from 5V actel to 3.5V actel. Minor x2 error in pulser frequency discrepancy in FPGA (could just change the documentation) All Mechanical parts have arrived. (Baffles finally arrived) DFE light tight Test box/cable in assembly (rework actually)

39. SEP EM Attenuator Testing

40. SEP Open issues Detectors still needed Test pulser circuitry needs modification One channel DAC threshold level not working properly – still under investigation

41. MAVEN PFP DCB, Power Converter & GSE Status March 2011 Dorothy Gordon Timothy Quinn Peter Berg Chris Tiu

42. DCB Status (1) DCB ETU Testing FLASH Memory Verified Both CPU Mode and DMA Mode tested Bad Blocks for both DCB-ETU #1 FLASH devices logged Test Environment Refined Simulation and Realtime testing software project consolidated Shared source code environment used by ModelSim (FPGA Simulator) and DCB-Monitor (DCBMON) (used for bench-testing and system diagnostics) Subsystem tests have been integrated into DCBMON DCB ETU integrated with the MISG in Instrument Simulator mode Instrument commands verified for all 7 interfaces Next step: Instrument message data reception verification

43. DCB Status (2) DCB ETU Build Parts kitted for the second DCB ETU and associated FLASH Daughter board Boards are currently being loaded at Digicom DCB FPGA Design of the major FPGA subsystems is completed Started timing analysis in preparation for Flight FPGA port Simulation continues in conjunction with target diagnostic development and verification.

44. DCB Test Setups DCB running DCB-MON Serial port based communication provides bench test environment DCB running GSEOS & FSW Boot Code (MISG appears next to GSEOS laptop)

45. GSE Software Status Delivered first rev of SEP GSEOS Delivered first rev of SWEA GSEOS Added CCSDS wrapper to SEP, SWEA, SWIA messages Provides timestamping capability for the MISG Message Data Next step: STATIC wrapper development Provided support for Instrument and Actuator GSEOS

46. Power Converter Status (1) REG board Currently under test The 28 V, the 3.3V, the 1.5V, the 5.0V, the  ±5V are working and synchronized The input start-up starts up and the board runs itself after start up In preparation for the upcoming LPW Interface test The following subsystems need to be verified LPW current monitor Housekeeping addressing LPW ON commanding

47. Power Converter Status (2) REG ETU under test

48. Power Converter Status (3) IIB board IIB ETU has been assembled and all magnetics wound Board is in test, starting with the LPW sections first • Secondary side of LPW converters powered-on but will require some transformer turns adjustments to tune output voltages

49. Concerns S/C Interface late changes DCB FPGA modifications required to coordinate with S/C ICD anticipated changes and clarifications Schedule is tight Much testing/analysis remains as we approach CDR

50. MAVEN PFP Flight Software Status March 1 2011 Peter Harvey