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Diamond Pixel Detector Developments in Bonn

Diamond Pixel Detector Developments in Bonn. Markus Mathes University Bonn. N.Wermes, F. Hügging, J. Große-Knetter, J. Fink, M. Keil, T. Lari. Diamond Pixels / Bonn. 2001/2002: UTS5 and CD91 single chip modules First diamond pixel assemblies Characterized in testbeam Poor bumping yield

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Diamond Pixel Detector Developments in Bonn

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  1. Diamond Pixel Detector Developments in Bonn Markus Mathes University Bonn N.Wermes, F. Hügging, J. Große-Knetter, J. Fink, M. Keil, T. Lari RD42 Collaboration Meeting

  2. Diamond Pixels / Bonn • 2001/2002: UTS5 and CD91 single chip modules • First diamond pixel assemblies • Characterized in testbeam • Poor bumping yield • Not rad hard FrontEnd electronics chips • 2004: CD109, new bumped UTS5 • Bumping improved • Fully bumped pixel single chips (2880 pixels) with radiation hard chip • Working in the lab • Ready for testbeam this spring/summer • Module practice piece to develop bumping of a large CVD module  in processing at Fraunhofer IZM now • Full ATLAS type module with 16 FE chips, 46000 pixels planned for summer 2004. Testbeam planned for 8/2004 (schedule tight) • Are ready for assembly of a single crystal diamond with an ATLAS-FE chip • Charge collection measurements (TCT – setup) with single channel Si, CdTe (and diamonds) presently carried out. RD42 Collaboration Meeting

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